COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL

    公开(公告)号:US20230124486A1

    公开(公告)日:2023-04-20

    申请号:US17915535

    申请日:2021-03-30

    摘要: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids facing a wall surface of the solid portion. At least a portion of the inorganic particles is present on a wall surface. The plurality of voids are in contact with each other directly or via the inorganic particle. A heat transmission path stretching through the plurality of voids is formed of the inorganic particles in contact with each other.

    HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET

    公开(公告)号:US20230052370A1

    公开(公告)日:2023-02-16

    申请号:US17792835

    申请日:2021-03-18

    摘要: A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

    PRESSURE-SENSITIVE ADHESIVE COMPOUND WITH HIGH FILLER CONTENT

    公开(公告)号:US20220259464A1

    公开(公告)日:2022-08-18

    申请号:US17622989

    申请日:2020-06-29

    申请人: TESA SE

    摘要: Pressure-sensitive adhesives (PSAs) and tapes comprising said PSAs are provided. The PSAs comprise at least one poly(meth)acrylate and at least 40% by volume, based on a total volume of the pressure-sensitive adhesive, of a mixture of at least two fillers. The mixture of at least two fillers comprises at least one filler Fisph comprising or consisting of essentially spherical particles and the PSAs may conduct heat and/or provide electrical resistivity for electronic device or component applications.