公开(公告)号：US20250043165A1

公开(公告)日：2025-02-06

申请号：US18923993

申请日：2024-10-23

Applicant: PPG Industries Ohio, Inc.

Inventor： Venkatachalam Eswarakrishnan ,  Hongying Zhou ,  Michael G. Sandala ,  Carolyn A.K. Novak ,  Jo-Ann E. Bice ,  Christopher A. Dacko ,  Hyun Wook Ro ,  Richard F. Syput ,  Egle Puodziukynaite ,  Craig A. Wilson ,  Justin M. Jones ,  Herbert Tillman

IPC: C09J175/00 ,  C08G18/20 ,  C08G18/22 ,  C08G18/28 ,  C08G18/32 ,  C08G18/58 ,  C08G18/76 ,  C08G18/80 ,  C09D5/24 ,  C09J11/08 ,  C09J163/00

Abstract: The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.

公开(公告)号：US20250034441A1

公开(公告)日：2025-01-30

申请号：US18783097

申请日：2024-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki OGAWA ,  Yoshitaka MURAKAMI

IPC: C09J163/00 ,  C08G59/24 ,  C08K3/013 ,  C08K5/54 ,  C09J11/04 ,  C09J11/06 ,  H01F27/26

Abstract: An adhesive includes a bisphenol F resin, a curing agent for the bisphenol F resin, and magnetic powder. The volume ratio of the magnetic powder to the adhesive is 35 vol % or lower. The number average molecular weight of the bisphenol F resin is 312 to 360 g/mol.

公开(公告)号：US12173194B2

公开(公告)日：2024-12-24

申请号：US17262850

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC: C09J163/00 ,  B05D3/00

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.

公开(公告)号：US20240376354A1

公开(公告)日：2024-11-14

申请号：US18686947

申请日：2022-09-01

Applicant: Zephyros, Inc.

Inventor： Vincent Goldman

IPC: C09J163/00 ,  C09J11/04 ,  C09J11/06

Abstract: A composition comprising a two-component liquid reinforcing adhesive comprising a first part having at least one epoxide functional constituent, an optional foaming agent, and a particulate filler and a second part having at least one acidic phosphorus containing curing agent.

公开(公告)号：US20240368336A1

公开(公告)日：2024-11-07

申请号：US18775933

申请日：2024-07-17

Applicant: MITSUBISHI CHEMICAL CORPORATION

Inventor： Daiki SUGIYAMA

IPC: C08G59/24 ,  C08G59/22 ,  C08G63/91 ,  C08J5/24 ,  C09D163/00 ,  C09J163/00

Abstract: The present invention provides a modified epoxy resin including a structural unit derived from an epoxy compound, and a structural unit derived from an acid-terminated polyester, wherein the modified epoxy resin has a weight average molecular weight of from 1,500 to 50,000, and an epoxy equivalent of from 500 to 10,000 g/eq, and wherein the modified epoxy resin is represented by the following formula (1) (wherein, in the formula (1), n represents a number from 1 to 30, X is a structural unit derived from an epoxy compound, and Y is a structural unit derived from an acid-terminated polyester).

公开(公告)号：US12134710B2

公开(公告)日：2024-11-05

申请号：US16491273

申请日：2018-03-21

Applicant: KOLON INDUSTRIES, INC.

Inventor： Da Ae Kim ,  Min Ho Lee ,  Ok Hwa Jeon

IPC: C09J109/08 ,  B05D1/18 ,  B05D7/02 ,  B05D7/24 ,  B60C9/00 ,  C09J107/02 ,  C09J111/02 ,  C09J163/00 ,  C09J175/04

Abstract: One embodiment of the present invention provides an adhesive composition including, on the basis of the total weight thereof, 0.5 to 4.0% by weight of an epoxy compound, 1.0 to 8.0% by weight of an isocyanate compound, 1.7 to 22% by weight of a rubber latex, 1.0 to 8.0% by weight of a polyurethane dispersion (PUD) resin, 0.1 to 2.0% by weight of an amine compound, and 69 to 92% by weight of a solvent, wherein the epoxy compound and the isocyanate compound have a weight ratio of 1:1 to 1:10.

