Laser machining apparatus and laser machining method

    公开(公告)号:US12237185B2

    公开(公告)日:2025-02-25

    申请号:US17588535

    申请日:2022-01-31

    Abstract: A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

    Laser processing apparatus and method of correcting converged spot position

    公开(公告)号:US12191216B2

    公开(公告)日:2025-01-07

    申请号:US17405330

    申请日:2021-08-18

    Inventor: Kentaro Odanaka

    Abstract: A laser processing apparatus includes a laser beam applying mechanism for applying a laser beam to a workpiece held by a holding mechanism while keeping a converged spot of the laser beam in the workpiece, and a temperature detector for detecting a temperature of the holding mechanism or a temperature of an actuator of a moving mechanism that moves the holding mechanism in a processing feed direction. The laser beam applying mechanism has a converged spot position adjusting unit. The controller, depending on a temperature change detected by the temperature detector, controls the converged spot position adjusting unit to establish a position of the converged spot of the laser beam in a thicknesswise direction of the workpiece.

    Handheld ophthalmic laser system with replaceable contact tips and treatment guide

    公开(公告)号:US12167891B2

    公开(公告)日:2024-12-17

    申请号:US18096291

    申请日:2023-01-12

    Abstract: In some embodiments, an ophthalmic laser system may be provided that does not include a traditional laser console. Instead, the treatment device may be configured to house the treatment light source within the device handle. Additionally, in some embodiments, the handheld treatment device may include a user interface, such as dials and buttons, for adjusting various parameters of the therapeutic light. With certain embodiments, the self-contained handheld treatment device may be operated independent of an AC power source. For example, in some embodiments, the handheld treatment device may be battery powered. Additionally, the handheld treatment device may be disposable or may utilize replaceable distal tips in certain embodiments. Certain embodiments may be particularly designed for transscleral cyclophotocoagulation. Also, treatment guides are provided that may be configured to couple with a treatment device to align the device with a target tissue of the eye.

    WAFER MANUFACTURING METHOD AND PROCESSING APPARATUS

    公开(公告)号:US20240408697A1

    公开(公告)日:2024-12-12

    申请号:US18676810

    申请日:2024-05-29

    Inventor: Kazuya HIRATA

    Abstract: In a flattening step included in a series of steps for manufacturing wafers from an ingot, the ingot is ground until the ingot has a thickness smaller than a thickness of the ingot as of the point in time when the series of steps is to be started, by a thickness obtained by adding up a finishing thickness of the wafer, an assumed thickness of a separation layer, and a distributed thickness obtained by dividing a surplus thickness of the ingot by a number obtained by subtracting one from a maximum number of wafers that can be manufactured from the ingot.

    LASER COLORED PRODUCT, LASER COLORING METHOD THEREFOR, AND LASER COLORING SYSTEM USING THE SAME

    公开(公告)号:US20240383268A1

    公开(公告)日:2024-11-21

    申请号:US18397636

    申请日:2023-12-27

    Abstract: A laser colored product, a laser coloring method therefor, and a laser coloring system using the same are provided. The laser coloring method comprises the following steps. First, provide a processing workpiece which includes a processing part, and the processing part includes a pattern region. The processing part within the pattern region includes an inner portion and an outer layer, and the outer layer includes metal materials. Use the laser coloring system to irradiate the outer layer of the pattern region in stages to convert the outer layer of the pattern region into a metal color pattern layer. The metal color pattern layer includes metal materials or metal compounds of metal materials, and the metal color pattern layer includes a plurality of pixel units arranged in arrays, wherein each of the pixel units includes a pixel color, and each of the pixel units has a pixel width or a pixel length between 1 μm to 500 μm.

    HIGH-PRECISION LASER TRIGGER SYSTEM AND HIGH-PRECISION LASER TRIGGER METHOD USING THE SAME

    公开(公告)号:US20240383066A1

    公开(公告)日:2024-11-21

    申请号:US18668031

    申请日:2024-05-17

    Applicant: DIT CORP.

    Abstract: A high-precision laser trigger system according to one embodiment of the present disclosure includes a stage on which an object is mounted, a trigger generator configured to generate a trigger signal according to a time-based mode and a position-based mode, a laser configured to emit laser light when the trigger signal is input, a motion controller configured to control the stage and the trigger generator, and a control device configured to identify coordinates of the stage, which places the object in a light-emitting position of the laser in the position-based mode, and transmit coordinate information including the coordinates and a mode change signal for changing a mode between the time-based mode and the position-based mode to the motion controller.

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