公开(公告)号：US12131921B2

公开(公告)日：2024-10-29

申请号：US18012944

申请日：2021-12-13

申请人： SHINKAWA LTD.

发明人： Kohei Seyama ,  Takahiro Shimizu

IPC分类号： B32B43/00 ,  B32B41/00 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67132 ,  B32B41/00 ,  B32B43/006 ,  H01L21/6838 ,  B32B2310/028 ,  B32B2310/0831 ,  B32B2457/14 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1944

摘要： A manufacturing apparatus (10) for manufacturing a semiconductor device includes: a wafer holding device (12), a PU device (14) having a PU head (40) that holds a target chip (100) in a non-contact manner, an energy irradiation device (16) irradiating energy to the target chip (100) from a back surface side of a dicing tape (130) to reduce an adhesive force of the dicing tape (130), and a controller (22). An adhesive layer of the dicing tape (130) is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip (100) by a small distance. The controller (22) controls a position of the PU head (40) so that the target chip (100) and the PU head (40) do not come into contact with each other even if the target chip (100) floats during a takeoff preparation period.

公开(公告)号：US20240352282A1

公开(公告)日：2024-10-24

申请号：US18574785

申请日：2022-06-29

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Yasuhiro Kono

IPC分类号： C09J7/20 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/36 ,  B32B43/00 ,  C09J5/00 ,  C09J7/40

CPC分类号： C09J7/201 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/36 ,  B32B43/006 ,  C09J5/00 ,  C09J7/401 ,  B32B2250/02 ,  B32B2250/244 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/558 ,  B32B2307/748 ,  C09J2301/124 ,  C09J2301/502 ,  C09J2400/24

摘要： To provide a double-sided adhesive tape with both high adhesive force and excellent ease of disassembly. A double-sided adhesive tape including a first adhesive layer; a separation layer containing a pigment, the separation layer being provided on the first adhesive layer; a film substrate directly laminated on the separation layer; and a second adhesive layer provided on the film substrate, wherein the pigment contains at least one selected from the group consisting of carbon black, titanium oxide, and phthalocyanine blue.

公开(公告)号：US20240349938A1

公开(公告)日：2024-10-24

申请号：US18688525

申请日：2022-09-02

申请人： SEB S.A.

发明人： Simon Allemand ,  Martin Rubio

IPC分类号： A47J36/02 ,  A47J27/00 ,  A47J37/10 ,  B32B7/06 ,  B32B15/08 ,  B32B27/20 ,  B32B27/28 ,  B32B37/06 ,  B32B37/10 ,  B32B37/18 ,  B32B38/10 ,  B32B43/00 ,  H05B3/28

CPC分类号： A47J36/025 ,  A47J27/002 ,  A47J27/004 ,  A47J37/10 ,  B32B7/06 ,  B32B15/08 ,  B32B27/20 ,  B32B27/283 ,  B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B38/10 ,  B32B43/006 ,  H05B3/28 ,  B32B2260/046 ,  B32B2307/7376 ,  B32B2307/748 ,  B32B2311/00 ,  B32B2371/00 ,  B32B2377/00 ,  B32B2509/00

摘要： The invention relates to a coated cooking element for a kitchen item or electrical cooking apparatus, comprising a metal substrate coated on one side with a peelable film, forming a cooking face, the peelable film comprising one or several layers of fluorinated polymer, a mechanical reinforcing layer and a hotmelt polymer layer arranged on the opposite side to the cooking face and having a melting point higher than 250° C. and lower than or equal to that of at least one of the other layers of the peelable film, the peelable film being assembled with the metal substrate, the hotmelt polymer layer being in contact with the face of the metal substrate. The invention also relates to a method for manufacturing such a coated cooking element and to a cooking article or an electrical cooking appliance having said coated cooking element.

公开(公告)号：US20240332396A1

公开(公告)日：2024-10-03

申请号：US18194199

申请日：2023-03-31

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chi-Ming CHEN ,  Chia-Shiung TSAI ,  Eugene CHEN ,  Chung-Yuan LI

IPC分类号： H01L29/66 ,  B32B43/00

CPC分类号： H01L29/66462 ,  B32B43/006 ,  B32B2310/0843

摘要： Some implementations described herein provide a temporary carrier structure and techniques to form a semiconductor device on the temporary carrier structure. The temporary carrier structure includes a core layer formed from a material having a first bandgap lattice constant. The temporary carrier structure further includes a debonding layer formed from another material having a second bandgap energy constant that is lesser relative to the first bandgap lattice constant. Techniques to form the semiconductor device including a forming substrate layer of the semiconductor device on the temporary carrier structure, where a material of the substrate layer and the material of the core layer have a same approximate coefficient of thermal expansion. The techniques further include providing energy (e.g., electromagnetic waves from a laser source) to the debonding layer to remove the core layer from the temporary carrier structure.

公开(公告)号：US20240326401A1

公开(公告)日：2024-10-03

申请号：US18244444

申请日：2023-09-11

申请人： SK SILTRON CO., LTD.

发明人： Se Ah OH ,  Je Hyung SEO ,  Kee Yun HAN

IPC分类号： B32B43/00

CPC分类号： B32B43/006

摘要： Disclosed is a device for separating wafers sheet by sheet from ingot blocks having a plurality of sliced wafers bonded thereto. The wafer separation device includes a water tank configured to receive the ingot blocks and a liquid, a heating member configured to heat the liquid, a barrier rib provided in the water tank to isolate the ingot blocks from each other, an arm configured to separate the wafers sheet by sheet from the ingot blocks, and a sensor configured to sense the barrier rib.

