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1.
公开(公告)号:US12129370B2
公开(公告)日:2024-10-29
申请号:US16477525
申请日:2018-01-12
发明人: Tao Xu , Zhi Sheng Fu , An Yang Wu
CPC分类号: C08L23/16 , B65G15/32 , C08K3/013 , C08K5/0016 , C08K5/0025 , C08L23/06 , C08L23/08
摘要: A rubber composition is disclosed and comprises a rubber matrix and essential components. The rubber matrix comprises, based on 100 parts by weight of the rubber matrix, A parts of a branched polyethylene, wherein 0
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公开(公告)号:US12122940B2
公开(公告)日:2024-10-22
申请号:US18555049
申请日:2022-03-30
发明人: Toshinori Hattori
IPC分类号: C09D5/18 , B27D1/04 , B27K3/20 , B27K3/32 , B32B21/04 , B32B21/13 , B32B21/14 , C09D1/00 , C09D5/14 , C09D5/16 , C09D7/40 , C09D7/61 , C09D191/06 , C08K3/013 , C08K3/015 , C08K3/36
CPC分类号: C09D5/18 , B27D1/04 , B27K3/20 , B27K3/32 , B32B21/042 , B32B21/13 , B32B21/14 , C09D1/00 , C09D5/14 , C09D5/16 , C09D5/185 , C09D7/61 , C09D7/69 , C09D7/70 , C09D191/06 , B27K2240/30 , B32B2255/08 , B32B2255/26 , B32B2255/28 , B32B2260/026 , B32B2260/046 , B32B2307/3065 , B32B2307/7376 , B32B2419/00 , C08K3/013 , C08K3/015 , C08K3/36
摘要: To provide a board material processing composition allowing for production of a board material laminate that is non-combustible and is excellent in adhesion performance. In order to solve this problem, a board material processing composition inhibiting combustion of a board material due to heating, comprises: a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; and binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component, wherein the carbonization promotion component includes boric acid, the chain inhibition component includes ammonium dihydrogen phosphate, and the binder particles include silica sand.
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公开(公告)号:US20240279457A1
公开(公告)日:2024-08-22
申请号:US18561614
申请日:2022-05-16
CPC分类号: C08L35/00 , C08K3/013 , C08K5/49 , C08L2203/16 , C08L2203/20
摘要: An aspect of the present invention relates to a resin composition containing a maleimide compound (A) having at least one selected from an alkyl group having 6 or more carbon atoms and an alkylene group having 6 or more carbon atoms, and a hydrocarbon-based compound (B) represented by the following Formula (1). In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group or an aliphatic cyclic group, and n represents an integer from 1 to 10.
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公开(公告)号:US12065524B2
公开(公告)日:2024-08-20
申请号:US17825122
申请日:2022-05-26
发明人: Byoung Tak Yim , Byung Jun Kim , Jeong Hwan Kim
IPC分类号: C08F210/18 , C08F4/52 , C08F4/68 , C08K3/013 , C08K3/04
CPC分类号: C08F210/18 , C08F4/52 , C08F4/68 , C08K3/013 , C08K3/04
摘要: Provided are an ethylene-propylene-diene monomer (EPDM) copolymer and a method of preparing the same. An EPDM copolymer which has more improved miscibility with inorganic fillers such as carbon black, may further facilitate dispersibility in mixing to further decrease the viscosity of a compound composition, and may provide a compound composition having excellent processability and mechanical properties. A method of preparing the same is also provided.
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公开(公告)号:US20240270899A1
公开(公告)日:2024-08-15
申请号:US18620420
申请日:2024-03-28
申请人: Ajinomoto Co., Inc.
