INTEGRATION OF SYSTEMS COMPRISING STANDARD ELECTRONIC COMPONENTS IN SATELLITES

    公开(公告)号:US20250002180A1

    公开(公告)日:2025-01-02

    申请号:US18690210

    申请日:2022-08-24

    Applicant: UNSEENLABS

    Abstract: A system includes a sealed enclosure comprising: an outer layer comprising a metallic foam; a radiation shielding layer; one or more heat transfer elements comprising one or more active heat transfer element disposed on one or more inner faces of the sealed enclosure, and configured or configurable to extract heat from the interior of the sealed enclosure; one or more electronic related components inside the sealed enclosure.

    HEAT FINS FOR HEAT DISSIPATION OF ROCKET COMPONENTS

    公开(公告)号:US20240300676A1

    公开(公告)日:2024-09-12

    申请号:US18669991

    申请日:2024-05-21

    CPC classification number: B64G1/58 B64G1/4021 F28F3/02

    Abstract: Rocket components having internal heat fins are described herein. The disclosed components have internal heat fins that mitigate buckling and uneven force application by adding thermal capacity to the component without adding component stiffness. This reduces a thermal force fight (i.e., tension versus compression between cold and hot areas, respectively), which inhibits the buckling loads on the propellant tank. The internal heats fins also provide for a reduced mass of the propellant tank wall relative to a propellant tank wall without internal heat fins. By reducing the thermal force fight, as discussed above, less material can be used which further allows for thinner welds to be used (i.e., less welding material).

    COOLING APPARATUS AND SPACE STRUCTURE
    10.
    发明公开

    公开(公告)号:US20230232588A1

    公开(公告)日:2023-07-20

    申请号:US18008685

    申请日:2020-08-04

    CPC classification number: H05K7/2039 B64G1/58 H05K7/20327

    Abstract: A cooling apparatus (100) cools a heat-generating instrument, such as an electronic instrument (2), installed in an installation apparatus. The cooling apparatus (100) includes a refrigerant flow path configured circularly by sequentially connecting a pump (1) that circulates a refrigerant in a liquid state, a cooler (3) that cools the heat-generating instrument with the refrigerant, and a radiator (5) that cools the refrigerant. The cooling apparatus (100) includes a discharge-side heat exchanger (7) provided in a flow path from the pump (1) to the cooler (3) in the refrigerant flow path, a suction-side heat exchanger (8) provided in a flow path from the radiator (5) to the pump (1) in the refrigerant flow path, and a Peltier device (9) that is provided between the discharge-side heat exchanger (7) and the suction-side heat exchanger (8), and transfers heat from the refrigerant flowing through the suction-side heat exchanger (8) to the refrigerant flowing through the discharge-side heat exchanger (7).

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