公开(公告)号：US20250034441A1

公开(公告)日：2025-01-30

申请号：US18783097

申请日：2024-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki OGAWA ,  Yoshitaka MURAKAMI

IPC: C09J163/00 ,  C08G59/24 ,  C08K3/013 ,  C08K5/54 ,  C09J11/04 ,  C09J11/06 ,  H01F27/26

Abstract: An adhesive includes a bisphenol F resin, a curing agent for the bisphenol F resin, and magnetic powder. The volume ratio of the magnetic powder to the adhesive is 35 vol % or lower. The number average molecular weight of the bisphenol F resin is 312 to 360 g/mol.

公开(公告)号：US12209204B2

公开(公告)日：2025-01-28

申请号：US17509222

申请日：2021-10-25

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Satoshi Kamiwaki ,  Sumiaki Yamasaki ,  Takeshi Iwanaga ,  Kiyohiro Yamanaka ,  Satoshi Inoue

IPC: C09J125/08 ,  C08K3/36 ,  C09J5/06 ,  C09J7/38 ,  C09J133/08 ,  B42D15/04 ,  C09J11/04

Abstract: A method for producing pressure-responsive particles includes: adding an aggregating agent to a dispersion containing composite resin particles containing a styrene-based resin including a styrene compound and a vinyl monomer other than the styrene compound as polymer components and a (meth)acrylic acid ester-based resin including a (meth)acrylic acid ester compound as a polymer component to aggregate the composite resin particles so as to form aggregated particles A; forming a shell by adding an aggregating agent and styrene-based resin particles containing a styrene compound and a vinyl monomer other than the styrene compound as polymer components to a dispersion containing the aggregated particles A to aggregate the styrene-based resin particles so as to form aggregated particles B; and heating and fusing the aggregated particles B to form pressure-responsive particles.

公开(公告)号：US12186987B2

公开(公告)日：2025-01-07

申请号：US17416252

申请日：2019-12-17

Applicant: TESA SE

Inventor： Frank Virus ,  Michael Schwertfeger ,  Manuel Bendeich

IPC: B29C64/314 ,  B29K105/00 ,  B33Y40/10 ,  B33Y70/00 ,  C09J7/10 ,  C09J11/04 ,  C23C4/11 ,  C23C4/134

Abstract: Methods for producing an adhesive filament from a pressure-sensitive adhesive, devices for carrying out the methods, adhesive filaments, adhesive rollers, and printed elements are provided. The methods comprise providing the pressure-sensitive adhesive; forming the pressure-sensitive adhesive to a material strand and treating at least a partial region of the surface of the material strand with a plasma stream.

公开(公告)号：US20250002761A1

公开(公告)日：2025-01-02

申请号：US18709512

申请日：2022-11-11

Applicant: XUZHOU H-GURAD BIOTECHNOLOGY CO., LTD

Inventor： Wen Hsien SUN ,  Yu QIU ,  Hao XIONG ,  Ping LI ,  Zhenjing KANG

IPC: C09J9/02 ,  C08K7/06 ,  C08K7/18 ,  C08K9/02 ,  C09J5/06 ,  C09J11/04 ,  C09J175/04 ,  H01B1/22

Abstract: In the present disclosure, a low-silver-content high-performance conductive paste and a preparation method therefor are provided. The conductive paste comprises the following raw material components in percentage by weight: 8-12.32% of silver nanowires, and 22-4.55% of at least one of spherical silver powder and flaky silver powder, with the balance being a cross-linking agent; the length-to-diameter ratio of the silver nanowires is 10-500. The method comprises the following steps: 1) taking silver nanowires and spherical/flaky silver powder, and adding same to the cross-linking agent; 2) performing ultrasonic oscillation or stirring treatment for 0.5-1 h to prepare uniformly dispersed silver nanowire conductive ink; 3) attaching the conductive ink to a substrate to form a conductive metal layer; 4) placing the conductive metal layer in a drying oven for drying, and finally curing and forming the conductive metal layer to obtain a high-performance conductive material.

公开(公告)号：US12173207B2

公开(公告)日：2024-12-24

申请号：US16855605

申请日：2020-04-22

Applicant: DU PONT CHINA LIMITED

Inventor： Yumi Matsuura

IPC: B23K35/02 ,  C08L1/28 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J101/28 ,  H01L23/00 ,  C08K3/08

Abstract: A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

公开(公告)号：US12172962B2

公开(公告)日：2024-12-24

申请号：US17598936

申请日：2020-03-17

Applicant: IGM (ANQING) HIGH TECHNOLOGY DEVELOPMENT CO., LTD.

