PHOTOCURABLE COMPOSITION WITH HIGH SILICON CONTENT

    公开(公告)号:US20240199816A1

    公开(公告)日:2024-06-20

    申请号:US18062374

    申请日:2022-12-06

    发明人: Fen WAN Weijun Liu

    摘要: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1)




    with R1, R2: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R3, R4: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R5: C1-C5-alkyl, aryl, alkylaryl; R6: -R5-X, or X, or —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt % based on the total weight of the photocurable composition.