公开(公告)号：US12129891B2

公开(公告)日：2024-10-29

申请号：US17244308

申请日：2021-04-29

申请人： NTN CORPORATION

发明人： Tomonori Yamashita ,  Yoshinori Ito ,  Daisuke Takeda ,  Yuta Ohashi

IPC分类号： B22F5/00 ,  C22C33/02 ,  C22C38/00 ,  C22C38/16 ,  F16C33/10 ,  F16C33/12 ,  F16C33/14

CPC分类号： F16C33/121 ,  B22F5/00 ,  C22C33/0278 ,  C22C38/00 ,  C22C38/008 ,  C22C38/16 ,  F16C33/10 ,  F16C33/104 ,  F16C33/128 ,  F16C33/14 ,  F16C33/145 ,  B22F2998/10 ,  F16C2204/10 ,  F16C2204/60 ,  F16C2240/48 ,  Y10T428/12014 ,  B22F2998/10 ,  B22F1/09 ,  B22F3/02 ,  B22F3/10

摘要： Provided is a sintered bearing formed mainly of an iron structure (33) and a copper structure (31) which are formed of a partially diffusion-alloyed powder (11) of an iron powder (12) and a copper powder (13). The sintered bearing includes a copper structure (31d) formed of a granular elemental copper powder (13′) having a grain diameter of 45 μm or less, the ratio of the copper structure (31d) being 10 mass % or less. With this, a further increase in strength of the sintered bearing can be realized.

公开(公告)号：US12128482B2

公开(公告)日：2024-10-29

申请号：US16972162

申请日：2019-03-27

申请人： SUMITOMO ELECTRIC HARDMETAL CORP.

发明人： Hirotsugu Iwasaki ,  Jinning Li ,  Tadashi Yamaguchi ,  Shinichiro Yurugi

IPC分类号： B23B27/14 ,  B22F3/12 ,  B22F7/00 ,  B22F7/06 ,  B22F5/00

CPC分类号： B23B27/14 ,  B22F3/12 ,  B22F7/008 ,  B22F7/06 ,  B22F2005/001 ,  B22F2302/406 ,  B23B2226/315

摘要： A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 μm from the interface.

公开(公告)号：US12109618B2

公开(公告)日：2024-10-08

申请号：US17197266

申请日：2021-03-10

申请人： GENERAL ELECTRIC COMPANY

发明人： Ibrahim Ucok ,  Yan Cui ,  Srikanth Chandrudu Kottilingam ,  Surinder Singh Pabla

IPC分类号： B32B15/01 ,  B22F3/15 ,  B22F3/24 ,  B22F5/00 ,  B22F5/04 ,  B22F10/14 ,  B22F10/28 ,  B22F10/62 ,  B22F10/64 ,  B23K15/00 ,  B23K26/00 ,  B23K26/342 ,  B23K26/70 ,  B32B3/30 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  C22C19/05 ,  C22C19/07 ,  C22C30/02 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C38/10 ,  C22C38/42 ,  C22C38/44 ,  C22C38/48 ,  C22C38/50 ,  C22C38/52 ,  C23C4/08 ,  C23C4/134 ,  C23C14/16 ,  C23C14/28 ,  C23C16/06 ,  C23C16/44 ,  C23C18/16 ,  C23C18/32 ,  F01D5/28 ,  F01D25/00 ,  F01D25/24 ,  B23K101/00

CPC分类号： B22F3/15 ,  B22F3/24 ,  B22F5/009 ,  B22F5/04 ,  B22F10/14 ,  B22F10/28 ,  B22F10/62 ,  B22F10/64 ,  B23K15/0086 ,  B23K15/0093 ,  B23K26/0006 ,  B23K26/342 ,  B23K26/70 ,  B32B3/30 ,  B32B15/01 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  C22C19/055 ,  C22C19/056 ,  C22C19/057 ,  C22C19/07 ,  C22C30/02 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C38/105 ,  C22C38/42 ,  C22C38/44 ,  C22C38/48 ,  C22C38/50 ,  C22C38/52 ,  C23C4/08 ,  C23C4/134 ,  C23C14/16 ,  C23C14/28 ,  C23C16/06 ,  C23C16/44 ,  C23C18/1637 ,  C23C18/32 ,  F01D5/28 ,  F01D25/005 ,  F01D25/24 ,  B22F2003/242 ,  B22F2301/15 ,  B22F2301/35 ,  B22F2998/10 ,  B23K2101/001 ,  F05D2300/17 ,  Y02P10/25 ,  B22F2998/10 ,  B22F10/28 ,  B22F10/62 ,  B22F2003/242 ,  B22F10/64 ,  B22F3/15

摘要： A process includes forming a printed article having an external surface and at least one microfeature with an internal surface by additive manufacture, coating the external surface and the internal surface of the printed article with a metallic microlayer to form a coated article, and densifying the coated article to form a component. After formation, the printed article has a porosity such that the printed article is not at full density. A densified component includes a printed article having an external surface and at least one microfeature with an internal surface and a metallic microlayer coating the external surface and the internal surface of the printed article. The printed article is formed by additive manufacture.

