-
公开(公告)号：US10207441B2
公开(公告)日：2019-02-19
申请号：US15512250
申请日：2015-11-12
申请人： DENSO CORPORATION
发明人： Atsushi Kawamura , Masato Ichikawa , Masami Gotoh , Tsuyoshi Arai
IPC分类号： B29C45/26 , B29C33/30 , B29C45/40 , B30B11/00 , B29C45/17 , B29C45/84 , B29C45/38 , B29C45/67
摘要： A molding die has a lower holder, an intermediate holder, an upper holder, a lock member, an upper link bar, a lower link bar, a restriction member, and a drive part. A movement of the lock member in a molding die opening direction or a molding die closing direction is restricted by the intermediate holder. The upper link bar has a first retaining groove in which the lock member fits when being located at a molding die closing position. The lower link bar has a second retaining groove in which the lock member fits and a release portion that enables the lock member to be released from the first retaining groove. The restriction member is movable between a restriction position that prevents the lock member from fitting in the second retaining groove and a free position that enables the lock member to fit in the second retaining groove.
-
公开(公告)号：US09636856B2
公开(公告)日：2017-05-02
申请号：US14278304
申请日：2014-05-15
发明人： Masamichi Momono , Nobuyuki Asanuma
CPC分类号： B29C45/0084 , B29C45/0053 , B29C45/14008 , B29C45/1418 , B29C45/38 , B29C45/382 , B29C45/42 , B29C2045/0077 , B29C2045/14286 , B29C2045/425 , B29K2701/12 , B65G15/00
摘要： A molding system 10 for manufacturing a molded article Q by integrally molding a sheet-shaped insert member S and a molding material R, the molding system comprising: a sheet supply part 20 configured to supply the insert member S; a sheet heating part 30 configured to heat the insert member S; a molding apparatus 100 configured to form the molded article Q by integrally molding the insert member S and the molding material R; an ejector 200 including a delivery position 222 and configured to transfer the insert member S between the sheet heating part 30 and the molding apparatus 100 and to eject and transfer the molded article Q from the molding apparatus; and a transfer robot configured to transfer the insert member S or the molded article Q between the sheet supply part 20 and the ejector.
-
公开(公告)号：US09524885B2
公开(公告)日：2016-12-20
申请号：US14446194
申请日：2014-07-29
发明人： Jimmy Chew Hwee Seng , Dingwei Xia
IPC分类号： H01L23/02 , H01L21/56 , B29C45/26 , B29C45/73 , B29C43/36 , B29C43/50 , H01L21/67 , B29C45/14 , B29C45/38 , B29C45/77 , H01L23/31 , B29L31/34
CPC分类号： H01L21/565 , B29C43/36 , B29C43/50 , B29C45/14655 , B29C45/2669 , B29C45/38 , B29C45/73 , B29C45/77 , B29C2045/7393 , B29L2031/3481 , H01L21/67126 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： Mold pieces (105 and 110) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer (118) include a primary cavity (117) and secondary cavities (120) into which excess mold compound from the primary cavity (117) flows. The secondary cavities (120) include a plunger (130) that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity (117) is forced to flow into the secondary cavities (120), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (118), which can then be removed, for example by grinding, in a relatively short time. Mold piece (105) further comprises a movable cavity bar (115) that can be moved away from mold piece (105) after molding and be cooled to detach the molded substrate that adheres to the cavity bar.
摘要翻译： 用于在凸起的半导体晶片（118）的互连侧上模制模制化合物层的模具（105和110）包括：主空腔（117）和次级空腔（120），多个模制化合物从初级腔 ）流。 辅助空腔（120）包括柱塞（130），其确定在模制期间等于模具化合物上期望的模具复合压力的预定背压。 由于主空腔（117）中的大多数多余的模制化合物被迫流入次级空腔（120），这有利地在半导体晶片（118）上留下相对薄的模制化合物层，然后可以将其去除， 例如通过研磨，在相对短的时间内。 模具（105）还包括可移动的空腔棒（115），其可以在模制之后移动离开模具（105）并被冷却以分离粘附到空腔棒的模制基底。
-
公开(公告)号：US09403283B2
公开(公告)日：2016-08-02
申请号：US12649352
申请日：2009-12-30
申请人： Chien-Feng Huang
发明人： Chien-Feng Huang
CPC分类号： B26D7/02 , B23D29/02 , B26D1/30 , B29C45/382 , B65H54/71 , Y10S425/051 , Y10T83/5733 , Y10T83/7487 , Y10T83/7513
摘要： A clamping and cutting device for frozen material includes a clamping member and a cutting component. The clamping member includes a clamper for clamping frozen materials and a driving component for driving the clamper to open or close. The cutting component is connected to the clamper and includes two driven arms cooperating with the clamper to open and close with the clamper.
