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公开(公告)号:US20250033346A1
公开(公告)日:2025-01-30
申请号:US18911249
申请日:2024-10-10
Inventor: TOMOKI AMANO , YASUHIKO SAKAI
Abstract: Plate-like glass 2 having a print layer bonded to base material 5 by adhesive layer 4 can be separated in a layer form from article 1 by irradiating print layer 3 with laser light 6, carbonizing an organic component on an entire surface of the print layer through irradiation, and separating the print layer in a layer form.
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公开(公告)号:US20250010399A1
公开(公告)日:2025-01-09
申请号:US18711687
申请日:2021-11-24
Applicant: NIKON CORPORATION
Inventor: Yoshio KAWABE , Toshihiko OZAWA
IPC: B23K26/359 , B23K26/067 , B23K26/36
Abstract: A processing apparatus is a processing apparatus that performs a riblet processing on a surface of an object by using light from a light source, and includes: a first optical system that forms an interference fringe on the surface of the object by irradiating the object with a plurality of processing lights, which are generated by dividing the light from the light source, from different incident directions, respectively; and a second optical system that adjusts a shape of a riblet, which is formed on the surface of the object, by providing at least one difference of a difference in intensity, a difference in phase and a difference in polarization between at least two processing lights, with which the object is irradiated, among the plurality of processing lights.
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公开(公告)号:US12186985B2
公开(公告)日:2025-01-07
申请号:US18310151
申请日:2023-05-01
Applicant: Seurat Technologies, Inc.
Inventor: James A. DeMuth , Erik Toomre , Francis L. Leard , Kourosh Kamshad , Heiner Fees , Eugene Berdichevsky
IPC: B29C64/264 , B22F3/24 , B22F10/00 , B22F10/28 , B22F10/34 , B22F10/36 , B22F10/70 , B22F12/00 , B22F12/30 , B22F12/33 , B22F12/44 , B22F12/70 , B22F12/88 , B22F12/90 , B23K15/00 , B23K15/06 , B23K26/03 , B23K26/08 , B23K26/12 , B23K26/142 , B23K26/144 , B23K26/16 , B23K26/36 , B23K26/70 , B23K37/04 , B29C64/153 , B29C64/268 , B29C64/386 , B33Y10/00 , B33Y40/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , G02B7/14 , G02B7/16 , G02B7/182 , G02B15/04 , G02B15/10 , G02B19/00 , G02B26/08 , G02F1/01 , G02F1/1333 , G02F1/135 , H01S5/00 , B22F10/10 , B22F10/32 , B22F10/47 , B22F10/50 , B22F10/64 , B22F10/73 , B22F12/17 , B22F12/20 , B22F12/41 , B22F12/45 , B22F12/53 , B23K26/00 , B23K26/082 , B23K26/342 , B23K101/00 , B23K101/02 , B23K101/24 , B23K103/00 , B25J11/00 , B28B1/00 , B29K105/00 , B33Y30/00 , B33Y99/00 , G02B27/00 , G02B27/09 , G02B27/10 , G02B27/14 , G02B27/28 , G05B17/02 , G07C3/14 , H01S5/40
Abstract: An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. Improved structure formation, part creation and manipulation, use of multiple additive manufacturing systems, and high throughput manufacturing methods suitable for automated or semi-automated factories are also disclosed.
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公开(公告)号:US20240391034A1
公开(公告)日:2024-11-28
申请号:US18265189
申请日:2022-12-21
Applicant: SHENZHEN HANQINGDA TECHNOLOGY CO., LTD.
Inventor: Shoushan HOU , Zhihuan LIU , Xiangying CHEN
Abstract: A visual laser engraving machine is disclosed, including a bottom plate, clamping assemblies and a product body. A portal frame is disposed around a surface of the bottom plate. An electrically controlled pulley is slidably connected with a horizontal slide rail at an inner side thereof. A laser device is slidably connected between longitudinal slide rails. A lower slide rail is arranged at a middle of the surface of the bottom plate. The clamping assemblies are slidably connected with the lower slide rail at an inner side of the lower slide rail and each includes a control pulley, electric push rods, a servo motor and miniature push rods. The product body is placed between the miniature push rods.
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公开(公告)号:US12138669B2
公开(公告)日:2024-11-12
申请号:US17665882
申请日:2022-02-07
Applicant: General Electric Company
Inventor: Michal Jerzy Cyrek , Michal Chomka , Mingjia Shao
Abstract: A method of removing contaminants from a surface of a gas turbine engine component protected by a diffusion coating that comprises an additive layer on the surface of the component and a diffusion zone in the surface of the component. The method includes subjecting the surface containing contaminants to laser beam pulses to remove contaminants from the component such that contaminants on the surface of the component are removed without damaging or removing the diffusion zone of the diffusion coating. Methods for controlled removal of at least a portion of a thickness of a diffusion coating from a coated superalloy component are also provided.
