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公开(公告)号:US12001042B2
公开(公告)日:2024-06-04
申请号:US17878347
申请日:2022-08-01
发明人: Karissa L. Eckert , Michelle L Toy , Adam D. Haag , Matthew B. Johnson , Albert I. Everaerts , Quinn D. Sanford
IPC分类号: G02B5/30 , C09J7/29 , C09J201/02 , B32B37/12 , C09J133/00 , C09J133/08
CPC分类号: G02B5/305 , C09J7/29 , C09J201/02 , B32B2037/1253 , B32B2307/40 , B32B2307/42 , B32B2307/538 , B32B2457/20 , B32B2457/202 , C09J133/00 , C09J133/08 , C09J2301/302 , C09K2323/03 , C09K2323/031 , C09K2323/05 , C09K2323/057 , C09K2323/06 , C09K2323/061
摘要: Optical bodies are described. In particular, optical bodies having a birefringent multilayer optical film and a continuous adhesive layer with a thickness less than 20 micrometers are described. Optical bodies described herein exhibit reduced occurrence and severity of a non-uniformity defect known as “orange peel.”
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公开(公告)号:US20240076524A1
公开(公告)日:2024-03-07
申请号:US18273088
申请日:2022-02-28
发明人: Yoshiko OGINO , Tatsuya KUMADA , Yusuke HARA , Tomonari NAITO
IPC分类号: C09J7/38 , C08L5/00 , C09J201/02
CPC分类号: C09J7/38 , C08L5/00 , C09J201/02 , C09J2301/122 , C09J2301/302
摘要: A film contains a β-1,3-glucan derivative obtained by introducing an acyl group into a β-1,3-glucan and at least one resin selected from the group consisting of a rosin-based resin, a terpene-based resin, and a petroleum-based resin. The acyl group is represented by RCO—, and the R is a hydrocarbon group having 1 or more and 5 or less carbon atoms. Parts by weight of the resin with respect to 100 parts by weight of the β-1,3-glucan derivative are 90 parts by weight or less. A pressure-sensitive adhesive tape includes the film and a pressure-sensitive adhesive layer.
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公开(公告)号:US11802221B2
公开(公告)日:2023-10-31
申请号:US17495409
申请日:2021-10-06
发明人: Jing Fang , Dong Yang , Jeffrey W. McCutcheon
IPC分类号: H01B1/22 , C09J9/02 , C09J201/02
CPC分类号: C09J9/02 , C09J201/02 , H01B1/22 , C09J2301/302 , C09J2301/312 , C09J2301/314
摘要: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.
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公开(公告)号:US11682564B2
公开(公告)日:2023-06-20
申请号:US17489922
申请日:2021-09-30
发明人: Takahiro Kuroda , Tomohiro Nagoya , Naoki Tomori
IPC分类号: H01L21/56 , C09J7/25 , C09J7/35 , C09J11/06 , C09J201/02 , H01L23/495 , H01L23/00
CPC分类号: H01L21/568 , C09J7/25 , C09J7/35 , C09J11/06 , C09J201/02 , H01L21/561 , H01L21/565 , H01L23/49503 , H01L24/45 , H01L24/85 , H01L24/96
摘要: A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.
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公开(公告)号:US11267997B2
公开(公告)日:2022-03-08
申请号:US16779709
申请日:2020-02-03
IPC分类号: C09J133/06 , C09J9/00 , C09J201/02 , C08L33/06 , C08F220/10
摘要: A solid thermoplastic semi-crystalline friction-activated adhesive composition comprising the mixture of: (a) from about 50 to about 100 parts by weight of a semi-crystalline adhesive polymer that comprises: (1) crystalline monomer having an alkyl carbon length of at least 16 carbon atoms; (2) non-crystalline monomer having a homopolymer Tg below about 80° C.; (3) waxy, soft monomer having an average pendant alkyl carbon length of at least 14 carbon atoms; (4) monomer having acid or base functionality; (5) functional or non-functional macromere having a Tm from about 40 to about 120° C.; (b) 0 to about 50 parts by weight of tackifier; (c) 0 to about 50 parts by weight of crystalline additive; (d) 0 to about 50 parts by weight of filler; (e) 0 to about 30 parts by weight of oil; and (f) 0 to about 50 parts by weight of one surfactant. Also glue crayons and other application devices comprising such adhesive compositions.
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公开(公告)号:US20210020460A1
公开(公告)日:2021-01-21
申请号:US16979781
申请日:2019-03-01
发明人: Takahiro KURODA , Tomohiro NAGOYA , Naoki TOMORI
IPC分类号: H01L21/56 , H01L23/00 , H01L23/495 , C09J7/35 , C09J11/06 , C09J201/02 , C09J7/25
摘要: Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.
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公开(公告)号:US10711083B2
公开(公告)日:2020-07-14
申请号:US15997838
申请日:2018-06-05
发明人: Atsushi Takahara , Jin Nishida
IPC分类号: C08F220/58 , C08F226/02 , C09J9/00 , C09J201/02 , C09J133/24 , C09J139/00
摘要: The object of the present invention is to provide a novel adhesive. The characteristics of the present invention is an adhesive comprising an organic polymer having a main chain formed by a water-soluble polymer unit, and a hydrophilic organic group and a self-assembling group bonded to the water-soluble polymer unit; and a curing agent.
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公开(公告)号:US20200153001A1
公开(公告)日:2020-05-14
申请号:US16604389
申请日:2018-03-29
申请人: TESA SE
IPC分类号: H01M8/0297 , C25B9/18 , C09J7/38 , C09J153/02 , C09J201/02 , H01M8/0221 , H01M8/0228 , H01M8/0284
摘要: Disclosed is an electrochemical cell or a stack of at least two electrochemical cells, wherein at least two components of the electrochemical cell or of the stack of electrochemical cells are bonded together by means of a strip of adhesive which can be removed again, in particular without residue or destruction, by stretching substantially in the bonding plane, wherein the strip of adhesive comprises one or more adhesive material layers and optionally one or more carrier layers, and wherein the outer upper surface and the outer lower surface of the strip of adhesive are formed by the one or more adhesive material layers. Also disclosed is the use of a strip of adhesive of this kind for bonding together components in an electrochemical cell or in a stack of at least two electrochemical cells.
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公开(公告)号:US20200095479A1
公开(公告)日:2020-03-26
申请号:US16497042
申请日:2017-05-09
发明人: Jing Fang , Dong Yang , Jeffrey W. McCutcheon
IPC分类号: C09J9/02 , C09J201/02
摘要: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.
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公开(公告)号:US20200010735A1
公开(公告)日:2020-01-09
申请号:US16468355
申请日:2017-12-14
发明人: Yongsuk Yang , Kyosung Hwang , Gyu Jin Jung
IPC分类号: C09J7/40 , C09J133/12 , C08F220/18 , C08F220/28 , C08F220/70 , C08K3/36 , C08K3/22 , C08K3/04 , C09J133/06 , C09J201/02
摘要: The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a —COOH or —OH functional group and includes two kinds of acrylic resins having different weight average molecular weights, and an adhesive substrate including the adhesive film and a substrate to be processed. In the adhesive film and the adhesive substrate according to the present invention, it is possible to simplify a processing process of the substrate and reduce costs and time, and prevent damage to a substrate and a circuit or an element formed on the substrate.
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