摘要翻译： 用于冷冻材料的夹紧和切割装置包括夹紧构件和切割构件。 夹紧构件包括用于夹持冷冻材料的夹持器和用于驱动夹持器打开或关闭的驱动部件。 切割部件连接到夹持器，并且包括与夹持器配合以与夹持器打开和关闭的两个从动臂。
-
5.发明授权公开(公告)号：US09381684B2
公开(公告)日：2016-07-05
申请号：US14433033
申请日：2013-11-01
申请人： Nam Woon Yun , Min Seok Yun , Young Kyu No , Soo Hyun Ayu
发明人： Nam Woon Yun , Min Seok Yun , Young Kyu No , Soo Hyun Ayu
IPC分类号： H04M1/00 , B29C45/00 , B29C45/14 , B29C45/27 , A45C11/00 , B29C45/38 , B29L31/34 , B29K69/00
CPC分类号： B29C45/0025 , A45C11/00 , A45C2011/002 , A45C2200/10 , B29C45/14778 , B29C45/14836 , B29C45/2708 , B29C45/38 , B29C2045/0027 , B29C2045/2716 , B29K2069/00 , B29L2031/3437 , B29L2031/3481
摘要： The present invention relates to a mobile phone protection case film with a transparent part and a method for manufacturing the same, and specifically a method for manufacturing a protection case film inserted in a protection case cover hinged to one side of a protection case for receiving the back and the sides of a mobile phone so as to open or close the front of the mobile phone, includes the steps of: assembling a first die and a second die so as to form a cavity conforming with the shape of the protection case film; filling the cavity with a molten resin through a gate provided in one side of the cavity; compressing the molten resin filling the cavity by closely contacting the first die and the second die with each other; cooling or hardening the molten resin; removing the molded product by separating the first die and the second die; and cutting off the gate from the molded product. Thus, the method can considerably reduce the processing time and cost compared to the conventional processing method using a numerically controlled processing machine, and minimize the flaw rate by eliminating the errors according to the skill of a worker so as to improve the reliability of the product.
摘要翻译： 本发明涉及具有透明部分的移动电话保护壳薄膜及其制造方法，具体地说，涉及一种用于制造保护壳薄膜的方法，所述保护壳薄膜插入保护壳盖中，所述保护壳薄膜铰接到保护壳体的一侧以接收 移动电话的背面和侧面以打开或关闭移动电话的前部，包括以下步骤：组装第一模具和第二模具，以形成符合保护壳膜的形状的空腔; 通过设置在空腔一侧的浇口用熔融树脂填充空腔; 通过使第一模具和第二模具彼此紧密接触来压缩填充空腔的熔融树脂; 冷却或硬化熔融树脂; 通过分离第一模具和第二模具来去除模制产品; 并从模制产品中切断浇口。 因此，与使用数控处理机的常规处理方法相比，该方法可以显着减少处理时间和成本，并且通过根据工人的技能消除错误来最小化缺陷率，从而提高产品的可靠性 。
-
6.发明授权公开(公告)号：US09289929B2
公开(公告)日：2016-03-22
申请号：US14342782
申请日：2012-09-05
申请人： Olof Franksson , Robert Axelsson
发明人： Olof Franksson , Robert Axelsson
CPC分类号： B29C45/14467 , B29C45/1615 , B29C45/162 , B29C45/2606 , B29C45/2681 , B29C45/38 , B29C45/401
摘要： A molding arrangement serves for molding articles at each stroke of an injection-molding machine in which an injection mold is mounted. The articles are composed of components made of different materials in cavities formed in the injection mold, with each cavities corresponding to the shape of a component whereby identical cavities are separated by angular distances and placed at equal distances from a central axis of the injection mold and parts of the cavities are formed in a separately movable section of the movable mold half. The injection molding arrangement includes an operation part for displacing the section to-and-fro between closed and open positions of the injection mold and in open positions to turn the section about the central axis angles corresponding to the angles between the cavities to form whole cavities in the injection mold in closed position.
摘要翻译： 模制装置用于在其中安装注射模具的注射成型机的每一行程处模制制品。 制品由在注射模具中形成的空腔中由不同材料制成的部件组成，每个空腔对应于部件的形状，由此相同的腔被角距离分开并且与注射模具的中心轴线等距离地设置， 空腔的一部分形成在可动半模的可分开移动的部分中。 注射成型装置包括用于使注射模具的闭合位置和打开位置之间的部分移动并在打开位置中的操作部分，以使得围绕与腔之间的角度对应的中心轴线角度的部分形成整个空腔 在注塑模具处于关闭位置。
-
公开(公告)号：US20140339727A1
公开(公告)日：2014-11-20
申请号：US14278304
申请日：2014-05-15
发明人： Masamichi MOMONO , Nobuyuki ASANUMA
CPC分类号： B29C45/0084 , B29C45/0053 , B29C45/14008 , B29C45/1418 , B29C45/38 , B29C45/382 , B29C45/42 , B29C2045/0077 , B29C2045/14286 , B29C2045/425 , B29K2701/12 , B65G15/00
摘要： A molding system 10 for manufacturing a molded article Q by integrally molding a sheet-shaped insert member S and a molding material R, the molding system comprising: a sheet supply part 20 configured to supply the insert member S; a sheet heating part 30 configured to heat the insert member S; a molding apparatus 100 configured to form the molded article Q by integrally molding the insert member S and the molding material R; an ejector 200 including a delivery position 222 and configured to transfer the insert member S between the sheet heating part 30 and the molding apparatus 100 and to eject and transfer the molded article Q from the molding apparatus; and a transfer robot configured to transfer the insert member S or the molded article Q between the sheet supply part 20 and the ejector.
