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    BONDING METHOD
    1.
    发明公开
    BONDING METHOD 审中-公开

    公开(公告)号：US20240342999A1

    公开(公告)日：2024-10-17

    申请号：US18684869

    申请日：2022-10-06

    申请人： NHK Spring Co., Ltd.

    发明人： Hidetoshi Mizuta ,  Atom Furuse ,  Kaoru Nagasawa ,  Fumitaka Arai

    IPC分类号： B29C65/14 ,  B29C65/00

    CPC分类号： B29C65/1416 ,  B29C66/742 ,  B60G2206/821

    摘要： A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.

    Connection element for adhering to a component surface and production method and securing method therefor
    3.
    发明授权
    Connection element for adhering to a component surface and production method and securing method therefor 有权

    公开(公告)号：US12103241B2

    公开(公告)日：2024-10-01

    申请号：US18138486

    申请日：2023-04-24

    申请人： BÖLLHOFF VERBINDUNGSTECHNIK GmbH

    发明人： Franz Drüke

    IPC分类号： B29C65/14 ,  B29C65/00 ,  B29C65/48

    CPC分类号： B29C65/1435 ,  B29C65/4845 ,  B29C66/474 ,  B29C66/73365 ,  B29C66/7392

    摘要： A connection element for adhering to a component surface of a first component, such that a second component can be secured to the first component by the connection element, including a base element having an adhesive side with an adhesive surface, and a mounting structure. The base element consists of a thermoplastic with a temperature of continued use of at least 130° C., which can be poorly irradiated or cannot be irradiated with light, and has at least one irradiation region. The base element can be irradiated with light in this region in such a way that light energy penetrates the base element. The irradiation region, in cross-section, has a smaller thickness and a transmittance at least 20% with a light wavelength between 320 and 500 nm. Alternatively, the irradiation region is formed by a through-opening.

    Method for producing shoe member, and molding die
    4.
    发明授权
    Method for producing shoe member, and molding die 有权

    公开(公告)号：US12023886B2

    公开(公告)日：2024-07-02

    申请号：US17281215

    申请日：2019-11-01

    申请人： ASICS CORPORATION

    发明人： Hajime Kumami ,  Koji Saito ,  Tatsuro Tanabe

    IPC分类号： B29D35/12 ,  B29C35/08 ,  B29C65/14 ,  B29D35/00 ,  B29L31/50

    CPC分类号： B29D35/128 ,  B29C35/0805 ,  B29C35/0894 ,  B29C65/14 ,  B29D35/0063 ,  B29D35/12 ,  B29D35/122 ,  B29C2035/0855 ,  B29L2031/504

    摘要： Provided is a method for producing a shoe member that includes a plurality of portions including a first portion and a second portion, each of which is constituted by one or more of members, the method including: a step of preparing a collective body including a first member that constitutes the first portion and a second member that constitutes the second portion and formed of a material different from that of the first member; and a step of irradiating electromagnetic wave toward the collective body, wherein the electromagnetic wave irradiation step including partly shielding the electromagnetic wave irradiated toward the second member by a shielding member capable of shielding electromagnetic wave, thereby reducing the electromagnetic wave irradiated onto the second member. Also provided is a molding die having a molding space corresponding to a shoe member and capable of being used for producing the shoe member by performing the method.