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31 条记录 (耗时 0.016 秒)

    Method for examining bonded-metal by ultrasonic examination
    2.
    发明授权
    Method for examining bonded-metal by ultrasonic examination 失效
    通过超声检查检查粘结金属的方法

    公开(公告)号：US06302314B1

    公开(公告)日：2001-10-16

    申请号：US09224710

    申请日：1998-12-31

    申请人： Hirotsugu Horio ,  Hisao Nakase

    发明人： Hirotsugu Horio ,  Hisao Nakase

    IPC分类号： B23K3112

    CPC分类号： G01N29/4418 ,  G01N29/11 ,  G01N29/2487 ,  G01N2291/015 ,  G01N2291/02881 ,  G01N2291/0421 ,  G01N2291/0422 ,  G01N2291/044 ,  G01N2291/056 ,  G01N2291/102 ,  G01N2291/2675

    摘要： A method for examining bonded-metal by ultrasonic examination, the method comprising a step of measuring an attenuation amount of an ultrasonic wave, the ultrasonic wave being generated by a sending probe and received by a receiving probe through a bonding interface, the sending probe and the receiving probe being disposed on the bonded-metal with putting the bonding interface therebetween, the bonded-metal being bonded under unknown condition, and a step of examining a bonding property of the bonded-metal based on the attenuation amount, with utilizing a relationship between a bonding property and an attenuation amount for standard metal bonded under known condition measured preliminarily.

    摘要翻译： 一种通过超声波检查来检测接合金属的方法，所述方法包括测量超声波的衰减量的步骤，所述超声波由发送探头产生并由接收探针通过接合界面接收，所述发送探针和 所述接收探针通过在所述接合金属上放置所述接合金属而被接合，所述接合金属在未知状态下接合，以及利用所述衰减量来检查所述接合金属的接合特性的步骤 在预先测量的已知条件下的标准金属键合的接合性能和衰减量之间。

    High temperature refractory joining paste
    3.
    发明授权
    High temperature refractory joining paste 失效
    高温耐火接合膏

    公开(公告)号：US06199747B1

    公开(公告)日：2001-03-13

    申请号：US09385932

    申请日：1999-08-30

    申请人： Michael A. Cohn ,  Joseph P. DeGeorge ,  Rao V. Vallabhaneni

    发明人： Michael A. Cohn ,  Joseph P. DeGeorge ,  Rao V. Vallabhaneni

    IPC分类号： B23K3112

    CPC分类号： B23K35/32 ,  B23K20/023 ,  B23K20/16 ,  B23K35/025

    摘要： A method of and novel composition for transient liquid phase bonding of refractory metal structures is described herein. Preferably, the composition comprises a first component substantially similar to the composition of the refractory metal structure, and a second component having a lower melting temperature than the first component comprising a metallic constituent selected from the group consisting of iron, nickel and cobalt. The second component acts as a melting point depressant to temporarily lower the melting point of the first component so that the join can be accomplished without melting the structure itself. Upon applying the composition to the surfaces of refractory metal structures in need of joining, the assembly is heated to a eutectic point defined as the lowest melting point of the composition. A localized liquid region is formed at the interface of the two structures which solidifies when the second component diffuses into the structures such that the region becomes increasingly refractory thereby solidifying into a substantially refractory joint.

    摘要翻译： 本文描述了难熔金属结构的瞬态液相粘合的方法和新组合物。 优选地，组合物包含与难熔金属结构的组成基本相似的第一组分，以及具有比包含选自铁，镍和钴的金属成分的第一组分更低的熔融温度的第二组分。 第二组分起着降低熔点的作用，暂时降低第一组分的熔点，从而可以在不熔化结构本身的情况下实现接合。 当将组合物施加到需要接合的难熔金属结构的表面时，将组件加热到被定义为组合物的最低熔点的共晶点。 当两个结构的界面处形成局部液体区域，当第二组分扩散到结构中时，这些结构固化，使得该区域变得越来越难以固化，从而固化成基本上耐火的接头。

    Semiconductor light-emitting device and method of manufacturing the same and mounting plate
    6.
    发明授权
    Semiconductor light-emitting device and method of manufacturing the same and mounting plate 有权

    公开(公告)号：US06474531B2

    公开(公告)日：2002-11-05

    申请号：US09729213

    申请日：2000-12-05

    申请人： Masafumi Ozawa

    发明人： Masafumi Ozawa

    IPC分类号： B23K3112

    CPC分类号： H01L33/40 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/06102 ,  H01L2224/48091 ,  H01L2933/0016 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02272 ,  H01L2924/00014

    摘要： To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser tip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser tip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser tip. Therefore, when the mounting plate is overlaid to the laser tip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film. Accordingly, even if the solder is squeezed out in the vicinity of the n-side electrode, the solder is hardly squeezed out in the vicinity of the p-side electrode. The pn junction part is generally positioned in the vicinity of the p-side electrode, which controls the solder to adhesion to the pn junction part.