摘要翻译： 一种用于通过将片状插入件S和成型材料R整体成形来制造模制品Q的模制系统10，该模制系统包括：供给部件20，其构造成供给插入件S; 构造成加热插入构件S的片材加热部30; 通过将插入部件S和成型材料R一体成型而形成成形品Q的成型装置100; 喷射器200，其包括输送位置222并且构造成将片材加热部件30和成型设备100之间的插入件S传送并且将模制品Q从成型设备中排出和转移; 以及传送机器人，其构造成在片材供应部20和喷射器之间传送插入部件S或成形品Q。
-
公开(公告)号：US08888479B2
公开(公告)日：2014-11-18
申请号：US13741494
申请日：2013-01-15
发明人： Fang Jiang , Fa-Ye Li , Shun-Bai Wu , Peng Tan , Yang Bi
CPC分类号： B29C45/0053 , B26D1/08 , B26D7/2614 , B26D2007/2685 , B26F2001/4427 , B26F2210/06 , B29C45/38 , Y10T83/9457
摘要： A molding device includes a male die, a master die core, a male die core located between the male die and the master die core, and a cutting mechanism received in the male die core. The cutting mechanism includes a cutting seat and a cutter. The cutting seat defines a latch slot. The latch slot includes a narrow portion and a wide portion communicating with the narrow portion. The cutter includes a plate body received in the narrow portion and a latch shaft located on the plate body. The latch shaft is engaged in the wide portion. When a plastic product is formed and a sprue gate is around the mold cavity, the plate body is configured to cut the sprue gate, and the plate body is movable relative to the cutting seat around the latch shaft, to prevent the plate body from sticking.
摘要翻译： 成形装置包括阳模，母模芯，位于阳模和主模芯之间的阳芯，以及容纳在阳模芯中的切割机构。 切割机构包括切割座和切割器。 切割座定义一个闩锁槽。 闩锁槽包括狭窄部分和与窄部分连通的宽部分。 切割器包括容纳在狭窄部分中的板体和位于板体上的锁定轴。 闩锁轴接合在宽部分中。 当形成塑料制品并且浇口浇口位于模腔周围时，板体被构造成切割浇道浇口，并且板体相对于围绕锁定轴的切割座可移动，以防止板体粘附 。
-
公开(公告)号：US08851875B2
公开(公告)日：2014-10-07
申请号：US13240045
申请日：2011-09-22
申请人： Young-jin Hwang
发明人： Young-jin Hwang
CPC分类号： H01L21/565 , B29C45/0084 , B29C45/382 , B29C45/42 , B29C45/4225 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.
摘要翻译： 一种半导体封装成型系统，包括压制单元，用于将第一构件和第一树脂构件装载在第一按压装置上的装载装置和第二压力装置上的第二构件和第二树脂构件，卸载装置， 从第一按压装置卸下模制的第一模具和来自第二冲压装置的模制的第二模具，以及适于向压制单元，装载装置和卸载装置施加控制信号的控制单元。 压榨单元包括至少一个第一压榨装置，其适于将第一树脂构件压靠第一构件以模制第一模具;以及至少一个第二压制装置，其适于将第二树脂构件压靠在第二构件上， 模制第二个模具。
-
公开(公告)号：US20130134626A1
公开(公告)日：2013-05-30
申请号：US13308489
申请日：2011-11-30
申请人： Arthur P. Molinari
发明人： Arthur P. Molinari
CPC分类号： B29C45/38 , A63B37/0003 , A63B37/0004 , A63B37/0023 , A63B37/0074 , A63B45/00 , B29C45/14819 , B29L2031/546
摘要： An apparatus and method of creating a dimple on a golf ball comprises the positioning of a runner and gate in a mold in a location where it is desired to form a dimple. A polymer is injected into a mold cavity in the mold. A cutter is placed adjacent the mold. When the cutter is actuated to cut the polymer, a pocket is formed between the cutter and the polymer in the mold, thereby creating a dimple on the molded golf ball.
摘要翻译： 在高尔夫球上形成凹坑的装置和方法包括将浇道和浇口定位在模具中，希望形成凹坑的位置。 将聚合物注入模具中的模腔中。 刀具靠近模具放置。 当切割器被致动以切割聚合物时，在切割器和模具中的聚合物之间形成袋，从而在模制的高尔夫球上形成凹坑。
-
-
-
-
-
-
-
-
-
搜索结果
316 条记录 (耗时 0.021 秒)