公开(公告)号：US12090549B2

公开(公告)日：2024-09-17

申请号：US17794300

申请日：2020-12-15

申请人： Toho Titanium Co., Ltd.

发明人： Yosuke Inoue ,  Syogo Tsumagari ,  Yasuhiko Goto

IPC分类号： B22F1/16 ,  B22F1/142 ,  B22F1/145 ,  B22F3/10 ,  B22F3/11 ,  B22F5/00 ,  C22C14/00

CPC分类号： B22F1/16 ,  B22F1/142 ,  B22F1/145 ,  B22F3/1007 ,  B22F3/11 ,  B22F5/006 ,  C22C14/00 ,  B22F2201/03 ,  B22F2201/10 ,  B22F2201/20 ,  B22F2301/205 ,  B22F2302/25 ,  B22F2304/10 ,  B22F2999/00 ,  B22F1/145 ,  B22F2201/03 ,  B22F1/16

摘要： A method for manufacturing a porous metal body according to the present invention includes: a surface oxidizing step of heating a titanium-containing powder in an atmosphere containing oxygen at a temperature of 250° C. or more for 30 minutes or more to provide a surface-oxidized powder; and a sintering step of depositing the surface-oxidized powder in a dry process, and sintering the surface-oxidized powder by heating it in a reduced pressure atmosphere or an inert atmosphere at a temperature of 950° C. or more.

公开(公告)号：US12084747B2

公开(公告)日：2024-09-10

申请号：US17611760

申请日：2020-04-23

申请人： SAFRAN

发明人： Rémi Marie François Augustin ,  Edern Menou

IPC分类号： C22C21/00 ,  B22F5/00 ,  B22F10/28 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C22C1/04

CPC分类号： C22C21/00 ,  B22F5/009 ,  B22F10/28 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C22C1/0416 ,  C22C21/003 ,  B22F2301/052 ,  B22F2301/205 ,  B22F2301/35 ,  B22F2998/10 ,  B22F2999/00 ,  B22F2998/10 ,  C22C1/0416 ,  B22F9/08 ,  B22F10/28

摘要： The invention relates to an aluminum alloy includes, in mass percentages 3 to 6% titanium, 1.5 to 3% manganese, 1 to 2% iron, 1 to 2% chromium, 0.5 to 1.5% vanadium, 0.5 to 1.5% nickel, 0.2 to 1% zirconium, 0 to 0.5% cerium, 0 to 0.5% lanthanum, the remainder being aluminum and unavoidable impurities.

公开(公告)号：US20240269749A1

公开(公告)日：2024-08-15

申请号：US18116580

申请日：2023-03-02

申请人： Pratt & Whitney Canada Corp.

发明人： Kevin M. Tracy ,  Charles Trent Daulton

IPC分类号： B22F10/85 ,  B22F5/00 ,  B22F10/28 ,  B22F10/366 ,  B22F10/38 ,  B22F10/66 ,  B22F12/53 ,  B22F12/90 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B33Y50/02 ,  B33Y80/00

CPC分类号： B22F10/85 ,  B22F5/009 ,  B22F10/28 ,  B22F10/366 ,  B22F10/38 ,  B22F10/66 ,  B22F12/53 ,  B22F12/90 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B33Y50/02 ,  B33Y80/00

摘要： A method of manufacturing a component includes scanning a component using computed tomography to provide scanned data. Additive manufacturing data is developed using the scanned data compared to reference data. Depositing powder using an additive manufacturing device based upon the additive manufacturing data to provide a first object the additive manufacturing device melting the powder. Determining predicted characteristics of the first object based upon the additive manufacturing data. The predicted characteristics of the first object are compared to the reference data to provide machining data. Machining the first object using the machining data then occurs. A system for manufacturing a component is also disclosed.