公开(公告)号：US20240301263A1

公开(公告)日：2024-09-12

申请号：US18659315

申请日：2024-05-09

申请人： NISSAN CHEMICAL CORPORATION

发明人： Kazuhiro SAWADA ,  Shunsuke MORIYA ,  Tetsuya SHINJO ,  Takuya FUKUDA

IPC分类号： C09J183/04 ,  B32B7/12 ,  B32B37/12 ,  B32B43/00 ,  C08G77/00 ,  C08G77/20 ,  C09J5/00 ,  H01L21/306 ,  H01L21/683

CPC分类号： C09J183/04 ,  B32B7/12 ,  B32B37/1207 ,  B32B43/006 ,  C08G77/20 ,  C09J5/00 ,  H01L21/6835 ,  B32B2457/14 ,  C08G77/70 ,  C08G77/80 ,  C09J2483/00 ,  H01L21/30625

摘要： An adhesive composition for use in debonding with infrared radiation, which composition can achieve debonding through irradiation with an infrared ray, the composition including a component (A) which is cured through hydrosilylation and a component (B) which is at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane, and a component containing a phenyl group-containing polyorganosiloxane.

公开(公告)号：US20240246331A1

公开(公告)日：2024-07-25

申请号：US18414643

申请日：2024-01-17

申请人： OptoTech AG

发明人： Andreas BUCHER ,  Olga ENGELMANN ,  Daniel MEIER ,  Claude VOLKEN ,  Dietmar SCHMIDT

IPC分类号： B32B43/00

CPC分类号： B32B43/006

摘要： A lens holder for accommodating an optical lens includes a carrier element that forms a receptacle area for the lens, a sealing structure or seal on the carrier element for fixing the lens in the receptacle area by negative pressure. A camera is arranged behind the receptacle area, using the image area of which a light distribution in the receptacle area is acquired. A protective film removal device is provided with the lens holder, wherein an action mechanism is designed to act mechanically, thermally, chemically, pneumatically, or hydraulically on a protective film on a lens. An evaluation device, linked to the camera, is designed to evaluate the light distribution in the receptacle area, which is dependent on the progress of the detachment of the protective film. A method and a use of the lens holder is also provided in terms of detaching a protective film from an optical lens.

公开(公告)号：US12039895B2

公开(公告)日：2024-07-16

申请号：US17875088

申请日：2022-07-27

申请人： S+P Samson GmbH

发明人： Karl Tochtermann ,  Roland Arndt

IPC分类号： B32B43/00 ,  B29C65/00 ,  B32B37/00 ,  C09J7/35 ,  G09F3/02

CPC分类号： G09F3/02 ,  B29C66/43 ,  B32B37/00 ,  C09J7/35 ,  B32B43/006 ,  C09J2203/334 ,  C09J2301/204 ,  G09F2003/0226 ,  G09F2003/023 ,  Y10T156/1195 ,  Y10T156/1994

摘要： A label including a base material with at least one adhesive region and a cover material, a label tape and a method for manufacturing labels are disclosed. The method includes providing a base material web and applying at least one adhesive to the base material web along at least one row by means of at least one applicator. The adhesive is applied to the base material web intermittently along the row so that the row comprises a plurality of individual adhesive regions spaced apart from one another by adhesive-free regions. The method also includes applying a cover material to at least some regions of the base material web so that a plurality of the applied adhesive regions are completely covered by the cover material, and at least partially separating the base material web and/or the cover material exclusively along adhesive-free regions by means of at least one separating device.

公开(公告)号：US20240217227A1

公开(公告)日：2024-07-04

申请号：US18558396

申请日：2022-05-10

申请人： SOLUTIA INC.

发明人： SUNGKYUN SOHN ,  GARY MATIS ,  NICHOLAS EDWARD KEEN ,  MICHAEL LEE STRICKLER

IPC分类号： B32B43/00 ,  B29B17/02

CPC分类号： B32B43/006 ,  B29B2017/0203 ,  B29B2017/0255 ,  B32B2309/02 ,  B32B2309/06 ,  B32B2329/04 ,  B32B2329/06

摘要： Processes are disclosed for separating a first layer from a remainder of a multilayer interlayer sheet, in which the multilayer sheet is heated, and thereafter the first layer is separated from the remainder of the multilayer interlayer sheet by pulling the first layer and the remainder of the multilayer interlayer sheet in different directions, in a defined orientation.

公开(公告)号：US12024594B2

公开(公告)日：2024-07-02

申请号：US17241174

申请日：2021-04-27

申请人： Brewer Science, Inc.

发明人： Luke M. Prenger ,  Qi Wu ,  Xiao Liu

IPC分类号： C08G73/00 ,  B32B7/12 ,  B32B17/06 ,  B32B43/00 ,  C09J179/00 ,  H01L21/683

CPC分类号： C08G73/00 ,  B32B7/12 ,  B32B17/06 ,  B32B43/006 ,  C09J179/00 ,  H01L21/6835 ,  B32B2307/412 ,  B32B2457/00 ,  H01L2221/68381

摘要： The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.