公开(公告)号：US20250069771A1

公开(公告)日：2025-02-27

申请号：US18947735

申请日：2024-11-14

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Tsukasa YASOSHIMA ,  Kataro Masuyama ,  Kohei Otogawa ,  Takuma Katase

IPC: H01B1/22 ,  B22F1/052 ,  B22F1/054 ,  B22F1/107 ,  C09J1/00 ,  C09J9/02 ,  C09J11/06 ,  C09J11/08

Abstract: This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

公开(公告)号：US12179266B2

公开(公告)日：2024-12-31

申请号：US17319554

申请日：2021-05-13

Applicant: VIRGINIA COMMONWEALTH UNIVERSITY

Inventor： Hong Zhao ,  Radhika Barua ,  Ravi L. Hadimani ,  Lilly Balderson

IPC: B33Y70/00 ,  B22F1/105 ,  B22F1/107 ,  B22F5/10 ,  B22F10/22 ,  B22F10/50 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  H01F1/01 ,  B22F3/10

Abstract: A polymer-assisted 3D printing method and ink compositions are used to manufacture magnetocaloric devices having many applications including in heat pumps, refrigerators, etc. The ink compositions and printing methods can produce compositionally graded, anisotropically aligned magnetocaloric architectures with designed pores and channels, to bring forth significant improvement in heat exchange efficiency.

公开(公告)号：US20240413117A1

公开(公告)日：2024-12-12

申请号：US18806922

申请日：2024-08-16

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US12030125B2

公开(公告)日：2024-07-09

申请号：US17434492

申请日：2020-03-02

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Kei Anai ,  Shinichi Yamauchi ,  Jung-Lae Jo ,  Takahiko Sakaue

IPC: B22F7/06 ,  B22F1/00 ,  B22F1/107 ,  H01L23/00

CPC classification number: B22F7/064 ,  B22F1/00 ,  B22F1/107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29147 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8384

Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.

公开(公告)号：US20240212930A1

公开(公告)日：2024-06-27

申请号：US18598301

申请日：2024-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi OHARA ,  Hideyasu ONISHI

IPC: H01G4/008 ,  B22F1/103 ,  B22F1/107 ,  B22F1/12 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/008 ,  B22F1/103 ,  B22F1/107 ,  B22F1/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  B22F2301/15 ,  B22F2302/25

Abstract: A conductive paste defining inner electrodes of a multilayer ceramic capacitor manufactured through a firing step, includes a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder. At least a portion of the ceramic powder is a powder of at least one oxide of ABO3 type with a specified ionic radius in which a ratio of a six-coordinate ionic radius of an A-site element in ABO3 to a six-coordinate ionic radius of a metal element in the conductive metal powder is about 0.97 or greater and about 1.04 or less. Preferably, when the conductive metal powder includes nickel, the at least one oxide of ABO3 type with the specified ionic radius is at least one of NiTiO3, MgTiO3, or MnTiO3.

公开(公告)号：US20240149340A1

公开(公告)日：2024-05-09

申请号：US18279012

申请日：2022-03-28

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Shinichi YAMAUCHI ,  Kei ANAI

IPC: B22F7/06 ,  B22F1/052 ,  B22F1/054 ,  B22F1/068 ,  B22F1/107 ,  B22F3/14 ,  B22F7/08 ,  B32B7/12 ,  B32B9/04 ,  B32B15/20 ,  H01L23/00

CPC classification number: B22F7/064 ,  B22F1/052 ,  B22F1/056 ,  B22F1/068 ,  B22F1/107 ,  B22F3/14 ,  B22F7/08 ,  B32B7/12 ,  B32B9/041 ,  B32B15/20 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  B22F2201/02 ,  B22F2301/10 ,  B22F2304/056 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/748 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/29147 ,  H01L2224/32221 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/8384

Abstract: A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.

公开(公告)号：US11905427B2

公开(公告)日：2024-02-20

申请号：US17347813

申请日：2021-06-15

Applicant: XEROX CORPORATION

Inventor： Guiqin Song ,  Sarah J. Vella ,  Barkev Keoshkerian

IPC: C09D11/52 ,  B22F9/24 ,  C09D11/38 ,  B22F1/054 ,  B22F1/107 ,  B82Y40/00 ,  B82Y30/00 ,  B22F1/068

CPC classification number: C09D11/52 ,  B22F1/054 ,  B22F1/056 ,  B22F1/107 ,  B22F9/24 ,  C09D11/38 ,  B22F1/068 ,  B22F2301/30 ,  B22F2303/01 ,  B22F2303/05 ,  B22F2304/054 ,  B22F2304/056 ,  B82Y30/00 ,  B82Y40/00 ,  B22F2999/00 ,  B22F1/107 ,  C22C1/0466 ,  C22C1/0483 ,  B22F1/054 ,  B22F1/056

Abstract: Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

公开(公告)号：US20240029916A1

公开(公告)日：2024-01-25

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0245 ,  H05K2201/0133 ,  H05K1/189