公开(公告)号：US12042864B2

公开(公告)日：2024-07-23

申请号：US17678752

申请日：2022-02-23

申请人： INDIUM CORPORATION

发明人： David P. Socha ,  Geoff Beckwith ,  Robert Ploessl

IPC分类号： B22F12/30 ,  B22C9/08 ,  B22F3/24 ,  B22F5/00 ,  B22F10/28 ,  B22F10/40 ,  B22F10/70 ,  B22F12/82 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/10 ,  B33Y80/00 ,  B33Y99/00

CPC分类号： B22F12/30 ,  B22C9/08 ,  B22F5/006 ,  B22F5/007 ,  B22F10/28 ,  B22F10/70 ,  B22F12/82 ,  B33Y30/00 ,  B33Y40/10 ,  B33Y80/00 ,  B33Y99/00 ,  B22F3/24 ,  B22F10/40 ,  B22F2999/00 ,  B33Y10/00

摘要： Additive manufacturing structures and methods that enable the facile release of 3D printed parts are described. In one implementation, an additive manufacturing structure includes: a body; and a recessed section formed through a surface of the body, the recessed section comprising: a pour hole for filling the recessed section with a liquid metal or metal alloy that solidifies into an insert having a surface for forming a 3D object in a 3D printing device; and one or more air holes configured to release air displaced by the liquid metal or metal alloy.

公开(公告)号：US20240244973A1

公开(公告)日：2024-07-18

申请号：US18533907

申请日：2023-12-08

申请人： HARBIN INSTITUTE OF TECHNOLOGY

发明人： Jiehe SUI ,  Liangjun Xie ,  Zihang Liu ,  Fengkai Guo

IPC分类号： H10N10/01 ,  B22F1/054 ,  B22F3/12 ,  B22F5/00 ,  B22F9/04

CPC分类号： H10N10/01 ,  B22F1/054 ,  B22F3/12 ,  B22F5/006 ,  B22F9/04 ,  H10N10/853

摘要： The present disclosure provides a preparation method of a contact material with high thermal stability and low contact resistance based on an MgAgSb-based thermoelectric material and relates to the field of the contact materials preparation. The present disclosure aims to solve the problem of failure to achieve long-term stability for the MgAgSb/Mg3Bi2 device due to the fact that a contact material used by MgAgSb is Ag and MgAgSb may easily yield Ag3Sb in an Ag-rich environment at present. The method includes: at step 1, preparing MgCuSb nano-powder; at step 2, preparing MgCu0.1Ag0.87Sb0.99 nano-powder; at step 3, preparing MgCu0.1Ag0.87Sb0.99—Mg3.2Bi1.5Sb0.5 thermoelectric generation device. The present disclosure is applied to preparation of a contact material with high thermal stability and low contact resistance based on an MgAgSb-based thermoelectric material.

公开(公告)号：US12036610B2

公开(公告)日：2024-07-16

申请号：US17293261

申请日：2018-12-27

申请人： Halliburton Energy Services, Inc.

发明人： Sotha Heng ,  Dmitri Predtetchenski ,  John William Varner

IPC分类号： B22F3/03 ,  B22F5/00 ,  B23P15/28 ,  E21B10/42

CPC分类号： B22F3/03 ,  B22F5/00 ,  B23P15/28 ,  E21B10/42 ,  B22F2005/001

摘要： The disclosure provides a mold for a downhole tool or component thereof. The mold includes a grain material, a sodium silicate and carbon dioxide reaction product, and between 0.1% and 10% graphite by weight, inclusive, graphite. The disclosure further provides a method of forming a mold for a downhole tool or component thereof by filling a mold housing with graphite/sodium silicate/grain material mixture including between 0.1% and 10% graphite by weight, inclusive and shaping the mixture into a pre-mold having the same shape as the mold to be formed, and subjecting the pre-mold to an atmosphere having elevated amounts of carbon dioxide as compared to ambient air for a time sufficient to allow the sodium silicate to react with the carbon dioxide to form sufficient reaction products to bind the other pre-mold components and solidify a mold.

公开(公告)号：US20240227013A9

公开(公告)日：2024-07-11

申请号：US18493470

申请日：2023-10-24

申请人： RTX Corporation

发明人： Lawrence A. Binek ,  Christopher D. Ramsey ,  Gen Satoh ,  Benjamin G. Gardell

IPC分类号： B22F10/28 ,  B22F5/00 ,  B22F10/37 ,  B33Y10/00 ,  B33Y80/00

CPC分类号： B22F10/28 ,  B22F5/009 ,  B22F10/37 ,  B33Y10/00 ,  B33Y80/00

摘要： A method of additive manufacturing of a component is provided. The method includes building up the component to have a first uppermost layer and a foundation to have a second uppermost layer below the first uppermost layer, evacuating powder from around the component and the foundation to expose the second uppermost layer, disposing, on the second uppermost layer, a forged flange having an upper surface coplanar with the first uppermost layer, backfilling powder about the component and the forged flange, applying a thin additive manufacturing layer to the upper surface and completing a building up of the component by building up on the thin additive manufacturing layer.