SYNTHESIS METHOD OF SILICON NITRIDE POWDER AND SINTERED BODY

    公开(公告)号:US20230339755A1

    公开(公告)日:2023-10-26

    申请号:US18080016

    申请日:2022-12-13

    发明人: In Chul CHO

    IPC分类号: C01B21/068

    摘要: A synthesis method of silicon nitride powder including preparing mixed powder having a particle size of 8 to 10 µm which includes 69 to 98 wt% of silicon powder, 1 to 30 wt% of α-phase silicon nitride powder, and 1 to 10 wt% of silicon dioxide powder; performing heat treatment on the mixed powder in a nitrogen gas atmosphere of 0.85 to 1 atm at a temperature of 1,450 to 1,750° C. for 5 to 20 hours; and cooling the mixed powder gradually to obtain silicon nitride powder,; and performing pressure sintering on a silicon nitride sintered body by filling the mixed powder into a mold and then keeping the mixed powder at a temperature of 1,750 to 1,850° C. for 2 to 6 hours while pressure of 150 to 300 kg/cm2 is applied thereto in a nitrogen gas atmosphere of 0.85 to 1 atm.

    METAL NITRIDE PRODUCTION METHOD
    5.
    发明申请

    公开(公告)号:US20230002229A1

    公开(公告)日:2023-01-05

    申请号:US17781489

    申请日:2020-12-02

    IPC分类号: C01B21/068

    摘要: The present invention relates to a method for producing a metal nitride, which is a method for synthesizing a metal nitride by igniting a raw material powder containing a metal powder housed in a reaction vessel (2) under a nitrogen atmosphere and propagating nitriding combustion heat of the metal powder to the whole of the housed raw material powder, characterized in that the raw material powder is housed in the reaction vessel (2) as a molded body (1B) having a void ratio of 40 to 70%. According to the present invention, it is possible to provide a method for producing a metal nitride capable of suppressing the occurrence of powder scattering and improving the recovery rate of the metal nitride.

    Composition for forming silica layer, silica layer, and electronic device

    公开(公告)号:US10804095B2

    公开(公告)日:2020-10-13

    申请号:US16163170

    申请日:2018-10-17

    摘要: A composition for forming a silica layer includes a silicon-containing polymer and a solvent, the composition having a SiO2 conversion rate of greater than about 0 and less than or equal to about 15. The SiO2 conversion rate is represented by: SiO2 conversion rate=(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 Å on a bare wafer, and allowing the coated wafer to stand for 24 hours under conditions of a temperature of 85° C. and a relative humidity of 85%)−(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 Å on a bare wafer, and allowing the coated wafer to stand for 2 hours under conditions of a temperature of 85° C. and a relative humidity of 85%).