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公开(公告)号：US20210308905A1
公开(公告)日：2021-10-07
申请号：US17352412
申请日：2021-06-21
申请人： AKITA PREFECTURE
发明人： Takayuki KUSUMI , Yoichi AKAGAMI , Masami ECHIGOYA
IPC分类号： B28D5/04
摘要： The cutting method is a cutting method for cutting a workpiece using a wire tool, including: supplying a slurry containing abrasive grains having an electrical dielectric property to a region of the workpiece into which the wire tool cuts; generating an alternating electric field in a region between the wire tool and the workpiece; and running the wire tool along a direction in which the wire tool is drawn while the wire tool abuts on the workpiece.
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公开(公告)号：US20210252742A1
公开(公告)日：2021-08-19
申请号：US17165163
申请日：2021-02-02
申请人： DISCO CORPORATION
发明人： Naoko YAMAMOTO
IPC分类号： B28D5/00 , H01L21/683 , B28D5/04
摘要： A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.
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公开(公告)号：US20210184068A1
公开(公告)日：2021-06-17
申请号：US17039425
申请日：2020-09-30
发明人： Xiaolong Bai , Lizhu He , Xinyu Zhang , Peiyuan Wang , Jun Yang , Ziyang Ou , Jide Huang , Weize Shang , Hao Jin
IPC分类号： H01L31/18 , H01L31/042 , H01L31/0352 , B23K26/40 , B23K26/364 , B28D5/04
摘要： Provided is a method for manufacturing at least one solar cell, a method for manufacturing a monocrystalline silicon wafer and a photovoltaic module. The method for manufacturing a monocrystalline silicon wafer includes: providing a monocrystalline silicon rod; squaring the monocrystalline silicon rod to form a quasi-square silicon rod with quasi-square cross-section having an arc, a length of the arc being not less than 15 mm; slicing the quasi-square silicon rod to form at least one quasi-square silicon wafer having the arc. The method for manufacturing at least one solar cell includes: using the method described above to obtain a quasi-square silicon wafer having an arc; forming a first solar cell by processing the quasi-square silicon wafer; scribing the first solar cell to obtain a square-shaped sub-solar cell and at least one strip-shaped sub-solar cell. The above methods improve the utilization rate of the monocrystalline silicon rod and reduce production cost.
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公开(公告)号：US20210053251A1
公开(公告)日：2021-02-25
申请号：US17094524
申请日：2020-11-10
摘要： Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.
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公开(公告)号：US10882214B2
公开(公告)日：2021-01-05
申请号：US15902292
申请日：2018-02-22
申请人： SK SILTRON CO., LTD.
发明人： Woo Tae Kim , Young Seo Bae
摘要： According to the present invention, there is provided an ingot clamp including: a clamp body configured to have a holder mounting groove and a cavity; a fixing part configured to support and fix one side of an ingot holder inserted in the holder mounting groove; a movable fixing part disposed in the cavity and the holder mounting groove and configured to press and fix the other side of the ingot holder; a cover assembly coupled with the clamp body and configured to cover the cavity; and an air supply part coupled with the cover assembly and configured to supply air into the cavity.
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公开(公告)号：US10654193B2
公开(公告)日：2020-05-19
申请号：US16414238
申请日：2019-05-16
IPC分类号： B28D5/00 , B28D5/04 , B23D57/00 , B28D1/00 , G05B19/402 , G05B19/042
摘要： Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
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公开(公告)号：US10391673B2
公开(公告)日：2019-08-27
申请号：US15544234
申请日：2016-01-07
申请人： SK SILTRON CO., LTD.
发明人： Ji Won Jeon , Sang Min An
摘要： A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.
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公开(公告)号：US20190232404A1
公开(公告)日：2019-08-01
申请号：US16256636
申请日：2019-01-24
发明人： Tomohiro KANAZAWA , Naoki KOHYAMA , Yoshihiro IGUCHI , Yuuki SASAGAWA , Tetsuji SHIBATA , Toshiyuki TANI
CPC分类号： B23D61/185 , B23D57/0007 , B24B27/0633 , B28D5/045 , C22C38/12 , C25D15/02
摘要： A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 μm. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 μm.
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公开(公告)号：US10363685B2
公开(公告)日：2019-07-30
申请号：US15716048
申请日：2017-09-26
摘要： In an ingot cutting apparatus that cuts an ingot using a plurality of stretched wires, load sensors are provided on the new wire side and the old wire side of the ingot, and loads applied to the new wire side and the old wire side of the ingot are measured using the load sensors on the new wire side and the old wire side. When measuring the loads, for example, the center of moment about the X-axis that is the running direction of the wire is calculated. When the deviation from the center of gravity of the ingot is greater than or equal to a reference value, notification for replacement of the wire, control of the conveying speed of the wire, control of the pressing speed of the ingot, and so forth are performed through a control unit.
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公开(公告)号：US20190105750A1
公开(公告)日：2019-04-11
申请号：US16086554
申请日：2017-02-24
发明人： Yoshihiro USAMI
摘要： A method for manufacturing a wire saw apparatus including a wire supply reel; a long roller; wire guides; a wire winding reel; and a tension arm controlled to move within a control angle of ±A (°) set in advance and configured to apply tension to the wire, the method including the steps of: measuring a surface roughness Rmax of the long roller; measuring an angle a (°) of the tension arm at which the tension arm swings outside a range of the control angle set in advance while the wire is extending from the wire supply reel; calculating R1×2×A÷(|a|+A)=R2, where R1 (μm) represents the measured surface roughness Rmax of the long roller; and adjusting the surface roughness Rmax of the long roller to the calculated numerical value R2 or less. The method for manufacturing a wire saw apparatus can prevent the tension arm from greatly swinging outside the control range.
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