公开(公告)号：US11780758B2

公开(公告)日：2023-10-10

申请号：US17343149

申请日：2021-06-09

申请人： CORNING INCORPORATED

发明人： Michael Thomas Gallagher ,  Suresh Thakordas Gulati ,  Timothy James Kiczenski ,  Robert Anthony Schaut ,  Natesan Venkataraman

IPC分类号： C03B17/02 ,  B32B17/06 ,  C03B23/20 ,  C03B29/02 ,  C03C21/00 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03B17/06

CPC分类号： C03B17/02 ,  B32B17/06 ,  C03B17/025 ,  C03B17/06 ,  C03B17/064 ,  C03B23/20 ,  C03B29/025 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C21/002 ,  B32B2307/30 ,  C03C2204/00 ,  Y10T428/24942 ,  Y10T428/2933

摘要： A method of making a glass sheet comprises laminating a high CTE core glass to a low CTE clad glass at high temperatures and allowing the laminate to cool creating compressive stress in the clad glass, and then ion exchanging the laminate to increase the compressive stress in the outer near surface regions of the clad glass. The core glass may include ions that exchange with ion in the clad glass to increase the compressive stress in inner surface regions of the clad glass adjacent to the clad glass/core glass interfaces. The glass laminate may be formed and laminated using a fusion forming and laminating process and fusion formable and ion exchangeable glass compositions.

公开(公告)号：US11771333B2

公开(公告)日：2023-10-03

申请号：US17313768

申请日：2021-05-06

申请人： Schott AG

发明人： Robert Hettler ,  Wee Kiat Chai ,  Rainer Graf ,  Helena Blümel

IPC分类号： A61B5/024 ,  A61B5/00 ,  C03C27/04 ,  G04G21/02 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18 ,  C03B23/20 ,  G04F13/02 ,  G02B6/42 ,  G04B39/02 ,  G02B6/08

CPC分类号： A61B5/02427 ,  A61B5/681 ,  A61B5/6847 ,  C03B23/20 ,  C03C27/044 ,  G02B6/4203 ,  G04B39/02 ,  G04F13/02 ,  G04G21/025 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02325 ,  H01L31/173 ,  H01L31/18 ,  A61B5/02416 ,  A61B2562/16 ,  G02B6/08

摘要： An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

公开(公告)号：US11745914B2

公开(公告)日：2023-09-05

申请号：US17668496

申请日：2022-02-10

申请人： NEXUS COMPANY INC.

发明人： Kenji Iwata ,  Toshihito Kashiwagi

IPC分类号： C03B23/09 ,  C03B23/20 ,  B65D13/02 ,  C03B23/207

CPC分类号： B65D13/02 ,  C03B23/207

摘要： In a fabricating method for a quartz vial having a body part for containing a substance, a bottom part closing a lower end of the body part, a cylindrical neck part disposed at an upper end of the body part, a cylindrical mouth part disposed above the neck part and having an outer diameter larger than that of the neck part, and a tapered portion connecting the mouth part and the neck part to each other, outer peripheral surfaces of the tapered portion and the neck part are formed by shaving, and the body part that is separately fabricated is welded to the neck part. Thus, quartz vials having a predetermined shape can be mass-fabricated.

公开(公告)号：US20230033251A1

公开(公告)日：2023-02-02

申请号：US17875578

申请日：2022-07-28

申请人： Fraunhofer-Gesellschaft zur Förderund der angewandten Forschung e.V. ,  Technische Universität Berlin

发明人： Philipp Wachholz ,  Norbert Arndt-Staufenbiel ,  Michael Töpper ,  Julian Schwietering

IPC分类号： C03B23/20 ,  C03C27/02 ,  C03C21/00 ,  F26B25/14

摘要： The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

公开(公告)号：US20220396515A1

公开(公告)日：2022-12-15

申请号：US17725714

申请日：2022-04-21

申请人： Samsung Electronics Co., Ltd.

发明人： Hosoon LEE ,  Wonsun LEE ,  Hyunsuk CHOI

IPC分类号： C03B11/00 ,  G06F1/16 ,  C03B23/20

摘要： According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.

公开(公告)号：US11485670B2

公开(公告)日：2022-11-01

申请号：US16673572

申请日：2019-11-04

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： C03B23/20 ,  H05K5/00 ,  A61N1/375 ,  H01L23/057 ,  H01L23/10 ,  B81C1/00

摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

公开(公告)号：US11365146B2

公开(公告)日：2022-06-21

申请号：US16376437

申请日：2019-04-05

申请人： DISCO CORPORATION

发明人： Yasushi Tanno

IPC分类号： C03B23/20 ,  C03C27/08 ,  C04B37/00 ,  C03B19/14 ,  C03C21/00

摘要： A method for joining an optical part made of quartz glass and a supporting part made of ceramic includes forming a metal layer on a surface of the supporting part by electroless plating, polishing the formed metal layer with a polishing pad to form a first smoothed face on the supporting part surface, polishing a surface of the optical part with the polishing pad to form a second smoothed face, cleaning the first smoothed face and the second smoothed face with ultrasonic cleaning water, forming a first metal film on the first smoothed face by vapor deposition and forming a second metal film on the second smoothed face by vapor deposition, and joining the first metal film and the second metal film to each other by interatomic joining by atomic diffusion between the faces at which the first metal film and the second metal film contact with each other.

公开(公告)号：US10604438B2

公开(公告)日：2020-03-31

申请号：US15743738

申请日：2015-07-15

申请人： HERAEUS QUARTZ AMERICA LLC

发明人： Matthew Donelon ,  Ashur J. Atanos ,  Arturo Sanchez ,  Kwang Chul Kim

IPC分类号： C03B23/207 ,  C03B19/06 ,  C03B20/00 ,  C03B23/20

摘要： Processes for fusing opaque fused quartz to clear fused quartz to form ultraviolet light transmission windows comprise surrounding a clear fused quartz ingot with an opaque fused quartz sleeve or opaque fused quartz particles, then heating the clear and opaque fused quartz together in a furnace, past the transition temperature of the opaque fused quartz, in order to join the two types of quartz together around the perimeter of the clear fused quartz ingot, but without substantial mixing beyond the interface.

公开(公告)号：US10322469B2

公开(公告)日：2019-06-18

申请号：US12994354

申请日：2009-06-03

申请人： Satoshi Matsumoto ,  Toshimitsu Wakuda

发明人： Satoshi Matsumoto ,  Toshimitsu Wakuda

IPC分类号： C03B23/20 ,  B23K26/324 ,  C03B23/24 ,  C03C27/06

摘要： A part of a glass layer 103 disposed along a region to be fused R is irradiated with a laser beam L1, so as to form the glass layer 103 with a laser-absorbing part 108a having a high laser absorptance. Then, while using the laser-absorbing part 108a as an irradiation initiation position, the region to be fused R is irradiated therealong with a laser beam L2, so as to melt the glass layer 103 and fix the glass layer 103 onto a glass member 104. Since the irradiation initiation position for the laser beam L2 has already become the laser-absorbing part 108a, a stable region where the melting of the glass layer 103 is stable can be formed immediately from the start point for initiating the irradiation with the second laser beam or nearby. The glass member 104 is fused to a glass member 105 through the glass layer 103 having such a stable region formed throughout the region to be fused R, so as to yield a glass fusing structure 101.

公开(公告)号：US20170338623A1

公开(公告)日：2017-11-23

申请号：US15660909

申请日：2017-07-26

申请人： Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.

发明人： Wolfgang REINERT ,  Hans Joachim QUENZER

IPC分类号： H01S5/022 ,  C03B23/02 ,  H01S5/028 ,  H01L23/00 ,  H01L33/58 ,  H01S5/40 ,  C03B23/20 ,  H01L33/00 ,  H01L33/56

CPC分类号： H01S5/02208 ,  C03B23/02 ,  C03B23/20 ,  H01L24/32 ,  H01L33/0095 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12043 ,  H01L2924/16152 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01S5/022 ,  H01S5/0222 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/028 ,  H01S5/40 ,  H01S5/4025 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.