公开(公告)号：US12217979B2

公开(公告)日：2025-02-04

申请号：US16913252

申请日：2020-06-26

Applicant: Axus Technology, LLC

Inventor： Daniel Ray Trojan ,  John Kevin Shugrue

IPC: H01L21/67 ,  B24B37/04 ,  B24B37/32 ,  B24B55/02 ,  H01L21/306 ,  H01L21/321 ,  H01L21/687 ,  H01L21/04

Abstract: Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP.

公开(公告)号：US12128524B2

公开(公告)日：2024-10-29

申请号：US18363162

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/32

CPC classification number: B24B37/32

Abstract: A membrane for a CMP carrier head includes a circular lower portion that provides a substrate mounting surface for a central region of a substrate, a first plurality of flaps that extend upward from the circular lower portion to form a plurality of inner chambers, an annular upper portion that provides a lower surface for applying pressure to an annular outer region of the substrate, and a second plurality of flaps that extend upward from the annular upper portion to form a plurality of independently pressurizable outer chambers. The annular upper portion surrounds the circular lower portion and is vertically offset from the circular lower portion such that the lower surface is positioned above a plane defined by the circular lower portion, and the annular upper portion is coupled to an outermost flap of the first plurality of flaps.

公开(公告)号：US12128523B2

公开(公告)日：2024-10-29

申请号：US16890833

申请日：2020-06-02

Applicant: EBARA CORPORATION

Inventor： Makoto Fukushima ,  Hozumi Yasuda ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki

IPC: B24B37/32 ,  B24B37/005 ,  B24B49/16 ,  H01L21/304

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B49/16 ,  H01L21/304

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface for pressing the substrate against the polishing surface and further having a retaining ring arranged so as to surround the substrate and brought into contact with the polishing surface, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface. The at least one local load exerting mechanism is arranged so as not to rotate together with the substrate holder.

公开(公告)号：US20240253179A1

公开(公告)日：2024-08-01

申请号：US18630886

申请日：2024-04-09

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY ,  Charles C. GARRETSON ,  Vladimir GALBURT

IPC: B24B37/32 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B37/04

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US12036636B2

公开(公告)日：2024-07-16

申请号：US18174125

申请日：2023-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Hao Kung ,  Shang-Yu Wang ,  Ching-Hsiang Tsai ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: B24B37/10 ,  B24B37/04 ,  B24B37/32 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768

CPC classification number: B24B37/105 ,  B24B37/042 ,  B24B37/32 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/7684

Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.

公开(公告)号：US12030156B2

公开(公告)日：2024-07-09

申请号：US17355024

申请日：2021-06-22

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Andrew J. Nagengast ,  Justin Ho Kuen Wong

IPC: B24B37/005 ,  B24B29/00 ,  B24B37/10 ,  B24B37/32 ,  B24B47/22 ,  B24B49/10

CPC classification number: B24B37/005 ,  B24B29/00 ,  B24B37/10 ,  B24B49/10 ,  B24B37/32 ,  B24B47/22

Abstract: A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carrier plate. The first flexible membrane has an upper surface and having a lower surface that provides a substrate mounting surface. The piezoelectric actuators are positioned above the first flexible membrane so as to independently adjust compressive pressure on the upper surface of the first flexible membrane.

公开(公告)号：US12017322B2

公开(公告)日：2024-06-25

申请号：US16210830

申请日：2018-12-05

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Wei-Chang Cheng ,  Chi-Hung Liao

IPC: B24B37/015 ,  B24B37/24 ,  B24B37/32 ,  H01L21/321 ,  H01L21/67

CPC classification number: B24B37/015 ,  B24B37/245 ,  B24B37/32 ,  H01L21/3212 ,  H01L21/67219

Abstract: A chemical mechanical polishing method includes holding a wafer in a carrier over a polishing pad, dispensing a first slurry comprising a plurality of first abrasive particles into the carrier, rotating at least one of the carrier and the polishing pad, halting the dispensing of the first slurry, and dispensing a second slurry into the carrier after halting the dispensing of the first slurry, wherein the second slurry comprises a plurality of second abrasive particles smaller than the first abrasive particles.

公开(公告)号：US12005545B2

公开(公告)日：2024-06-11

申请号：US17477857

申请日：2021-09-17

Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.

Inventor： Chao Li ,  Chin-Chung Ku

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/32 ,  H01L21/67

CPC classification number: B24B37/205 ,  B24B37/005 ,  B24B37/32 ,  H01L21/67017 ,  H01L21/67253

Abstract: The embodiments of the present application provide a fixing device and a detection system. The fixing device includes: a bearing disk used for bearing a lapping head, the bearing disk being provided with positioning holes and a first positioning ring, the positioning holes being used for accommodating and fixing a positioning pin of a first type of lapping head, and the first positioning ring being used for fixing a positioning disk of a second type of lapping head.

公开(公告)号：US20240131655A1

公开(公告)日：2024-04-25

申请号：US17994411

申请日：2022-11-28

Applicant: Powerchip Semiconductor Manufacturing Corporation

Inventor： Ming-Hsiang Chen ,  Shih-Ci Yen ,  Kai-Yao Shih

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/042

Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.

公开(公告)号：US20230390883A1

公开(公告)日：2023-12-07

申请号：US17961516

申请日：2022-10-06

Applicant: Applied Materials, Inc.

Inventor： Haoquan Fang ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Jun Qian ,  Kun Xu ,  Sohrab Pourmand ,  Boguslaw A. Swedek ,  Jeonghoon Oh ,  Dominic J. Benvegnu ,  Brian J. Brown

IPC: B24B37/005 ,  B24B37/32 ,  G01N29/44 ,  G01N29/46

CPC classification number: B24B37/005 ,  B24B37/32 ,  G01N29/4436 ,  G01N29/4427 ,  G01N29/46

Abstract: A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relative motion between the platen and the carrier head so as to polish the substrate. The carrier head includes a retaining ring for holding the substrate, and the acoustic sensor travels in a path below the carrier head and the retaining ring. A controller is configured to analyze a signal from the acoustic sensor and determine a characteristic of the retaining ring based on the signal.