公开(公告)号：US12053833B2

公开(公告)日：2024-08-06

申请号：US18094465

申请日：2023-01-09

申请人： BENTELER AUTOMOBILTECHNIK GMBH

发明人： Tobias Dupmeier ,  Guenter Fortmeier

IPC分类号： B23K1/00 ,  B23K3/04 ,  B23K3/08 ,  B23P15/26 ,  B23K101/14

CPC分类号： B23K1/0012 ,  B23K3/04 ,  B23K3/085 ,  B23P15/26 ,  B23K2101/14

摘要： A hot-forming die has a heatable lower die and a heatable upper die. The lower die and the upper die have spacer elements to permit flexing. A plate stack including two plate elements is inside the hot-forming die. The plate stack is on the spacer elements in the lower die. The lower die and the upper die are displaced relative to each other when the hot-forming die is closed. The spacer elements of the upper die come into contact with the plate stack. As the closing movement continues, the spacer elements, are displaced into the lower die and the upper die, respectively, and the plate stack is clamped between the lower die and the upper die. The plate stack is then heated by the lower die and the upper die and an internal pressure is applied to an intermediate space between the plate elements by feeding in an active medium.

公开(公告)号：US11780022B2

公开(公告)日：2023-10-10

申请号：US16912615

申请日：2020-06-25

申请人： Western Digital Technologies, Inc.

发明人： Yusuke Matsumoto ,  Kenichi Murata

IPC分类号： B23K1/005 ,  B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K26/14 ,  B23K3/04 ,  B23K101/42

CPC分类号： B23K1/0056 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/0623 ,  B23K26/1476 ,  B23K35/0244 ,  B23K2101/42

摘要： A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.

公开(公告)号：US20230219156A1

公开(公告)日：2023-07-13

申请号：US18187319

申请日：2023-03-21

申请人： General Electric Company

发明人： Shan Liu ,  Daniel J. Dorriety ,  Paul A. Cook ,  Brian Leslie Henderson ,  Ryan T. Smith

IPC分类号： B23K3/04 ,  B23K1/00 ,  B23K3/08

CPC分类号： B23K3/04 ,  B23K1/0018 ,  B23K3/085

摘要： A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.

公开(公告)号：US11420282B2

公开(公告)日：2022-08-23

申请号：US16305705

申请日：2017-11-27

申请人： Hitachi, Ltd.

发明人： Miki Hiraoka ,  Shinya Kawakita ,  Masayuki Kyoi ,  Osamu Ikeda

IPC分类号： B23K3/00 ,  B23K3/06 ,  B23K3/02 ,  B23K3/04

摘要： A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

公开(公告)号：US11014180B2

公开(公告)日：2021-05-25

申请号：US16166286

申请日：2018-10-22

申请人： ERSA GmbH

发明人： Thomas Alletzhaeusser ,  Tim Alletzhaeusser

IPC分类号： B23K3/00 ,  B23K3/02 ,  B23K3/04 ,  B23K3/06 ,  B23K3/08 ,  B23K3/03 ,  H04L29/08 ,  B23K3/047 ,  B23K31/12 ,  B23K37/02 ,  G05D23/22 ,  B23K101/42

摘要： Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

公开(公告)号：US10695853B2

公开(公告)日：2020-06-30

申请号：US15323808

申请日：2015-07-15

申请人： PAC TECH—PACKAGING TECHNOLOGIES GMBH

发明人： Ghassem Azdasht ,  Thorsten Krause

IPC分类号： B23K3/06 ,  B23K1/005 ,  B23K1/00 ,  B23K3/04 ,  B23K101/42

摘要： A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position P1 to a transfer position P2, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P3. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle α with respect to the rotation axis.

公开(公告)号：US20190009375A1

公开(公告)日：2019-01-10

申请号：US15764165

申请日：2016-09-29

申请人： ORIGIN ELECTRIC COMPANY, LIMITED ,  KOKI COMPANY LIMITED

发明人： Yukiko HAYASHI ,  Arisa SHIRAISHI ,  Naoto OZAWA ,  Takayuki SUZUKI ,  Takeshi SHIRAI ,  Noriyoshi UCHIDA ,  Mitsuyasu FURUSAWA

IPC分类号： B23K35/38 ,  B23K35/36 ,  B23K35/26 ,  B23K3/04 ,  B23K1/19 ,  B23K37/00

摘要： The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

公开(公告)号：US20180333796A1

公开(公告)日：2018-11-22

申请号：US15546032

申请日：2016-01-26

申请人： Illinois Tool Works Inc.

发明人： Gerardus Johannes Adrianus Maria Diepstraten ,  Antonie Cornelis Colijn

IPC分类号： B23K3/08 ,  B23K1/008 ,  B23K1/00 ,  B23K1/20 ,  B23K3/04 ,  H05K3/34

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K1/203 ,  B23K3/04 ,  B23K2101/42 ,  H05K3/3494

摘要： The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

公开(公告)号：US20180317326A1

公开(公告)日：2018-11-01

申请号：US15938256

申请日：2018-03-28

申请人： DENSO WAVE INCORPORATED ,  DENSO CORPORATION

发明人： Takeshi NAGANUMA ,  Hideaki KANIE ,  Akinari HIGASHIDA ,  Koji KONDO

IPC分类号： H05K3/36 ,  H05K3/34 ,  B23K3/04 ,  H05K1/02

摘要： An apparatus for bonding flexible printed wires to non-flexible printed wires is provided. The apparatus incudes a heater; and a heating tool heated by the heater and formed to have a heating chip. The heating chip has a height direction and a heating surface directed in the height direction. The heating surface is moved toward the flexible wires to press the flexible wires formed on the non-flexible printed wires. A solder portion is mounted on, at least, ones of the flexible printed wires and the non-flexible printed wires, the heating tool melting the solder portion for a mutual connection between the flexible and non-flexible printed wires when the heating surface of the heating tool is pressed onto the flexible printed wires. The pressing surface is formed as a curved surface having a central part which protrudes outward more than other parts thereof.

公开(公告)号：US20180279485A1

公开(公告)日：2018-09-27

申请号：US15927179

申请日：2018-03-21

申请人： Service Support Specialties, Inc.

发明人： Gary Hillman ,  Joseph Deghuee

IPC分类号： H05K3/34 ,  H01L21/67 ,  B23K3/04 ,  B23K1/008 ,  B23K35/38

摘要： A reflow soldering apparatus, system, and method. The reflow soldering system may include a housing that is alterable between an open state and a closed state, the open state being used for loading and unloading of substrates and the closed state being used during operation. The system may also include a heating assembly located within the chamber and a cooling assembly that is spaced apart from the heating assembly. A support member may be included to support a substrate within the chamber. A first actuator unit may be operably coupled to either the heating and cooling assemblies jointly, or to the support member. Additionally, the system may include a control unit coupled to the first actuator unit to cause relative movement between the substrate and the heating and cooling assemblies. Thus, the substrate can move between the heating and cooling assemblies during the various stages of the reflow soldering process.