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公开(公告)号:US12128502B2
公开(公告)日:2024-10-29
申请号:US17236897
申请日:2021-04-21
Applicant: Makeblock Co., Ltd.
Inventor: Yuchao Liu
IPC: B23K26/36 , B23K26/362
CPC classification number: B23K26/362
Abstract: A control method of laser processing, a laser processing apparatus, and non-transitory computer readable storage medium are provided. The control method of laser processing includes the following. An image of a to-be-processed material is captured via a camera mounted on a laser processing apparatus, where the captured image is used for depicting the to-be-processed material and lines drawn on the to-be-processed material. Processing lines of the to-be-processed material are identified according to the drawn lines in the captured image. Laser processing is performed on the to-be-processed material according to the processing lines, to obtain a laser product corresponding to the drawn lines.
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公开(公告)号:US12115599B2
公开(公告)日:2024-10-15
申请号:US16608160
申请日:2018-04-25
Applicant: 4JET MICROTECH GMBH
Inventor: Heinz Leonhard Jetter , Tobias Dyck
IPC: B23K26/352 , B23K26/067 , B23K26/08 , B23K26/36 , B64C21/10
CPC classification number: B23K26/355 , B23K26/0676 , B23K26/08 , B23K26/3584 , B23K26/36 , B64C21/10 , B64C2230/26
Abstract: Method and device for producing riblets by applying the riblets by laser interference patterning by a carbon dioxide laser.
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公开(公告)号:US12109585B2
公开(公告)日:2024-10-08
申请号:US18072935
申请日:2022-12-01
Applicant: RTX Corporation
Inventor: Tahany El-Wardany , Timothy C. Davenport , Thomas P. Filburn , Eric W. Stratton
CPC classification number: B05D3/06 , B05B17/06 , B05D3/062 , B05D3/065 , B05D5/005 , B05D5/02 , B23K26/355 , B23K26/36 , B25J15/0019 , F01D5/005
Abstract: Methods and systems for treating components are described. The methods include using a system having a controller, a laser applicator, a coating applicator, and a sensor array. The laser applicator, the coating applicator, and the sensor array are arranged on a treatment arm that is controlled by the controller. The method includes scanning a surface to be treated of the component using the sensor array, cleaning the surface to be treated using the laser applicator, defining surface texture patterns, applying laser texturing, and applying a new coating to the surface to be treated using the coating applicator.
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公开(公告)号:US20240316701A1
公开(公告)日:2024-09-26
申请号:US18128147
申请日:2023-03-29
Applicant: LMTGPR LLC
Inventor: Samuel Palmeter
CPC classification number: B23K37/0435 , B23K26/36 , B23K37/0211
Abstract: An adjustable fixture assembly for marking objects, such as pistols, includes a base and an adjusting device. The base includes a platform having a first end, a second end, a pair of side walls, and a pair of tracks extending between the first end, and a second end. An activator section includes a neck section and a motor section including a motor having a circular base and a clamping surface for engaging the rear side of the pistol, wherein the clamping surface includes a first axis. The activator section includes a cradle member for holding the pistol. A laser marking device marks the pistol, as the pistol is fixedly attached to the cradle. As the cradle rotates about the axis, the laser marking device marks various surfaces of the pistol at various angles thereby allowing variety and flexibility in laser marking.
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公开(公告)号:US20240312841A1
公开(公告)日:2024-09-19
申请号:US18602117
申请日:2024-03-12
Inventor: Hidefumi SAEKI , Hidehiko KARASAKI , Shogo OKITA , Toshiyuki TAKASAKI , Akihiro ITOU
IPC: H01L21/78 , B23K26/36 , H01L21/56 , H01L21/683
CPC classification number: H01L21/78 , B23K26/36 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L2221/68327
Abstract: An element chip manufacturing method disclosed herein includes a preparation process of preparing a substrate having a semiconductor layer, a wiring layer, a plurality of element areas and a dividing area, a resin layer formation process of forming a resin layer covering the wiring layer, an opening formation process of irradiating the wiring layer and the resin layer in the dividing area to form an opening in which the semiconductor layer is exposed in the dividing area, a reflow process of reducing the opening by reflowing the resin layer, and a singulation process of dividing the substrate into a plurality of element chips each including a different one of the element areas, by performing etching of the substrate with plasma along the opening reduced in the reflow process, using the resin layer as a mask.
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