-
公开(公告)号：US20230085638A1
公开(公告)日：2023-03-23
申请号：US17988515
申请日：2022-11-16
发明人： Andrew J. Bayramian , James A. DeMuth , Ning Duanmu , Yiyu Shen
IPC分类号： B23K26/342 , B33Y10/00 , B33Y70/00 , B33Y50/02 , B23K26/03 , B23K26/12 , B23K26/06 , B23K26/064 , B23K26/073 , B23K26/0622
摘要： A method of additive manufacture is disclosed. The method may include providing a powder bed and directing a shaped laser beam pulse train consisting of one or more pulses and having a flux greater than 20 kW/cm2 at a defined two dimensional region of the powder bed. This minimizes adverse laser plasma effects during the process of melting and fusing powder within the defined two dimensional region.
-
公开(公告)号：US11577339B2
公开(公告)日：2023-02-14
申请号：US16879847
申请日：2020-05-21
申请人： DISCO CORPORATION
发明人： Satoshi Kumazawa , Masatoshi Nayuki
IPC分类号： B23K26/064 , B23K26/70 , B23K26/04 , G01M11/08 , H01L21/67 , H01L21/683 , B23K26/402 , B23K26/57
摘要： An optical axis adjusting method includes a position detecting step of emitting a laser beam from a laser oscillator, applying the laser beam to a processing point, and detecting the position of the laser beam by using a position detecting unit set at the processing point, a storing step of storing the position of the laser beam as detected in the position detecting step as a reference position, and an adjusting step of operating an adjusting mechanism of each optical component holder in the case that the position of the laser beam is deviated from the reference position after performing maintenance of each optical component, thereby adjusting the position of the laser beam so that the position of the laser beam is shifted back to the reference position.
-
公开(公告)号：US20230001517A1
公开(公告)日：2023-01-05
申请号：US17900966
申请日：2022-09-01
发明人： Shunpei YAMAZAKI , Naoto KUSUMOTO
IPC分类号： B23K26/50 , B23K26/064 , B23K26/08 , B32B43/00 , B23K26/073
摘要： A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.
-
公开(公告)号：US20220379408A1
公开(公告)日：2022-12-01
申请号：US17664739
申请日：2022-05-24
申请人： DISCO CORPORATION
发明人： Koji SHIONO , Haruki KAMIYAMA
IPC分类号： B23K26/50 , B23K26/064 , B23K26/06 , B23K26/067 , B23K26/082
摘要： A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.
-
公开(公告)号：US20220365298A1
公开(公告)日：2022-11-17
申请号：US17873361
申请日：2022-07-26
摘要： In various embodiments, optical fibers have arrangements of core, annular core, and cladding regions enabling variation of beam shape and/or beam parameter product and may be utilized for the processing (e.g., welding, cutting, drilling, etc.) of various workpieces.
-
公开(公告)号：US20220326539A1
公开(公告)日：2022-10-13
申请号：US17708027
申请日：2022-03-30
申请人： CORNING INCORPORATED
摘要： Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.
-
公开(公告)号：US11453085B2
公开(公告)日：2022-09-27
申请号：US16802105
申请日：2020-02-26
发明人： Keigo Yasuda , Koji Yamaguchi
IPC分类号： B23K26/242 , B23K26/06 , B23K26/064
摘要： Firstly, an upper base material is disposed above a lower base material. Secondly, a laser beam is irradiated so that an area irradiated with a laser beam at a time of melting start is formed on only an upper surface of the upper base material or on only both the upper surface and an end surface of the upper base material, whereby the end surface of the upper base material and the lower base material are fillet welded. With the end surface as a reference, a side the upper surface and the lower surface are positioned is a first side, and an opposite side of the first side is a second side. The laser beam is set such that an intensity of the laser beam is lower toward the second side from the first peak area within the irradiation area of the laser beam.
-
公开(公告)号：US11433483B2
公开(公告)日：2022-09-06
申请号：US16462033
申请日：2017-11-20
IPC分类号： B23K26/354 , B23K26/0622 , B23K26/064 , B23K26/00 , B23K26/06 , B23K26/067 , B23K103/10 , B23K103/12 , B23K103/00 , B23K103/08
摘要： A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.
-
公开(公告)号：US11433478B2
公开(公告)日：2022-09-06
申请号：US16889949
申请日：2020-06-02
申请人： FANUC CORPORATION
IPC分类号： G06F19/00 , B23K26/064 , G05B19/18 , G06N20/00 , G05B15/02 , G05B19/4065
摘要： The laser machining system includes a laser device configured to output a laser beam, and a machining head configured to emit the laser beam emitted by a laser oscillator of the laser device and propagated through an optical fiber, to a workpiece in order to perform laser machining. The machining head includes at least one wavelength selective mirror having wavelength selectivity with various values of reflectivity and transmittance according to wavelengths, and at least one image capturing device. The laser machining system monitors abnormality in a laser optical system leading from the laser oscillator to the machining head, during the laser machining, by reflecting light propagated from a side of introduction of the laser beam into the machining head by the wavelength selective mirror, making the light incident on an image capturing surface of the image capturing device, and detecting incident light illuminance distribution appearing on the image capturing surface of the image capturing device.
-
公开(公告)号：US20220241892A1
公开(公告)日：2022-08-04
申请号：US17580325
申请日：2022-01-20
申请人： Coherent, Inc.
发明人： Bradley CZOPEK , Cameron SIMMONS
IPC分类号： B23K26/064 , G02B7/02 , H01S3/00 , B23K26/06
摘要： An optomechanical assembly for temperature-robust laser beam processing includes a baseplate and an optics plate. The baseplate includes a source area for accommodating a source of the laser beam, and a light-processing area located away from the source area and including first and second anchor points. The optics plate is disposed in the light-processing area and includes first and second portions and a flexible coupling interconnecting the first and second portions. The first and second portions are fixed to the baseplate at the first and second anchor points, respectively. The flexible coupling allows for a thermally-induced change in distance between the first and second anchor points in the presence of dissimilar thermal expansion of the optics plate and the baseplate. The assembly further includes a series of optical elements for manipulating a laser beam from the laser source. Each of the optical elements is rigidly bonded to the first portion.
-
-
-
-
-
-
-
-
-
搜索结果
536 条记录 (耗时 0.025 秒)