Inventor： Wenchao Zhao ,  Jiaqi Li ,  Zhongli Ma ,  Chenlong Wang ,  Yonglin Wang

IPC: C07D209/00 ,  C07D209/86 ,  C08F220/18 ,  C08F222/02 ,  C09D4/06 ,  C09D7/61 ,  C09D7/63 ,  C09D11/037 ,  C09D11/101 ,  C09D11/107 ,  C09D135/02 ,  C09J4/06 ,  C09J11/04 ,  C09J11/06 ,  C09J135/02 ,  G02B5/20 ,  G03F7/00 ,  G03F7/029

Abstract: Provided in the present invention is a novel diaroyl carbazole compound, used together with a carbazolyl oxime ester photoinitiator to show a significant synergistic initiation effect in a photoresist composition; the best sensitising effect is shown when the molar ratio of the diaroyl carbazole compound and the carbazolyl oxime ester photoinitiator is 0.1-1.4.

公开(公告)号：US20240409792A1

公开(公告)日：2024-12-12

申请号：US18726365

申请日：2023-01-04

Applicant: Tesla, Inc.

Inventor： Nathaniel Hall-Snyder ,  Sarah Spaugh ,  John Malcovitch

IPC: C09J9/02 ,  B32B7/12 ,  B32B15/01 ,  C08K3/08 ,  C09J5/06 ,  C09J11/04 ,  C09J183/04

Abstract: Provided herein is a. curable electrical joint composition for metallic electrical conductors, and methods of using the same. The curable electrical joint composition includes at least one electrically conductive metal and at least one curable polymer.

公开(公告)号：US20240409781A1

公开(公告)日：2024-12-12

申请号：US18698078

申请日：2022-10-11

Applicant: Nanyang Technological University

Inventor： Matthew Wei Ming TAN ,  Pooi See LEE

IPC: C09J7/35 ,  C09J5/06 ,  C09J11/04

Abstract: Disclosed herein is a photothermal adhesive that has a crosslinked polymeric matrix and a photothermal agent dispersed within the crosslinked polymeric matrix, where the crosslinked polymeric matrix is formed by the random block copolymerisation of: a urethane acrylate polymeric material that has two or more acrylate end groups; and a polymeric or oligomeric crosslinker material having two or more acrylate end groups. Also disclosed herein is a method of manufacturing the photothermal adhesive, uses thereof, and methods of use thereof.

公开(公告)号：US12158654B2

公开(公告)日：2024-12-03

申请号：US17921204

申请日：2021-10-08

Applicant: LG Chem, Ltd.

Inventor： Ha-Song Yun ,  Na-Hee Kim ,  Yoon-Kyung Kwon

IPC: G02F1/1335 ,  C09J7/10 ,  C09J7/38 ,  C09J11/04 ,  G02F1/1347

Abstract: A polarizing plate and a display device including the same is disclosed herein. In some embodiments, a polarizing plate includes a polarizer which allows only light polarized in a specific direction to pass through; and a haze adhesive film disposed on a one surface of the polarizer and having a haze of 49% to 65%, wherein the haze adhesive film is configured to adhere to the display device, and reduce moire occurring in the dual cell structure of the display device.

公开(公告)号：US20240392175A1

公开(公告)日：2024-11-28

申请号：US18696504

申请日：2022-08-17

Applicant: WACKER CHEMIE AG

Inventor： Nazuna Terashita ,  Yukihiko Asakawa ,  Takashi Nakamura ,  Kazuya Sakai ,  Yusuke Suzuki ,  Taishi Uchida

IPC: C09J183/06 ,  C09J11/04

Abstract: A two-component thermally conductive silicone composition long with methods of producing and uses for the same. Where the two-component thermally conductive silicone includes a first liquid containing (A) a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, (D) an addition catalyst, (E) a thermally conductive filler, and (F) a condensation catalyst. Where the two-component thermally conductive silicone includes a second liquid containing (A) the diorganopolysiloxane having an alkenyl group bonded to a silicon atom, (B) a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, (C) at least one selected from (C-1) an organosilicon compound having two or more groups that are at least one selected from a methoxy group and an ethoxy group and not having a hydrocarbon group having 3 or more carbon atoms or a vinyl group, and (C-2) a hydrolysate of the organosilicon compound (C-1), and (E) the thermally conductive filler.