发明人: Ichiro OGURA , Naoya SATO
IPC分类号: C08G63/189 , C08J5/18 , C08J5/24 , C08K3/013 , C08L67/03
CPC分类号: C08G63/189 , C08J5/18 , C08J5/24 , C08K3/013 , C08L67/03 , C08G2650/34 , C08L2203/206
摘要: Polyester resins containing a structural unit represented by the following general formula (1), and has an aromatic oxycarbonyl group at its terminal:
(in the formula,
XCs each independently represent a divalent organic group containing at least one aromatic ring,
XDs each independently represent a divalent organic group,
m is an average value of the number of repetitions, and is a number satisfying 0-
公开(公告)号:US12049560B2
公开(公告)日:2024-07-30
申请号:US18546107
申请日:2021-02-25
发明人: Jianfeng Gu , Xiaoxiang Wang , Shoujun Li
CPC分类号: C08L67/02 , C08K3/013 , C08K3/04 , C08K2201/001 , C08K2201/006 , C08L2201/08
摘要: The present application relates to a heat-resistant semi-conductive thermoplastic resin composition and shaped articles made therefrom. The thermoplastic resin composition comprises the following components: an aromatic polycarbonate, a polyalkylene terephthalate, a conductive carbon black and a reinforcement material. The shaped article made from the thermoplastic resin composition according to the present invention has a good combination of heat-resistance, semi-conductivity and dimensional stability.
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公开(公告)号:US20240247137A1
公开(公告)日:2024-07-25
申请号:US18628308
申请日:2024-04-05
发明人: Akira Yane , Kento Tsuda , Daisuke Tanaka
CPC分类号: C08L23/08 , C08K3/013 , C08K3/04 , C08L2203/20 , C08L2203/30
摘要: A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.
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8.
公开(公告)号:US20240208170A1
公开(公告)日:2024-06-27
申请号:US18601401
申请日:2024-03-11
发明人: Robert BARNED , Joshua ABELL , David BENDER
IPC分类号: B29D30/56 , B29D30/54 , C08J5/12 , C08K3/013 , C08K5/32 , C09J5/00 , C09J11/04 , C09J107/00 , C09J109/00
CPC分类号: B29D30/56 , B29D30/54 , C08J5/128 , C08K3/013 , C08K5/32 , C09J5/00 , C09J11/04 , C09J107/00 , C09J109/00 , B29D2030/544 , C08J2307/00 , C08J2309/00 , C08J2407/00 , C08J2409/00 , C09J2400/20 , C09J2407/00 , C09J2409/00
摘要: A process for retreading a tire, the process comprising the steps of providing a tire casing, providing a cured rubber component having first and second planar surfaces, providing a cushion gum, wherein the cushion gum contains a cure system comprising at least one stable aryl dinitrile oxide compound, applying the cushion gum to the tire casing, and forming a tire composite by applying the second planar surface of the cured rubber component to the cushion gum.
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公开(公告)号:US20240191084A1
公开(公告)日:2024-06-13
申请号:US18538018
申请日:2023-12-13
发明人: Michelle X. WANG , Ying CHANG , John E. HUGHES , Linzhu ZHANG , Steven L. MASIA
IPC分类号: C09D5/14 , C08K3/013 , C08K3/16 , C08K3/38 , C09D7/60 , C09D7/61 , C09D7/65 , C09D157/00 , C09D187/00 , E04B1/92
CPC分类号: C09D5/14 , C08K3/013 , C08K3/16 , C08K3/38 , C09D7/60 , C09D7/61 , C09D7/65 , C09D157/00 , C09D187/00 , E04B1/92 , C08K2003/387
摘要: Described herein is a coating comprising a binder, a pigment, and an antimicrobial composition which comprises particles selected from the group consisting of an aluminum silicate, a magnesium silicate, and a mixture thereof, and wherein the particles are modified with a quaternary ammonium salt. Further described is a building panel and building systems comprising a substrate and the coating composition applied thereto as well as methods of making and using the same.
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公开(公告)号:US20240166843A1
公开(公告)日:2024-05-23
申请号:US18549632
申请日:2022-04-04
CPC分类号: C08K3/046 , C08J3/201 , C08J5/042 , C08K3/013 , C08K3/041 , C08K3/40 , C09C1/48 , C08K2201/004 , C08K2201/01 , C08K2201/017
摘要: Described herein are a polyamide composition and a molded article comprising such polyamide composition, such as a mobile electronic device component. The polyamide composition comprises a polyamide polymer, an electrically conductive material comprising carbon fibers, carbon nano-tubes, or any combination thereof, and a glass filler having tri-dimensional structures characterized by an average length of at most 500 microns, said glass filler comprising at least 20 wt % glass flakes. The polyamide composition and the molded article exhibit near-isotropic mold shrinkage, low warpage and near-isotropic CLTE (Coefficient of Linear Thermal Expansion) and are electrostatic dissipative (ESD).
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