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1.发明授权公开(公告)号：US12128458B1
公开(公告)日：2024-10-29
申请号：US17960333
申请日：2022-10-05
IPC分类号： B08B7/00 , B08B6/00 , B08B7/04 , C09J9/02 , C09J11/04 , C09J133/02 , C09J143/04 , C09J165/00 , C09J179/02
CPC分类号： B08B7/0028 , B08B6/00 , B08B7/04 , C09J9/02 , C09J11/04 , C09J133/02 , C09J143/04 , C09J165/00 , C09J179/02 , C09J2400/10
摘要： A method for the removal of paint from a surface using a molecular adhesive comprising: applying an anionic coating to the paint to be removed; placing a pulling medium in contact with said anionic coating; said pulling medium comprising a substrate having a surface comprising a conductive polymer nanotube array; applying an electric potential across said pulling medium and said anionic coating to facilitate ionic bonding between said conductive polymer nanotube array and said anionic coating; and applying force to said pulling medium to pull away said pulling medium from said surface and thereby removing the paint which is bonded to said anionic coating which is bonded to said conductive polymer nanotube array.
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公开(公告)号：US20240352289A1
公开(公告)日：2024-10-24
申请号：US18756411
申请日：2024-06-27
发明人： Minoru MORITA , Shunya OHBUCHI
IPC分类号： C09J163/00 , C09J5/06 , C09J11/04 , C09J11/06 , H01L21/683
CPC分类号： C09J163/00 , C09J5/06 , C09J11/04 , C09J11/06 , H01L21/6836
摘要： A thermally conductive film adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), a polyhedral alumina filler (D), and a silane coupling agent (E), wherein a percentage of the polyhedral alumina filler (D) to a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C), the polyhedral alumina filler (D), and the silane coupling agent (E) is from 20 to 70 vol %, and wherein a blending multiple of the silane coupling agent is from 1.0 to 10;
a film adhesive using the composition;
a semiconductor package; and
a producing method thereof.-
3.发明公开公开(公告)号：US20240343947A1
公开(公告)日：2024-10-17
申请号：US18294142
申请日：2022-07-29
发明人： Tsukasa Mizuhara , Tyson Davis , Matthew Hunley
CPC分类号： C09J7/381 , C09J9/02 , C09J11/04 , C09J2301/302 , C09J2301/408 , C09J2423/00
摘要： Filled polyisobutene-based (PIB) pressure sensitive adhesives (PSA) comprising a polyisobutene resin and certain fillers, the fillers including silicas, aluminas, and/or acetylene (carbon) black (and optionally other fillers), as well as mixtures thereof. In certain embodiments the silica and alumina fillers are not surface-treated or otherwise modified, while in other embodiments, these fillers are surface-treated with a composition comprising an organosilane, an organosiloxane or an organosilazane, but remain unreacted in the finished PSA. The PIB PSAs may be used for a variety of applications, including as a barrier adhesive or as a component of a conductive, or non-conductive, tape.
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公开(公告)号：US20240327679A1
公开(公告)日：2024-10-03
申请号：US18194395
申请日：2023-03-31
申请人： Intel Corporation
发明人： Yuan MENG , Elizabeth NOFEN , Zhixin XIE , Dingying XU , Seyed Hadi ZANDAVI
CPC分类号： C09J7/38 , C09J11/04 , H05K13/0069 , C09J2301/408
摘要： This disclosure describes systems, methods, and devices related to switchable adhesion. A switchable adhesion system may comprise a shape memory polymer having a shaped surface to enhance adhesion using a trigger and a force applied to the shape memory polymer, wherein the trigger is applied to alter characteristics of the shape memory polymer, and wherein the force is applied to deform the shape memory polymer while the trigger is applied. The system may further comprise a media tray connected to the shape memory polymer.
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公开(公告)号：US12104098B2
公开(公告)日：2024-10-01
申请号：US17767889
申请日：2020-10-06
发明人： Frederic Gubbels , Gregory Chambard
CPC分类号： C09J183/06 , B29C73/163 , B60C19/002 , C08J5/128 , C08J9/36 , C09J5/00 , C09J11/04 , C09J11/06 , C08J2205/052 , C08J2321/00 , C08J2375/04 , C08J2483/06 , C09J2400/246 , C09J2421/008 , C09J2483/00
摘要： The present disclosure relates to self-sealing tires, a process for making said self-sealing tires and the use of a silicone composition cured via a condensation cure chemistry to form a self-sealing layer designed to function as both (i) a self-sealing tire puncture material, i.e., to seal puncture holes in the tread region of tires if/when punctured by a foreign body and (ii) as an adhesive for sound-absorbing foams adapted to reduce the noise generated by tires during travel.