公开(公告)号：US20240352289A1

公开(公告)日：2024-10-24

申请号：US18756411

申请日：2024-06-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA ,  Shunya OHBUCHI

IPC: C09J163/00 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  H01L21/683

CPC classification number: C09J163/00 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  H01L21/6836

Abstract: A thermally conductive film adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), a polyhedral alumina filler (D), and a silane coupling agent (E), wherein a percentage of the polyhedral alumina filler (D) to a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C), the polyhedral alumina filler (D), and the silane coupling agent (E) is from 20 to 70 vol %, and wherein a blending multiple of the silane coupling agent is from 1.0 to 10;



a film adhesive using the composition;
a semiconductor package; and
a producing method thereof.

公开(公告)号：US20240343952A1

公开(公告)日：2024-10-17

申请号：US18579545

申请日：2022-08-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Adam O. Moughton ,  Kathleen S. Shafer ,  Andrew Satrijo ,  Michael J. Maher ,  Deborah K. Schneiderman

IPC: C09J133/08 ,  C08L33/08 ,  C08L63/00 ,  C09J163/00

CPC classification number: C09J133/08 ,  C08L33/08 ,  C08L63/00 ,  C09J163/00

Abstract: Curable and cured compositions as well as articles that contain the curable or cured compositions are provided. The curable composition comprises (a) a (meth)acrylic-based multiblock copolymer, (b) a random (meth)acylate copolymer comprising a monomeric unit having a pendant poly(alkylene oxide) group, wherein the monomeric unit having the pendant poly(alkylene oxide) group has a number average molecular weight of at least 300 Daltons, (c) an epoxy resin, and (d) a cationic photoinitiator. Articles containing the curable composition can be die-cut and can retain their dimensions with minimal oozing when stored under ambient conditions.

公开(公告)号：US20240336051A1

公开(公告)日：2024-10-10

申请号：US18745644

申请日：2024-06-17

Applicant: Rapiscan Systems, Inc.

Inventor： Evgeniy Kuksin ,  Neal Hartsough ,  William C. Barber

IPC: B32B37/12 ,  B32B3/26 ,  B32B7/14 ,  B32B37/18 ,  C09J5/06 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J183/04 ,  H01L23/00 ,  H01L27/146

CPC classification number: B32B37/1292 ,  B32B3/266 ,  B32B7/14 ,  B32B37/1207 ,  B32B37/18 ,  C09J5/06 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J183/04 ,  H01L24/29 ,  H01L24/83 ,  H01L27/1463 ,  H01L27/14683 ,  B32B2305/72 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2309/025 ,  B32B2457/14 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2483/00 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/83862

Abstract: A method of attaching a detector onto a substrate that has an array of electrically conducting pads is provided, together with the resulting detector assembly. The method includes pouring a non-conductive adhesive material over a substrate surface, allowing the adhesive to settle between the conducting pads to form dams around the conducting pads, applying a conductive adhesive material onto the conducting pads of the substrate, and placing a surface of the detector on the substrate surface over the conducting and non-conducting adhesives to thereby attach the surface of the detector to the surface of the substrate.

公开(公告)号：US20240327688A1

公开(公告)日：2024-10-03

申请号：US18617769

申请日：2024-03-27

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Naoyuki KUSHIHARA ,  Kazuaki SUMITA ,  Akira YAJIMA

IPC: C09J163/00 ,  C08K3/36 ,  C08K5/00 ,  C08K5/3492 ,  C08K9/10 ,  C08L63/00

CPC classification number: C09J163/00 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/3492 ,  C08K9/10 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/05 ,  C08L2312/04 ,  C09J2463/00

Abstract: One of the objects of the present invention is to provide an epoxy resin composition that has excellent curability and storage stability, and that gives a cured product with excellent adhesive strength. The present invention provides an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin in a form of liquid at 25° C., having, per molecule, one or more functional groups having an aliphatic carbon-carbon double bond, (C) a microcapsule-type curing accelerator, (D) an imidazole compound having a triazine ring, and (E) an inorganic filler.