Electrically conductive adhesive
    3.
    发明授权

    公开(公告)号:US11802221B2

    公开(公告)日:2023-10-31

    申请号:US17495409

    申请日:2021-10-06

    IPC分类号: H01B1/22 C09J9/02 C09J201/02

    摘要: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.

    Friction-activated adhesive formulations and application devices

    公开(公告)号:US11267997B2

    公开(公告)日:2022-03-08

    申请号:US16779709

    申请日:2020-02-03

    摘要: A solid thermoplastic semi-crystalline friction-activated adhesive composition comprising the mixture of: (a) from about 50 to about 100 parts by weight of a semi-crystalline adhesive polymer that comprises: (1) crystalline monomer having an alkyl carbon length of at least 16 carbon atoms; (2) non-crystalline monomer having a homopolymer Tg below about 80° C.; (3) waxy, soft monomer having an average pendant alkyl carbon length of at least 14 carbon atoms; (4) monomer having acid or base functionality; (5) functional or non-functional macromere having a Tm from about 40 to about 120° C.; (b) 0 to about 50 parts by weight of tackifier; (c) 0 to about 50 parts by weight of crystalline additive; (d) 0 to about 50 parts by weight of filler; (e) 0 to about 30 parts by weight of oil; and (f) 0 to about 50 parts by weight of one surfactant. Also glue crayons and other application devices comprising such adhesive compositions.

    BONDING IN ELECTROCHEMICAL CELLS, AND STACKING OF ELECTROCHEMICAL CELLS

    公开(公告)号:US20200153001A1

    公开(公告)日:2020-05-14

    申请号:US16604389

    申请日:2018-03-29

    申请人: TESA SE

    摘要: Disclosed is an electrochemical cell or a stack of at least two electrochemical cells, wherein at least two components of the electrochemical cell or of the stack of electrochemical cells are bonded together by means of a strip of adhesive which can be removed again, in particular without residue or destruction, by stretching substantially in the bonding plane, wherein the strip of adhesive comprises one or more adhesive material layers and optionally one or more carrier layers, and wherein the outer upper surface and the outer lower surface of the strip of adhesive are formed by the one or more adhesive material layers. Also disclosed is the use of a strip of adhesive of this kind for bonding together components in an electrochemical cell or in a stack of at least two electrochemical cells.

    ELECTRICALLY CONDUCTIVE ADHESIVE
    9.
    发明申请

    公开(公告)号:US20200095479A1

    公开(公告)日:2020-03-26

    申请号:US16497042

    申请日:2017-05-09

    IPC分类号: C09J9/02 C09J201/02

    摘要: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.

    ADHESIVE FILM AND ADHESIVE SUBSTRATE
    10.
    发明申请

    公开(公告)号:US20200010735A1

    公开(公告)日:2020-01-09

    申请号:US16468355

    申请日:2017-12-14

    摘要: The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a —COOH or —OH functional group and includes two kinds of acrylic resins having different weight average molecular weights, and an adhesive substrate including the adhesive film and a substrate to be processed. In the adhesive film and the adhesive substrate according to the present invention, it is possible to simplify a processing process of the substrate and reduce costs and time, and prevent damage to a substrate and a circuit or an element formed on the substrate.