公开(公告)号：US11980998B2

公开(公告)日：2024-05-14

申请号：US16796903

申请日：2020-02-20

申请人： EBARA CORPORATION

发明人： Itsuki Kobata ,  Takashi Yamazaki ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/14 ,  B24D13/20

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/147 ,  B24D13/20

摘要： An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

公开(公告)号：US11958160B2

公开(公告)日：2024-04-16

申请号：US16963972

申请日：2018-11-26

申请人： SHIN-ETSU HANDOTAI CO., LTD.

发明人： Koji Kitagawa ,  Shiro Toyoda

IPC分类号： B24B55/02 ,  B23D57/00 ,  B23D59/04 ,  B23D61/18 ,  B24B27/06 ,  B24B41/00 ,  B28D5/00 ,  B28D5/04 ,  B28D7/02

CPC分类号： B24B27/0633 ,  B23D57/0007 ,  B23D61/18 ,  B24B41/005 ,  B24B55/02 ,  B28D5/0076 ,  B28D5/04 ,  B28D5/042 ,  B28D5/045 ,  B28D7/02

摘要： A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around multiple grooved rollers, the method including feeding a workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at multiple positions aligned in an axial direction of the workpiece simultaneously. The method includes: supplying a coolant for workpiece slicing onto the wire row when the workpiece is sliced with the fixed abrasive grain wire; and supplying a coolant for workpiece drawing, which differs from and has a higher viscosity than the coolant for workpiece slicing, onto the wire row when the workpiece is drawn out from the wire row after the slicing of the workpiece.

公开(公告)号：US11685016B2

公开(公告)日：2023-06-27

申请号：US16550620

申请日：2019-08-26

申请人： Lake Country Tool, LLC

发明人： Scott S. McLain ,  Charles B. Kendall, III

IPC分类号： B24B23/02 ,  B24B41/047 ,  B24B55/02

CPC分类号： B24B55/02 ,  B24B23/02 ,  B24B41/047

摘要： A cooling device for a rotating machine has a fan assembly coupled with a backing plate. A hub, on the backing plate, secures the cooling device with a shaft. The backing plate includes one or more vents to enable air to exit the cooling device. The fan includes an opening to enable air to enter the cooling device. A chamber is formed between the fan assembly and the backing plate. During rotation, air is drawn into the opening. The air is passed into the chamber and exits through the vents to cool a work surface or working pad attached to the backing plate.

公开(公告)号：US11679467B2

公开(公告)日：2023-06-20

申请号：US17405933

申请日：2021-08-18

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Hsi Huang ,  Huang-Chu Ko

IPC分类号： B24B37/015 ,  B24B49/14 ,  B24B57/02 ,  B24B37/04 ,  B24B37/10 ,  B24B55/02 ,  B24B37/30

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/107 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B37/30

摘要： An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

公开(公告)号：US11638977B2

公开(公告)日：2023-05-02

申请号：US16638153

申请日：2018-08-30

申请人： Mirka Ltd

发明人： Stig Finnäs ,  Caj Nordström ,  Simon Bäck

IPC分类号： B24B23/02 ,  B24B55/02 ,  F16C37/00

摘要： An arrangement for cooling a spindle bearing or bearings of an abrading apparatus with rotating abrading members is disclosed. This is premised on arranging in a housing of the abrading apparatus conduits which extend from a spindle bearing chamber wall of the housing to an inner suction chamber wall of the housing. Via such conduits, hot air may be expelled from a spindle bearing chamber of the housing as an overpressure in front of a protruding balancer element of a rotating shaft balancer is discharged from the spindle bearing chamber via a conduit into a suction chamber. Cool air may be conveyed from a suction chamber into the spindle bearing chamber as an underpressure behind the protruding balancer element draws in air from the suction chamber via the conduit to the spindle bearing chamber.