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公开(公告)号：US12098307B2
公开(公告)日：2024-09-24
申请号：US17326919
申请日：2021-05-21
申请人： Henkel AG & Co. KGaA
IPC分类号： C09J175/06 , B32B7/12 , C08G18/36 , C08G18/42 , C08G18/58 , C08G18/72 , C08G18/76 , C09D175/04 , C09J11/04 , C09J11/06 , C09J175/04 , B32B27/32 , B32B27/36 , B32B27/40
CPC分类号： C09J175/06 , B32B7/12 , C08G18/4288 , C08G18/58 , C08G18/76 , C09D175/04 , C09J11/04 , C09J11/06 , C09J175/04 , B32B27/32 , B32B27/36 , B32B27/40 , B32B2307/546 , B32B2439/70 , C08G18/36 , C09J2423/046 , C09J2467/006 , C09J2491/00
摘要： The present invention refers to an adhesive composition for flexible lamination, especially for food packaging, which comprises a vegetable oil-based polyol and an NCO-terminated compound as well as a method of producing the vegetable oil-based polyol. Further, the present invention refers to the use of the inventive adhesive composition in flexible lamination and an article comprising the inventive adhesive composition.
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7.发明公开公开(公告)号：US20240309256A1
公开(公告)日：2024-09-19
申请号：US18669429
申请日：2024-05-20
发明人： JUN SONG , ZHI YU , YOU RAO , JIANJUN CHEN , HENGCHAO HUANG , MINGSONG MIAO
摘要： Provided are a polyurethane phase-change nanocapsule, a phase-change polyurethane pouring sealant and a preparation method therefor. The polyurethane phase-change nanocapsule is a nanocapsule formed by coating a phase-change material with an amphiphilic block copolymer. The oleophilic end of the amphiphilic block copolymer is a polyurethane chain segment, and the hydrophilic end is a methoxy polyethylene glycol chain segment. The polyurethane phase-change nanocapsule is added, such that the two-component phase-change polyurethane pouring sealant has a temperature control advantage, and has an excellent enthalpy value and heat-conducting properties while maintaining a low viscosity. In the field of electronic engineering, particularly in the field of electronics needing temperature control, the pouring sealant has an application value.
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公开(公告)号：US20240309252A1
公开(公告)日：2024-09-19
申请号：US18017423
申请日：2021-07-22
IPC分类号： C09J189/00 , B27N3/00 , B27N3/02 , B27N3/04 , C09J11/04 , C09J11/06 , C09J105/00 , C09J197/00
CPC分类号： C09J189/005 , B27N3/002 , B27N3/02 , B27N3/04 , C09J11/04 , C09J11/06 , C09J105/00 , C09J197/005
摘要： Easy to use and store. an environmentally friendly binding agent for cellulose-containing materials, without animal products, particularly suitable for use in the production of wood composites. and a composite material product obtained with the use of this binder is disclosed.
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公开(公告)号：US20240301252A1
公开(公告)日：2024-09-12
申请号：US18593521
申请日：2024-03-01
申请人： Rohm and Haas Electronic Materials Korea Ltd. , DuPont Toray Specialty Materials Kabushiki Kaisha
发明人： Hyunji Kang , Shunya TAKEUCHI , Mayumi MATSUZAKI , Yuri IGUCHI
CPC分类号： C09J11/04 , C08K3/22 , C08K3/36 , C09J183/04 , C08G77/14 , C08G77/20 , C08G77/70 , C08G77/80 , C08K2003/2241
摘要： A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in an amount of 1% by weight or more relative to the total weight of the composition, and at least one additive selected from (C1) organopolysiloxane having at least one organic functional group including at least one polyether structure at molecular side chain and/or molecular terminal; (C2) organosilane compound comprising at least one organic functional group selected from a C1-C6alkyl group, aryl group, and epoxy group, (C3) organopolysiloxane having at least one hydroxy group and at least one aryl group; (C4) organosiloxane oligomer having at least one epoxy group; (C5) unsaturated carboxylic acid or an ester thereof, and combinations thereof.
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公开(公告)号：US12084599B2
公开(公告)日：2024-09-10
申请号：US18381288
申请日：2023-10-18
申请人： RESONAC CORPORATION
发明人： Emi Miyazawa , Tsuyoshi Hayasaka , Takashi Kawamori , Shinichiro Sukata , Yoshihito Inaba , Keisuke Nishido
IPC分类号： C09J4/06 , B32B7/12 , B32B17/06 , B32B37/12 , B32B43/00 , C09J7/30 , C09J9/02 , C09J11/04 , H01L21/683
CPC分类号： C09J4/06 , B32B7/12 , B32B17/06 , B32B37/12 , B32B43/006 , C09J7/30 , C09J9/02 , C09J11/04 , H01L21/6835 , B32B2037/1253 , B32B2310/0825 , C09J2203/326 , C09J2203/37 , C09J2409/00 , C09J2433/00 , H01L2221/68381
摘要： Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.
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