公开(公告)号：US12146352B2

公开(公告)日：2024-11-19

申请号：US16378750

申请日：2019-04-09

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： Zsolt Wilke ,  Elmar Fries ,  Anna Lisa Contini

IPC: B29C45/00 ,  B29C45/02 ,  E05B85/12 ,  E05B85/16 ,  B29K505/00 ,  B29L31/46 ,  B60R11/00 ,  B60R11/02

Abstract: An interior door handle arrangement of a vehicle, includes a housing and an actuating section which is arranged on the housing, wherein the housing and/or the actuating section have/has a carrier section made from a first plastic and a visible section made from another, second material which is connected to the carrier section in an integrally joined manner. A method for producing such an interior door handle arrangement is also provided.

公开(公告)号：US11992982B2

公开(公告)日：2024-05-28

申请号：US17602285

申请日：2020-02-27

Applicant: TOWA Corporation

Inventor： Yoshito Okunishi ,  Fuyuhiko Ogawa ,  Hideyuki Sakai

IPC: B29C45/02 ,  B29C33/12 ,  B29C45/14 ,  B29C45/36 ,  B29C45/40 ,  B29C45/56 ,  B29C45/64 ,  B29C45/80 ,  B29C45/37 ,  B29C45/66

CPC classification number: B29C45/02 ,  B29C33/12 ,  B29C45/021 ,  B29C45/14065 ,  B29C45/36 ,  B29C45/4005 ,  B29C45/56 ,  B29C45/64 ,  B29C45/80 ,  B29C45/14639 ,  B29C2045/14663 ,  B29C45/376 ,  B29C2045/569 ,  B29C2045/664

Abstract: Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.

公开(公告)号：US11969922B2

公开(公告)日：2024-04-30

申请号：US17602287

申请日：2020-02-27

Applicant: TOWA Corporation

Inventor： Yoshito Okunishi ,  Fuyuhiko Ogawa

IPC: B29C45/02 ,  B29C33/12 ,  B29C45/14 ,  B29C45/36 ,  B29C45/80 ,  B29C45/37 ,  B29C45/56

CPC classification number: B29C45/02 ,  B29C33/12 ,  B29C45/021 ,  B29C45/14065 ,  B29C45/36 ,  B29C45/80 ,  B29C45/14639 ,  B29C2045/14663 ,  B29C45/376 ,  B29C45/56 ,  B29C2045/569

Abstract: Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

公开(公告)号：US11926683B2

公开(公告)日：2024-03-12

申请号：US16626812

申请日：2018-06-29

Applicant: IDEMITSU KOSAN CO., LTD.

Inventor： Yutaka Obata ,  Haruhiko Mori

IPC: C08F20/18 ,  B29C45/00 ,  B29C45/02 ,  B29K33/04 ,  B29K105/00 ,  B29K507/04 ,  B29K509/08 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08K7/18 ,  C08K9/06

CPC classification number: C08F20/18 ,  B29C45/0001 ,  B29C45/02 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08K7/18 ,  C08K9/06 ,  B29K2033/04 ,  B29K2105/0002 ,  B29K2105/0032 ,  B29K2507/04 ,  B29K2509/08 ,  C08K2003/2241 ,  C08K2201/003 ,  C08K2201/011 ,  C08K2201/014

Abstract: The present invention provides a thermosetting material, which contains the following components (A) to (C) and which, when measured with a rotational viscometer at a constant shear rate (JIS K7117-2:1999), exhibits a viscosity at 25° C. and 10 s−1 of 5 Pa·s or more and 200 Pa·s or less and, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity at 25° C. and a shear rate of 100 s−1 of 0.3 Pa·s or more and 50 Pa·s or less. (A): a (meth) acrylate compound in which a substituted or unsubstituted alicyclic hydrocarbon group having 6 or more carbon atoms is ester-bonded, and which, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity of 5 to 300 mPa·s as a viscosity measured at 25° C. and 10 to 100 s−1; (B): spherical silica; and (C): a black pigment.