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11877900B2

公开(公告)日：2024-01-23

申请号：US18082053

申请日：2022-12-15

Applicant: Ossiform ApS

Inventor： Morten Østergaard Andersen ,  Martin Bonde Jensen ,  Casper Slots

IPC: B29C64/10 ,  B29C64/106 ,  A61C13/00 ,  C04B35/563 ,  C04B28/00 ,  C04B35/468 ,  C04B35/583 ,  C04B35/01 ,  C04B28/04 ,  C04B35/505 ,  C04B35/632 ,  C04B35/495 ,  C04B35/16 ,  C04B35/58 ,  C04B35/50 ,  C04B35/457 ,  C04B28/34 ,  C04B35/56 ,  C04B35/111 ,  C04B35/515 ,  C04B35/486 ,  C04B35/636 ,  C04B33/04 ,  C04B35/447 ,  C04B35/565 ,  C04B35/453 ,  C04B35/46 ,  C04B35/49 ,  C04B35/634 ,  C04B35/08 ,  C04B35/14 ,  C04B35/553 ,  B29C64/165 ,  B29C64/188 ,  B29C64/112 ,  B29C64/124 ,  B29C64/118 ,  B22F1/107 ,  B33Y70/10 ,  B33Y40/20 ,  B22F10/20 ,  B28B1/00 ,  C09D11/033 ,  C09D11/037 ,  C09D11/32 ,  C09D11/36 ,  C09D11/38 ,  C09D11/52 ,  C04B111/00 ,  B29C64/153 ,  B29L31/00 ,  B22F10/18 ,  B22F10/64 ,  B22F10/60 ,  B29K105/00 ,  B22F10/16 ,  B22F10/12 ,  B22F10/14 ,  B22F10/28 ,  B22F10/10 ,  B33Y10/00

CPC classification number: A61C13/0013 ,  A61C13/00 ,  B22F1/107 ,  B22F10/20 ,  B28B1/001 ,  B29C64/112 ,  B29C64/118 ,  B29C64/124 ,  B29C64/165 ,  B29C64/188 ,  B33Y40/20 ,  B33Y70/10 ,  C04B28/006 ,  C04B28/04 ,  C04B28/34 ,  C04B33/04 ,  C04B35/01 ,  C04B35/08 ,  C04B35/111 ,  C04B35/14 ,  C04B35/16 ,  C04B35/447 ,  C04B35/453 ,  C04B35/457 ,  C04B35/46 ,  C04B35/4682 ,  C04B35/486 ,  C04B35/49 ,  C04B35/495 ,  C04B35/50 ,  C04B35/505 ,  C04B35/5152 ,  C04B35/553 ,  C04B35/563 ,  C04B35/565 ,  C04B35/5626 ,  C04B35/583 ,  C04B35/5805 ,  C04B35/58007 ,  C04B35/58014 ,  C04B35/58028 ,  C04B35/58085 ,  C04B35/58092 ,  C04B35/632 ,  C04B35/634 ,  C04B35/636 ,  C09D11/033 ,  C09D11/037 ,  C09D11/32 ,  C09D11/36 ,  C09D11/38 ,  C09D11/52 ,  B22F10/10 ,  B22F10/12 ,  B22F10/14 ,  B22F10/16 ,  B22F10/18 ,  B22F10/28 ,  B22F10/60 ,  B22F10/64 ,  B29C64/106 ,  B29C64/153 ,  B29K2105/0064 ,  B29L2031/753 ,  B29L2031/7532 ,  B29L2031/7534 ,  B29L2031/7536 ,  B33Y10/00 ,  C04B2111/00129 ,  C04B2111/00181 ,  C04B2235/6021 ,  C04B2235/6026 ,  C04B2235/658 ,  C04B2235/95 ,  Y02P10/25 ,  Y02P40/10 ,  C04B28/006 ,  C04B24/085 ,  C04B28/34 ,  C04B22/064 ,  C04B24/085 ,  C04B28/04 ,  C04B24/085

Abstract: The present invention relates to a suspension comprising 50-95% by weight of the total suspension (w/w) of at least one metallic material and/or ceramic material and/or polymeric material and/or solid carbon containing material; and at least 5% by weight of the total suspension of one or more fatty acids or derivatives thereof. In addition, the invention relates to uses of such suspension in 3D printing processes.

公开(公告)号：US20230373004A1

公开(公告)日：2023-11-23

申请号：US18029084

申请日：2020-10-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： JOHN SAMUEL DILIP JANGAM ,  THOMAS CRAIG ANTHONY ,  LIHUA ZHAO

IPC: B22F10/16 ,  B33Y70/10 ,  B22F1/105 ,  B22F1/107 ,  B22F10/64 ,  B33Y40/20 ,  B33Y10/00

CPC classification number: B22F10/16 ,  B33Y70/10 ,  B22F1/105 ,  B22F1/107 ,  B22F10/64 ,  B33Y40/20 ,  B33Y10/00 ,  B22F2302/30 ,  B22F2301/10 ,  B22F2998/10 ,  B22F2304/10

Abstract: The present disclosure is drawn to a three-dimensional printing kit and can include a particulate build material including from about 80 wt % to about 100 wt % metal particles, and a binding agent including water, from about 0.01 wt % to about 5 wt % organic compounds, and from about 20 wt % to about 60 wt % copper nitrate.