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公开(公告)号：US20240365475A1
公开(公告)日：2024-10-31
申请号：US18770932
申请日：2024-07-12
发明人： Do Jae YOO , Yong Gil NAMGUNG , Jong Hoon SHIN , Sang Soon CHOI , Young Chul AN
IPC分类号： H05K3/22 , B23K1/00 , B23K1/005 , B23K1/19 , B23K101/42
CPC分类号： H05K3/225 , B23K1/0016 , B23K1/005 , B23K1/19 , B23K2101/42 , H05K2203/16
摘要： A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
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2.发明公开公开(公告)号：US20240359255A1
公开(公告)日：2024-10-31
申请号：US18771007
申请日：2024-07-12
IPC分类号： B23K20/10 , B23K20/00 , B23K37/04 , B23K101/40 , B23K101/42 , H01L23/49 , H05K3/32
CPC分类号： B23K20/10 , B23K20/002 , B23K37/04 , H05K3/328 , B23K2101/40 , B23K2101/42 , H01L23/49 , H05K2203/0285
摘要： An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.
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公开(公告)号：US12127334B2
公开(公告)日：2024-10-22
申请号：US16286427
申请日：2019-02-26
申请人： Teradyne, Inc.
发明人： Heng-Kit Too , Xue-Bin Tan , Max Zhang , Rocky Tao , Brian Brecht , Iris Weng , Hale Deng
CPC分类号： H05K1/0271 , B23K1/0008 , G01R1/07378 , H05K1/09 , H05K1/11 , H05K1/181 , H05K3/3463 , B23K2101/42 , H05K2201/068 , H05K2201/10378 , H05K2201/10734 , H05K2203/0195
摘要： An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.
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4.发明公开公开(公告)号：US20240292514A1
公开(公告)日：2024-08-29
申请号：US18572369
申请日：2022-06-30
申请人： Lisa Dräxlmaier GmbH
发明人： Andreas Brinkmann
IPC分类号： H05K1/02 , B23K1/00 , B23K101/42 , H05K1/18 , H05K3/34
CPC分类号： H05K1/0204 , B23K1/0016 , H05K1/0209 , H05K3/3421 , H05K3/3452 , H05K3/3485 , B23K2101/42 , H05K1/181 , H05K2201/0305 , H05K2201/0989 , H05K2201/09909 , H05K2201/10689 , H05K2203/0557 , H05K2203/1178
摘要： The present disclosure relates to a method for the process-reliable soldering of a chip package onto a printed circuit board for the process-reliable soldering of a chip package. The printed circuit board has a metallic cooling surface, a plurality of metallic contact surfaces surrounding the cooling surface, and, on a side opposite the cooling surface, a rear metallic mating surface, the mating surface being connected to the cooling surface by open vias, and lanes of solder resist being arranged on the cooling surface, which lanes both divide the cooling surface into a plurality of partial surfaces and enclose the vias.
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公开(公告)号：US12070814B2
公开(公告)日：2024-08-27
申请号：US18510842
申请日：2023-11-16
IPC分类号： B23K20/00 , B23K20/10 , B23K37/04 , H05K3/32 , B23K101/40 , B23K101/42 , H01L23/49
CPC分类号： B23K20/10 , B23K20/002 , B23K37/04 , H05K3/328 , B23K2101/40 , B23K2101/42 , H01L23/49 , H05K2203/0285
摘要： An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.
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6.发明公开公开(公告)号：US20240269759A1
公开(公告)日：2024-08-15
申请号：US18042050
申请日：2022-09-14
发明人： Jianqiang GUO , Wenjun LUO , Mingchuan LI
CPC分类号： B23K1/0016 , B23K1/0056 , B23K3/047 , B23K3/087 , H05K3/363 , B23K2101/42 , H05K2203/0147
摘要： This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.
