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公开(公告)号:US11901331B2
公开(公告)日:2024-02-13
申请号:US17647275
申请日:2022-01-06
申请人: IMMUNOLIGHT, LLC
IPC分类号: C08K3/00 , H01L23/00 , B41J2/175 , C09J4/00 , A61B17/00 , A61L24/06 , B32B37/12 , B32B37/18 , B32B38/00 , C09J133/08 , C09K11/02 , C09K11/77 , H01L25/065 , H01L25/00 , B32B3/26 , B32B7/14 , B32B9/04 , C09J9/02 , C09J11/04 , C09J11/06 , H01L23/522
CPC分类号: H01L24/83 , A61B17/0057 , A61L24/06 , B32B3/266 , B32B7/14 , B32B9/04 , B32B37/1284 , B32B37/18 , B32B38/0008 , B41J2/17559 , C08K3/00 , C09J4/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J133/08 , C09K11/02 , C09K11/777 , C09K11/7769 , H01L23/5226 , H01L24/32 , H01L25/0657 , H01L25/50 , B32B2037/1253 , B32B2457/00 , B32B2457/08 , B32B2457/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83192 , H01L2224/83855 , H01L2224/92125 , H01L2225/06524 , H01L2225/06589 , H01L2924/07811 , H01L2924/1461 , H01L2924/15311 , Y10T428/2852 , H01L2224/48091 , H01L2924/00014 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2924/15311 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2924/15311 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2224/83192 , H01L2224/32225 , H01L2924/00 , H01L2924/07811 , H01L2924/00 , H01L2924/1461 , H01L2924/00 , H01L2224/92125 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2224/83192 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00
摘要: A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.
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公开(公告)号:US11728559B2
公开(公告)日:2023-08-15
申请号:US17178318
申请日:2021-02-18
申请人: Ticona LLC
发明人: Young Shin Kim
CPC分类号: H01Q1/241 , C08K3/04 , C08K3/30 , C08K7/06 , C08K7/14 , C08L67/04 , H01Q21/065 , C08K2003/3045
摘要: A polymer composition comprising a semiconductive material distributed within a polymer matrix is provided. The semiconductive material includes inorganic particles and an electrically conductive material, the inorganic particles having an average particle size of from about 0.1 to about 100 μm and an electrical conductivity about 500 μS/cm or less. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection under load of about 40° C. or more. The polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.
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公开(公告)号:US11578183B2
公开(公告)日:2023-02-14
申请号:US16463401
申请日:2017-11-27
申请人: SOMAR CORPORATION
发明人: Hirohisa Ishizaki , Akira Ochiai
IPC分类号: C08K3/22 , B29C35/02 , C08J3/09 , C08K9/04 , C08L101/00 , C08K5/00 , C08K3/00 , C08F2/46 , C08L15/00 , C08L63/00 , C08L67/04 , C08L75/04 , C08L83/04 , C08L63/08 , C07C255/54
摘要: A resin composition including: a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, a production method thereof, a resin composition molded body obtained by using the resin composition, and a production method thereof.
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公开(公告)号:US11535941B2
公开(公告)日:2022-12-27
申请号:US16751941
申请日:2020-01-24
发明人: Kentaro Shinoda , Takanori Saeki , Masakazu Mori , Jun Akedo
IPC分类号: C23C24/04 , C23C4/01 , C23C4/134 , C08K3/28 , C08K3/40 , C08K3/14 , C08K3/00 , C08K3/16 , B32B5/18 , C04B32/00 , C08K3/38 , B23B9/00 , B32B9/00 , C08K3/02 , C08K3/22
摘要: A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.
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公开(公告)号:US11433157B2
公开(公告)日:2022-09-06
申请号:US16446020
申请日:2019-06-19
申请人: Unicharm Corporation
IPC分类号: A61F13/514 , A61L15/62 , A61L15/18 , A61F13/15 , A61L15/22 , B32B27/18 , C08L101/00 , A61F13/53 , B01J20/24 , C08K3/00 , A61F13/511 , A61F13/534 , A61F13/496
摘要: An absorbent article may include a top sheet that is liquid-permeable, a back sheet that is liquid-impermeable, and an absorbent body situated between the top sheet and the back sheet in a thickness direction. At least one of the top sheet and the back sheet may include a synthetic resin sheet that includes a synthetic resin component and an oxidative decomposer comprising a mixture of a carboxylate and a rare earth compound. The synthetic resin sheet may contain the oxidative decomposer in a mass ratio such that a decomposition rate index (Di), as determined by formula (1), is 7.8 or less: Di=Br×Sa (1) where Br represents a mass ratio (g/g) of the oxidative decomposer with respect to the synthetic resin component, and Sa represents a specific surface area (cm2/g) of the synthetic resin sheet.
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公开(公告)号:US11427715B2
公开(公告)日:2022-08-30
申请号:US17205131
申请日:2021-03-18
发明人: Masako Kidokoro , Akira Nomoto
IPC分类号: C09D7/61 , C09D7/40 , B32B27/30 , C08K5/00 , C09D133/02 , C08K3/00 , C09D179/02 , C08L79/02 , C08J7/04 , C08J7/043 , C08J7/048 , B32B27/06 , B32B37/06 , C08J7/16 , C09D4/06 , C09D5/00 , C08K3/22
摘要: A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —COO— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.
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公开(公告)号:US20220181292A1
公开(公告)日:2022-06-09
申请号:US17647275
申请日:2022-01-06
申请人: IMMUNOLIGHT, LLC
IPC分类号: H01L23/00 , C08K3/00 , B41J2/175 , C09J4/00 , A61B17/00 , A61L24/06 , B32B37/12 , B32B37/18 , B32B38/00 , C09J133/08 , C09K11/02 , C09K11/77 , H01L25/065 , H01L25/00 , B32B3/26 , B32B7/14 , B32B9/04 , C09J9/02 , C09J11/04 , C09J11/06 , H01L23/522
摘要: A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.
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公开(公告)号:US11186675B2
公开(公告)日:2021-11-30
申请号:US15997224
申请日:2018-06-04
申请人: LSIS CO., LTD.
发明人: Sang-Eon Kim , Wook-Dong Cho , Heon-Seop Song , Tae-Yun Kang , Han-Gil Kim , Hyeon-Jeong Choi
IPC分类号: H01F27/32 , C08G59/22 , C08G59/42 , C08G59/68 , C08L63/00 , H01F27/34 , C09K5/14 , C08K5/00 , C08K5/3445 , C08K3/013 , C08K3/00 , C08K3/36
摘要: The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.
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公开(公告)号:US11161961B2
公开(公告)日:2021-11-02
申请号:US15493534
申请日:2017-04-21
摘要: The present invention provides a novel process that involves a reliable, robust, reproducible, and cost effective casting technique for a shutdown separator with, for example, a combination of poly(vinylidene fluoride-co-hexafluoropropylene) (PVdF-HFP) copolymer, polysulfonamide (PSA)/polyether imide (PEI), and CaCO3 powder, and for a non-shutdown separator with, for example, a combination of polysulfonamide (PSA)/polyether imide (PEI), filler/plasticizer, and metal oxide nanostructures (SiO2, TiO2, and Al2O3).
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公开(公告)号:US11149164B2
公开(公告)日:2021-10-19
申请号:US16341764
申请日:2017-09-26
发明人: Yuma Takeuchi , Hisato Takahashi , Yoshihito Inaba
IPC分类号: H01L23/22 , C09D163/00 , C09D7/61 , H01L21/56 , H01L23/29 , H01L23/31 , C08G59/50 , C08L63/00 , C08K3/00
摘要: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
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