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公开(公告)号:US20240281955A1
公开(公告)日:2024-08-22
申请号:US18651957
申请日:2024-05-01
申请人: UNITY SEMICONDUCTOR
CPC分类号: G06T7/0004 , B81C99/003 , G01B11/22 , G06T7/521 , G06T7/60 , G06T2207/30148
摘要: A method for characterizing structures etched in a substrate, such as a wafer is disclosed. A bottom of the structure is embedded in the substrate, the substrate having a top side in which the structures are etched and a bottom side opposite to the top side. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.
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公开(公告)号:US20240270566A1
公开(公告)日:2024-08-15
申请号:US18022145
申请日:2022-03-31
发明人: Hao YAN , Yulin FENG , Yue LI , Chuncheng CHE
CPC分类号: B81B7/0006 , B81C99/00 , H05K1/0306 , H05K1/115 , H05K1/181 , B81B2201/014 , B81B2203/0118 , H05K2201/10053 , H05K2201/1006
摘要: An electronic device includes a substrate having a first surface and a second surface opposite to each other in a thickness direction of the substrate, wherein the substrate has first and second connection vias which penetrate through the substrate in the thickness direction of the substrate, and first and second conductive pillars are respectively in the first connection via and the second connection via; a switch on the first surface of the substrate and comprising first and second signal electrodes, wherein the first signal electrode is electrically coupled to a first terminal of the first conductive pillar, and the second signal electrode is electrically coupled to a first terminal of the second conductive pillar; and a filter on the second surface of the substrate.
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公开(公告)号:US12044962B2
公开(公告)日:2024-07-23
申请号:US16389085
申请日:2019-04-19
发明人: Satoshi Iwatani , Byung-Jin Choi , Makoto Mizuno
IPC分类号: B29C64/00 , B29C59/02 , B81C99/00 , G03F7/00 , H01L21/027
CPC分类号: G03F7/0002 , B29C59/02 , B81C99/009 , H01L21/0271 , B29C2059/023
摘要: A forming apparatus forming a composition on a substrate by using a mold, includes a supplier configured to supply a composition on the substrate, a plurality of processors including a first processor and a second processor, each of the plurality of processors being configured to bring the mold into contact with the composition supplied onto the substrate by the supplier, and a substrate conveyer configured to convey the substrate onto which the composition is supplied by the supplier to the first processor and then convey other substrate onto which the composition is supplied following the substrate to the second processor.
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4.
公开(公告)号:US20240228268A1
公开(公告)日:2024-07-11
申请号:US18410339
申请日:2024-01-11
发明人: Marco SARCLETTI , Uwe VOGLER
CPC分类号: B81C99/002 , B82Y40/00
摘要: Disclosed is a component for manufacturing micro- and/or nanostructured devices. The component has a base body and a surface which has micro- or nanostructures which form a substantially flat support surface, and between which trenches extend with a statistical distribution, to which a vacuum can be applied. Also disclosed is a method of manufacturing such a component.
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公开(公告)号:US11970681B2
公开(公告)日:2024-04-30
申请号:US17261466
申请日:2019-07-02
发明人: Daisuke Nomoto , Makoto Yamanaka
CPC分类号: C12M23/16 , B81B1/006 , B81C99/007 , C12M23/12 , C12M23/50 , B81B2201/05 , B81B2203/0338
摘要: To provide a plate with which, although the plate has a plurality of microchannels or a microchannel in which a plurality of branch channels are formed, when a sample flowing through a microchannel is observed by a microscope, it is possible to easily identify the position of the microchannel or the branch channel under observation without reducing the magnification of the microscope.
A plate having a microchannel therein includes an identification mark for identifying a position of the microchannel in a plane direction of the plate. When the microchannel includes a plurality of mutually independent microchannels, the identification mark is preferably formed for each microchannel. When the microchannel includes a source channel communicating with an injection port through which a sample is injected and a plurality of branch channels communicating with the source channel, the identification mark is preferably formed for each of the source channel and the branch channels.-
公开(公告)号:US20240004185A1
公开(公告)日:2024-01-04
申请号:US18341131
申请日:2023-06-26
申请人: Tomohiro TAIRA
发明人: Tomohiro TAIRA
CPC分类号: G02B26/0858 , B81C99/005 , B81B3/007 , B81B2201/042 , B81B2203/04
摘要: A movable device includes a movable portion and a drive structure configured to drive the movable portion. The movable device includes a support frame that surrounds the movable portion and supports the drive structure. The movable device includes electrodes electrically coupled to the drive structure. The movable device includes pseudo electrodes electrically isolated from the drive structure. The electrodes and the pseudo electrodes are provided on the support frame.