公开(公告)号：US20240051199A1

公开(公告)日：2024-02-15

申请号：US18270479

申请日：2021-11-15

Applicant: TOWA CORPORATION

Inventor： Fuyuhiko OGAWA ,  Yoshito OKUNISHI

IPC: B29C45/02 ,  B29C45/64 ,  B29C45/34 ,  B29C45/76 ,  B29C45/77 ,  B29C45/80

CPC classification number: B29C45/02 ,  B29C45/64 ,  B29C45/34 ,  B29C45/7613 ,  B29C45/7653 ,  B29C45/77 ,  B29C45/80 ,  B29C2945/76498 ,  B29C2945/76678 ,  B29C2945/76869 ,  B29C2945/76545 ,  B29C2945/76598 ,  B29C2945/76568 ,  B29C2945/76702 ,  B29C2945/76742

Abstract: The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

公开(公告)号：US20230382027A1

公开(公告)日：2023-11-30

申请号：US18034268

申请日：2021-09-29

Applicant: TOWA CORPORATION

Inventor： Makoto TSUKIYAMA ,  Atsushi MORIKAMI

IPC: B29C45/02 ,  B29C45/14 ,  B29C45/76 ,  B29C45/80

CPC classification number: B29C45/02 ,  B29C45/14639 ,  B29C45/7653 ,  B29C45/80

Abstract: A resin molding apparatus includes: a mold die that is configured to hold an object to be molded, the object including a substrate and a chip on the substrate, and that has a cavity configured to receive a resin material through a gate; a mold clamp mechanism configured to clamp the mold die; and a control section configured to control how the mold die and the mold clamp mechanism are operated, the mold die including: a movable block configured to narrow at least a portion of an internal flow path of the cavity in which internal flow path the chip is not disposed; and a driving mechanism configured to drive the movable block with use of a fluid, the control section being configured to change a driving force of the driving mechanism during resin-molding of the object.

公开(公告)号：US11605548B2

公开(公告)日：2023-03-14

申请号：US17396053

申请日：2021-08-06

Applicant: Kioxia Corporation

Inventor： Takeori Maeda ,  Ryoji Matsushima ,  Makoto Kawaguchi ,  Masaaki Wakui

IPC: H01L21/67 ,  B29C45/03 ,  B29C45/02 ,  B29C45/14 ,  B29C45/77 ,  B29C45/78 ,  B29C45/80 ,  B29C45/34 ,  H01L21/687 ,  B29L31/34

Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

公开(公告)号：US11374471B2

公开(公告)日：2022-06-28

申请号：US16197218

申请日：2018-11-20

Applicant: Mitsui High-tec, Inc.

Inventor： Shigeru Saruwatari ,  Masayuki Ono

IPC: H02K15/03 ,  B29C45/14 ,  H02K15/12 ,  B29B13/02 ,  B29C45/02 ,  B29B13/06 ,  H02K1/17 ,  H02K1/276 ,  B29K63/00 ,  B29K105/00 ,  B29K101/10

Abstract: A method of manufacturing an core product includes heating the resin pellet at a temperature higher than 25° C. for 24 hours or longer, the resin pellet being formed of a thermosetting resin composition including epoxy resin, a curing agent, accelerator, and a release agent. The method includes holding a core body having a resin formation region, which is a region in which a resin is to be formed by injection of a melted resin, between a pair of holding members, and disposing the heated resin pellet in a resin pot formed in at least one of the pair of holding members. Additionally, the method includes melting the resin pellet in the resin pot and injecting the melted resin into the resin formation region through a resin channel extending from the resin pot in communication with the resin formation region, and curing the melted resin injected into the resin formation region.

公开(公告)号：US10939565B2

公开(公告)日：2021-03-02

申请号：US16468952

申请日：2017-10-20

Applicant: Robert Bosch GmbH

Inventor： Michael Hoefer

IPC: H05K5/00 ,  B29C45/02 ,  B29C45/14 ,  B60R16/023 ,  F16H61/02 ,  H01R13/405 ,  H01R24/62 ,  H01R43/24 ,  H05K1/02 ,  H05K1/11 ,  B29K101/10 ,  B29L31/34

Abstract: A transmission control device, in particular for a motor vehicle, includes a circuit board element, and an electrical-connector housing. The circuit board element has electronic components. The electrical-connector housing is configured to receive an electrical connector, and to electrically connect the electrical connector to the circuit board element. The electrical-connector housing substantially consists of a thermoset material, and partially encloses the circuit board element via direct contact in an integrally bonded fashion.

公开(公告)号：US20200247019A1

公开(公告)日：2020-08-06

申请号：US16857215

申请日：2020-04-24

Applicant: IDEMITSU KOSAN CO., LTD.

Inventor： Yutaka OBATA ,  Takeshi IWASAKI ,  Daichi OGAWA ,  Haruhiko MORI

IPC: B29C39/26 ,  H01L33/60 ,  C08L33/04 ,  B29C45/02 ,  C08F20/10 ,  C08F292/00 ,  C08F2/44 ,  B29C45/14 ,  B29C45/54 ,  C08K3/36 ,  C08K3/013 ,  B29C39/00 ,  C08K9/06 ,  H01L33/48 ,  H01L33/62

Abstract: A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s−1 of 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 s−1 of 0.3 Pa·s or more and 100 Pa·s or less: