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公开(公告)号:US20240318031A1
公开(公告)日:2024-09-26
申请号:US18259413
申请日:2021-12-29
发明人: Bin Cao , Qi Zheng , Michael Allen Mayo , Matthew Sam Luchansky , Tsukasa Mizuhara , Mitchell Ryan Stibbard
IPC分类号: C09D163/00 , C08G59/22 , C08G59/24 , C08G59/42 , C08G59/68
CPC分类号: C09D163/00 , C08G59/22 , C08G59/24 , C08G59/245 , C08G59/4261 , C08G59/686
摘要: A two-component waterborne coating system includes: a first component including an acid-functional polymer having an acid value of at least 100, based on total resin solids, dispersed in an aqueous medium; and a second component separate from the first component. The second component includes an epoxy-functional compound. A method of preparing a two-component waterborne coating system and two-component waterborne coating system kit are also described herein.
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公开(公告)号:US12091494B2
公开(公告)日:2024-09-17
申请号:US17745635
申请日:2022-05-16
申请人: SWIMC LLC
发明人: Anthony J. Tye
IPC分类号: C08G59/22 , C08G63/06 , C08G63/08 , C09D163/00 , C09D187/00
CPC分类号: C08G59/22 , C08G63/06 , C08G63/08 , C09D163/00 , C09D187/005
摘要: The present disclosure describes polymers and improved resin systems having flexibility, low water uptake, good adhesion, chemical resistance, and/or weatherability at extreme negative temperatures, such as temperatures down to about −40° C. or below and even temperatures down to about −60° C. The systems herein, in approaches, include a polymer or resin system for an epoxy component of an epoxy/amine system including an epoxy and/or acetoacetoxy functionalized flexible block copolymer that has a base hydrophobic polyol block or core, optional flexible monomeric blocks, and epoxy, acetoacetoxy, or both functional endcaps.
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公开(公告)号:US20240301129A1
公开(公告)日:2024-09-12
申请号:US18667102
申请日:2024-05-17
申请人: Henkel AG & Co. KGaA
发明人: Chunlin He , Timothy M. Champagne , Jay Chao , Ruud de Wit
CPC分类号: C08G59/245 , C08G59/226 , C08G59/3227 , C08G59/50 , C08K3/22 , C08K3/36 , H01L21/56 , H01L23/295 , H01L2924/3511
摘要: Thermosetting resin compositions in a flowable state useful for liquid compression molding (“LCM”) or stencil printing application are provided, reaction products of which become non-flowable after exposure to an elevated temperature and are then platable upon exposure to laser energy.
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公开(公告)号:US20240301127A1
公开(公告)日:2024-09-12
申请号:US18655887
申请日:2024-05-06
发明人: Joseph J. Zupancic , Tuoqi Li , Wenwen Li
IPC分类号: C08G59/22 , C08G63/91 , C09J163/00
CPC分类号: C08G59/22 , C08G63/916 , C09J163/00
摘要: An epoxy terminated polyester; an adhesive formulation including the epoxy terminated polyester and a curative composition; a laminating adhesive prepared from the above adhesive formulation; a process of making a laminate; a laminate made by the above process; and a flexible package prepared from the above laminate.
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5.
公开(公告)号:US20240254277A1
公开(公告)日:2024-08-01
申请号:US18620558
申请日:2024-03-28
发明人: Li ZHENG , Jiye LUO , Baizhao TAN
CPC分类号: C08G59/22 , C08G59/5046 , C25D3/38
摘要: This application discloses a polymer, a leveling agent, and preparation methods thereof, an electroplating solution, and an electroplating method, and pertains to the field of electroplating technologies. The polymer includes a plurality of repeating units, and the repeating unit includes: a binary epoxy compound residual group and a nitrogen-containing group. The binary epoxy compound residual group is a residue formed after an epoxy bond of a binary epoxy compound is ring-opened. The nitrogen-containing group includes: an alkyl group, and a dimethylamine group and a nitrogen-containing heterocyclic group that are respectively connected to two ends of the alkyl group, where the dimethylamine group is further connected to the binary epoxy compound residual group through a single bond. The polymer is conducive to obtaining a high-coplanarity plating at a high current density, and is especially suitable for being used as a leveling agent in an electroplating solution.
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公开(公告)号:US11993698B2
公开(公告)日:2024-05-28
申请号:US17513296
申请日:2021-10-28
IPC分类号: C08L63/00 , C04B20/10 , C04B26/14 , C04B26/16 , C04B26/18 , C04B26/32 , C08K9/04 , C08K9/10 , C09D7/80 , C09D163/00 , C04B103/00 , C08G59/22 , C08K9/08
CPC分类号: C08K9/04 , C04B20/1037 , C04B20/1051 , C04B26/14 , C04B26/16 , C04B26/18 , C04B26/32 , C09D7/80 , C09D163/00 , C04B2103/0075 , C08G59/226 , C08K9/08 , Y02W30/91 , C04B26/32 , C04B14/06 , C04B24/32 , C04B26/14 , C04B14/06 , C04B24/32 , C04B26/18 , C04B14/06 , C04B24/32 , C04B20/1037 , C04B14/06 , C04B20/1037 , C04B14/10 , C04B20/1037 , C04B14/368 , C04B20/1037 , C04B14/28 , C04B20/1037 , C04B18/08 , C04B26/16 , C04B14/06 , C04B24/32 , C04B40/0028 , C04B20/1051 , C04B18/08 , C04B20/1051 , C04B14/06
摘要: A low-dust composite building product is provided. The low-dust composite building product includes a binder system comprising one or more of a thermoset resin, a diluent, and a hardener; and a low-dust filler material comprising filler particles that have been pre-coated with a coating agent comprising one or more of the thermoset resin, the diluent, and the hardener from the binder system.
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公开(公告)号:US11975478B2
公开(公告)日:2024-05-07
申请号:US17235244
申请日:2021-04-20
发明人: Alexandre Richez
IPC分类号: B29C59/02 , B01L3/00 , B29C59/00 , C08G59/06 , C08G59/22 , C08G59/32 , C08G77/04 , G01N15/1434 , B29K63/00 , B29K83/00 , B82Y30/00 , B82Y35/00 , B82Y40/00
CPC分类号: B29C59/022 , B01L3/5027 , B29C59/005 , B29C59/026 , C08G59/063 , C08G59/22 , C08G59/32 , C08G77/045 , G01N15/1436 , B01L2300/0896 , B29K2063/00 , B29K2083/00 , B82Y30/00 , B82Y35/00 , B82Y40/00 , C08G2270/00
摘要: An example of a flow cell includes a substrate and a cured, patterned resin on the substrate. The cured, patterned resin has nano-depressions separated by interstitial regions. Each nano-depression has a largest opening dimension ranging from about 10 nm to about 1000 nm. The cured, patterned resin also includes an interpenetrating polymer network. The interpenetrating polymer network of the cured, patterned resin includes an epoxy-based polymer and a (meth)acryloyl-based polymer.
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公开(公告)号:US20240043607A1
公开(公告)日:2024-02-08
申请号:US18546707
申请日:2022-02-04
申请人: THREEBOND CO., LTD.
发明人: Jyunya IWASAWA
CPC分类号: C08G59/245 , C08K3/36 , C08K9/06 , C08G59/502 , C08G59/4064 , C08G59/223 , C08K2201/005 , C08K2201/006 , C08G2170/00 , C08G2190/00
摘要: The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability into a clearance of a narrow portion. An epoxy resin composition containing components (A) to (C) below:
the component (A): a compound having two or more epoxy groups;
the component (B): silica treated with phenylaminosilane; and
the component (C): a compound curing the component (A).-
公开(公告)号:US20230250274A1
公开(公告)日:2023-08-10
申请号:US18190798
申请日:2023-03-27
发明人: Marvin Michael Pollum, JR. , Joseph Peter Kriley , Masayuki Nakajima , Ljiljana Maksimovic , Brian Kirk Rearick , Adam B. Powell , David Joseph Fortman , Loubna Pagnotti
IPC分类号: C08L63/04 , C08K3/013 , C08G59/22 , C08G59/24 , C08G59/40 , C08G59/68 , C08L25/10 , C08L83/04 , C09D163/00 , C09J163/00 , B32B27/38
CPC分类号: C08L63/04 , C08K3/013 , C08G59/226 , C08G59/245 , C08G59/4021 , C08G59/68 , C08L25/10 , C08L83/04 , C09D163/00 , C09J163/00 , B32B27/38 , C08G2150/00 , C08G2170/00 , C08K2201/019 , C08L2205/18 , C08L2207/53 , C08L2312/06
摘要: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 μm measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.
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公开(公告)号:US11713374B2
公开(公告)日:2023-08-01
申请号:US17191024
申请日:2021-03-03
申请人: THE BOEING COMPANY
CPC分类号: C08G75/00
摘要: Aspects of the present disclosure relate to Schiff base oligomers and uses thereof. In at least one aspect, an oligomer is represented by Formula (I) wherein each instance of R4, R5, R6, R7, R8, R10, R11, R12, R13, and R14 is independently selected from the group consisting of hydrogen, alkyl, cycloalkyl, alkoxyl, aryloxyl, ether, and heterocyclyl. Each instance of R9 of Formula (I) is independently selected from the group consisting of alkyl, cycloalkyl, aryl, heterocyclyl, and ether. Each instance of R28 and R29 of Formula (I) is independently selected from the group consisting of hydrogen, alkyl, and aryl. Each instance of R33 of Formula (I) is independently selected from the group consisting of alkyl, cycloalkyl, aryl, heterocyclyl, and a bond. Each instance of R41 of Formula (I) is independently —NH— or a bond and each instance of R40 is independently —NH— or —NH—NH—.
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