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7.发明授权公开(公告)号：US12048101B2
公开(公告)日：2024-07-23
申请号：US17445331
申请日：2021-08-18
发明人： Seok Kim Tay , Mikael Tuominen
IPC分类号： H05K1/02 , B23K26/38 , H01L23/14 , H01L23/15 , H05K1/09 , H05K3/00 , H05K3/22 , H05K3/32 , H05K3/46 , H10K50/11 , H10K50/854 , H10K71/00 , H10K71/80 , B23K101/42
CPC分类号： H05K3/0032 , B23K26/38 , H05K3/4608 , B23K2101/42 , H05K2203/107
摘要： A method of manufacturing a component carrier is described. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and cutting out the component carrier from the stack along a closed circumferential laser cutting trajectory by a pulsed laser beam having a pulse length of less than 1 ns.
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公开(公告)号：US20240237225A1
公开(公告)日：2024-07-11
申请号：US17926149
申请日：2022-03-14
发明人： Guodong Chen , Hongjie Lyu , Lisha Zhou , Xingsheng Huang , Zhaohui Yang
IPC分类号： H05K3/22 , B23K26/06 , B23K26/384 , B23K26/402 , G02B26/10 , B23K26/082 , B23K101/42
CPC分类号： H05K3/22 , B23K26/0608 , B23K26/384 , B23K26/402 , G02B26/105 , B23K26/082 , B23K2101/42 , H05K2203/107
摘要： An opening method and opening device are provided. The opening device can perform opening according to the following steps: controlling a first laser processing device to process an object to be opened to form a first opening area; controlling a second laser processing device to process the object to be opened to form a second opening area; the power of the first laser processing device is greater than that of the second laser processing device, and the light spot of the first laser processing device is larger than that of the second laser processing device. The second opening area surrounds the edge of the first opening area and connects to the first opening area.
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公开(公告)号：US20240177912A1
公开(公告)日：2024-05-30
申请号：US18402357
申请日：2024-01-02
IPC分类号： H01F27/08 , B23K1/00 , B23K101/42 , B23K103/02 , B33Y10/00 , B33Y80/00 , H01F27/245 , H01F41/02 , H05K1/18 , H05K3/34
CPC分类号： H01F27/08 , B23K1/0016 , B33Y80/00 , H01F27/245 , H01F41/0233 , H05K1/181 , H05K3/341 , B23K2101/42 , B23K2103/02 , B33Y10/00 , H05K2201/1003
摘要： A component includes a magnetic core having a body formed of a first material, defining a first opening and a second opening thereon. A duct formed of a second material extends at least partially through the body between the first opening and the second opening. The first opening and the second opening are in fluid communication by way of the duct.
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公开(公告)号：US11931827B2
公开(公告)日：2024-03-19
申请号：US17263304
申请日：2020-06-22
发明人： Huanyin Xin , Zhongqian Li , Hong Chen , Jiangang Lu , Hongjiang Zhang , Jiangang Yin , Yunfeng Gao
IPC分类号： B23K26/38 , B23K26/00 , B23K26/06 , B23K26/067 , B23K26/08 , G02B27/09 , B23K101/40 , B23K101/42 , B23K103/00
CPC分类号： B23K26/38 , B23K26/0006 , B23K26/0608 , B23K26/0626 , B23K26/0648 , B23K26/0676 , B23K26/08 , G02B27/0916 , G02B27/0927 , G02B27/0955 , B23K2101/40 , B23K2101/42 , B23K2103/56
摘要： Provided are a laser cutting device and a laser cutting method. The laser cutting device comprises a beam expanding element provided with a plurality of lens sets, wherein optical axes of the plurality of lens sets are located in the same line and each lens set comprises at least one lens; the beam expanding element is configured to convert an incident beam into a first beam; and a spectroscopic element arranged on a light path of an emitted light of the beam expanding element, and wherein the spectroscopic element is configured to convert the first beam into multiple second beams that are annular and spaced apart from each other.
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