公开(公告)号：US20230081654A1

公开(公告)日：2023-03-16

申请号：US17904446

申请日：2021-02-18

申请人： Antoni Josep SORIANO ASENSIO ,  Maria Josefa ANILLO LOPEZ

发明人： Antoni Josep SORIANO ASENSIO ,  Maria Josefa ANILLO LOPEZ

IPC分类号： B23Q11/10 ,  B24B23/02 ,  B23B45/00 ,  B24B55/02 ,  B24B57/02 ,  B24D13/04

摘要： The present invention refers to a device that is coupled to motorised tools whose consumable or implement rotates, preferably tools of the portable or swivelling type, supplying fluids either to the surface on which the consumable or implement acts, or to the consumable or implement itself so that it performs its function correctly, having a reservoir in which pressure is generated for its use and the device and the tool or consumable that is used being independent and interchangeable, and having conventional means of attachment that allow it to be used in conventional tools without having to adapt the tool, the consumable or implement.

公开(公告)号：US20230001561A1

公开(公告)日：2023-01-05

申请号：US17785363

申请日：2020-11-26

申请人： Robert Bosch GmbH

发明人： Juergen Wiker ,  Daniel Barth

IPC分类号： B25F5/00 ,  B24B23/02 ,  B24B55/02

摘要： A machine tool, in particular a hand-held machine tool, is disclosed. The machine tool includes at least one housing unit and at least one drive unit arranged within the housing unit. The machine tool further includes at least one separator unit which is provided to divide at least one fluid flow directed through the housing unit into at least two sub-flows, in particular according to a density of foreign bodies. One sub-flow of the sub-flows has a higher density of foreign bodies in comparison to another sub-flow of the sub-flows. The machine tool also includes at least one fluid cooling unit which is provided for cooling the drive unit by way of the at least two sub-flows.

公开(公告)号：US20220388117A1

公开(公告)日：2022-12-08

申请号：US17337298

申请日：2021-06-02

申请人： Revasum, Inc.

发明人： Robert Lewis Rhoades ,  Bryan Francis Sennett ,  Peter Sterling Patrick Vowell

IPC分类号： B24B55/02 ,  B24B53/017 ,  H01L21/3105 ,  H01L21/321

摘要： The present disclosure describes an apparatus for chemical-mechanical polishing of a semiconductor wafer. Some embodiments of the present disclosure include a pad, a slurry introduction mechanism, a wafer carrier (e.g., carrying a wafer being polished by the chemical-mechanical polishing system), a pad conditioner, and a pad cooling mechanism. The pad cooling mechanism of the present disclosure may apply a liquid or gas to the pad (e.g., to an upper surface of the pad) to control the temperature of the pad as the chemical-mechanical polishing process occurs. As a result, the temperature of the pad may be maintained at a safe and operable level for an extended period of time during chemical-mechanical polishing of a wafer.

公开(公告)号：US11440155B2

公开(公告)日：2022-09-13

申请号：US16305976

申请日：2017-06-01

申请人： HUSQVARNA AB

发明人： Andreas Fogelberg

IPC分类号： B24B7/18 ,  B24B41/047 ,  B24B23/02 ,  B24B55/02 ,  B24B55/05 ,  B24B55/10 ,  B24B55/12 ,  B24B55/04 ,  B24B7/22 ,  B24B55/06

摘要： The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine frame, a grinding head hood 2, which defines a space in which the grinding head 1 is rotatable, a hollow and resilient member 4, arranged in the space, and a pressurized fluid source, operatively connected to the hollow member 4 to supply said pressurized fluid, whereby the hollow member 4 is resiliently expandable upon supply of said fluid.

公开(公告)号：US20220219287A1

公开(公告)日：2022-07-14

申请号：US17609877

申请日：2020-04-17

申请人： TOKUYAMA CORPORATION

发明人： Junya SAKAI ,  Hiroyuki TASAKI

IPC分类号： B24B55/02 ,  B24B27/06 ,  B28D1/00 ,  B24B55/06 ,  B28D7/02 ,  B28D1/12

摘要： Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).