    Full coverage thermal couple
    7.
    发明授权
    Full coverage thermal couple 有权
    全覆盖热电偶

    公开(公告)号：US06206267B1

    公开(公告)日：2001-03-27

    申请号：US09475897

    申请日：1999-12-30

    申请人： Doreen DePalma Burns

    发明人： Doreen DePalma Burns

    IPC分类号： B23K3112

    CPC分类号： G01K1/14 ,  H05K3/225 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2201/10734 ,  H05K2203/176

    摘要： A process for profiling solder joints of circuit boards including solder bumps is provided using an arrangement with a thin tape element with length and width dimensions generally corresponding to the length and width dimensions of the ball grid array (BGA) and with a registration portion. Thermal couple probes are positioned on the element at locations corresponding, based on the registration portion, to critical locations of the BGA requiring profiling. The element is disposed underneath the BGA and secured in position with the element in registration with the solder bumps on the BGA and with the plurality of thermal couples connected to the element such that the thermal couples are positioned corresponding to the critical locations requiring profiling. The tape element may be kapton tape. The registration may be provided with a portion of the element having holes, each hole being of a size to go over a solder bump on the BGA.

    摘要翻译： 使用具有通常对应于球栅阵列（BGA）的长度和宽度尺寸以及配准部分的长度和宽度尺寸的薄带元件的布置来提供用于形成包括焊料凸块的电路板的焊点的工艺。 热耦合探针位于元件上，该位置对应于对准部分，位于需要分析的BGA的关键位置。 该元件设置在BGA下方并且固定在适当位置，元件与BGA上的焊料凸块对准，并且多个热耦连接到元件，使得热耦对于需要成型的关键位置。 带元件可以是卡波带。 对准可以设置有具有孔的元件的一部分，每个孔的尺寸要超过BGA上的焊料凸块。

    Method and apparatus for holding a workpiece during welding
    8.
    发明授权
    Method and apparatus for holding a workpiece during welding 失效
    焊接时保持工件的方法和装置

    公开(公告)号：US06173882B1

    公开(公告)日：2001-01-16

    申请号：US09076353

    申请日：1998-05-12

    申请人： Kenneth Booker ,  Mark R. Dunneback ,  Joseph Guerra ,  Lianchun Mu ,  Enoch Nartey

    发明人： Kenneth Booker ,  Mark R. Dunneback ,  Joseph Guerra ,  Lianchun Mu ,  Enoch Nartey

    IPC分类号： B23K3112

    CPC分类号： B23K37/0435 ,  B23K26/037 ,  B23K2101/006

    摘要： A workpiece is held at a welding station by several clamps during welding. After welding, the workpiece is transferred to a checking station where a determination is made of the actual location of critical points on the workpiece. The actual critical point locations are compared with ideal critical point locations to determine if there is any error in the manner in which the workpiece was held by the clamps. If an error is determined, one or more of the clamps are adjusted to compensate for the error when holding a subsequent workpiece for welding. Apparatus is also provided for carrying out the method of this invention.

    摘要翻译： 在焊接过程中，工件通过多个夹具保持在焊接站。 在焊接之后，工件被传送到确定工件上临界点的实际位置的检查站。 将实际的临界点位置与理想的临界点位置进行比较，以确定夹具夹持工件的方式是否存在任何误差。 如果确定了错误，则调整一个或多个夹具以补偿保持随后的焊接工件时的误差。 还提供了用于实施本发明的方法的设备。

    Wave soldering method and system used for the method
    10.
    发明授权
    Wave soldering method and system used for the method 失效
    波峰焊方法和系统用于该方法

    公开(公告)号：US06412682B2

    公开(公告)日：2002-07-02

    申请号：US09886042

    申请日：2001-06-22

    申请人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

    发明人： Ataru Ichikawa ,  Tatsuya Kubo ,  Atsushi Furumoto ,  Kenji Arai ,  Mitsuhiro Sugiura ,  Misao Tanaka

    IPC分类号： B23K3112

    CPC分类号： B23K1/085 ,  B23K3/0653 ,  H05K3/3468

    摘要： In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

    摘要翻译： 在工件与波熔融焊料接触的状态下焊接工件的方法中，在将工件浸入波熔融焊料中的浸入深度保持恒定的同时进行焊接工艺。 通过根据工件在其高度方向上的位移量来改变工件的高度位置和波熔融焊料的波高之一来进行浸入深度控制。 因此，即使当工件发生热翘曲时，也可以以高质量执行焊接工艺。