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公开(公告)号:US20240002220A1
公开(公告)日:2024-01-04
申请号:US17767904
申请日:2021-06-18
申请人: ZHEJIANG UNIVERSITY
发明人: Huan HU , Renwei MAO
CPC分类号: B81C99/0025 , G01Q80/00 , G01Q70/10 , G01Q70/14
摘要: The present disclosure discloses a self-packing three-arm thermal scanning probe for micro-nano manufacturing, comprising: a three-arm cantilever beam, metal contact pads, a nichrome heating electrode for printing, a nichrome heating electrode for transportation, and a polymer storage area. The present disclosure is manufactured by conventional micro-nano machining processes such as lithography and wet etching. In the present disclosure, a gradient density design of heating electrodes is used to generated continuous change of temperature gradients, thus realizing continuous transportation of a printing material from a storage area to a tip area, which realizes self-packing. The present disclosure can be seamlessly integrated with a CMOS process, and a printed material can be completely eliminated by means of commonly used acetone or oxygen plasma in the CMOS process, without contamination; furthermore, the micro-nano machining method of the present disclosure only requires an atomic force microscope whose cost is very low.
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公开(公告)号:US11820651B2
公开(公告)日:2023-11-21
申请号:US17345266
申请日:2021-06-11
申请人: Apple Inc.
发明人: Antoine Manens
IPC分类号: B81C99/00 , H01L25/075 , H05K13/04 , H05K13/08
CPC分类号: B81C99/002 , H01L25/0753 , H05K13/0413 , H05K13/0812
摘要: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a plurality of articulating transfer head assemblies coupled with a main translation track, where each articulating transfer head assembly is translatable along the main translation track between a donor substrate stage and a receiving substrate stage.
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公开(公告)号:US20230358781A1
公开(公告)日:2023-11-09
申请号:US18353305
申请日:2023-07-17
发明人: Guoxiu PAN , Renli SHI
IPC分类号: G01P21/00 , G05D1/00 , G01C25/00 , B81B7/00 , B81C99/00 , G01D3/036 , G01D18/00 , G05D23/19 , B64C39/02 , G01K13/00
CPC分类号: G01P21/00 , G05D1/0011 , G01C25/005 , B81B7/0087 , B81C99/003 , G01D3/036 , G01D18/008 , G05D23/19 , B64C39/024 , G01K13/00 , B81B2201/0242 , B64U10/13
摘要: A thermal regulation system includes an inertial measurement unit (IMU), one or more temperature adjusting devices in thermal communication with the IMU, and configured to adjust a temperature of the IMU from an initial temperature to a predetermined temperature, a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, and a shared substrate configured to bear a weight of the IMU and the one or more temperature adjusting devices. The shared substrate includes a metallic board.
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10.
公开(公告)号:US20230249965A1
公开(公告)日:2023-08-10
申请号:US17960120
申请日:2022-10-04
IPC分类号: B81C99/00 , B29C48/335 , B29C48/00
CPC分类号: B81C99/0015 , B29C48/338 , B29C48/022 , B81C2900/02
摘要: A curable sheath fluid and a core fluid are simultaneously introduced from a hydrodynamic nozzle to form a co-flowing extrusion, depositing at least a portion of the co-flowing extrusion on a material bed, and causing relative motion between the hydrodynamic nozzle and the material bed to form an extruded shape. The method comprises curing part or all of the external curable fluid. The method may introduce co-flowing extrusion to pressure to remove the internal core fluid from the external curable fluid, and may receive the core fluid into the fluid drain system. The extruded shapes may form a tube or plurality of tubes in a bundle or porous substrate. The ability to form concentric tubes and complex shapes provides a means forming high strength materials controlled release materials, and self-repair materials.
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