摘要:
A thermal protection system for a chemical vapor deposition machine (CVD). The system of the present invention includes a thermal sensor for providing a temperature signal corresponding to a CVD chamber temperature, a heating component for heating the CVD chamber, and a controller for regulating the CVD chamber temperature. The controller is coupled to receive the temperature signal and to control the heating component in response thereto. An interlock circuit is coupled between the heating component and the controller. The interlock circuit has an open state and a closed state. A comparison circuit is coupled to receive the temperature signal and coupled to control the interlock circuit, wherein the comparison circuit effects a comparison between the temperature signal and a reference and commands the interlock to the open state when the temperature signal exceeds the reference. In so doing, the comparison circuit protects the CVD chamber from an over-temperature condition that might not otherwise be prevented by the controller.
摘要:
A method and apparatus for the non-contact in-situ temperature measurement of a material layer during chemical vapor deposition of the material on an underlying substrate are provided. Magnitude modulated UV light having a plurality of separated spectral components is directed at the material being deposited on the substrate. The modulated UV light has a plurality of wavelengths corresponding to different temperature dependencies of absorptance in the deposited material. The separated spectral components are within transparency spectral windows of a plasma media contained in the CVD reactor. A portion of the magnitude modulated UV light is directed as a reference into a comparison device, such as a spectrophotometer. Light reflected from the deposited material is also directed at the comparison device for comparison with the reference light. That is, the magnitudes of the magnitude modulated components of the reflected light and the reference light are compared at more than one spectral component. The temperature of the deposited material is derived from this comparison. The results of the comparison are then utilized to control the temperature of the substrate on which the material is being deposited.
摘要:
The present invention provides systems, methods and apparatus for high temperature (at least about 500-800° C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.
摘要:
The present invention relates to a method of applying glass layers, which may or may not be doped, to the interior of a substrate tube by means of a chemical vapor deposition (CVD) technique, using a reactive gas mixture, in order to obtain a preform that exhibits a precisely defined refractive index profile, which method comprises a number of steps.
摘要:
A plasma processing apparatus that allows processing of high quality under a wider processing condition is provided by optimizing the distance between a plasma region and a substrate even in the case where the processing condition such as process pressure or high frequency output differs. A plasma chamber is divided into a lower plasma chamber and an upper plasma chamber. A process chamber and the lower plasma chamber are connected flexibly by a lower chamber bellows. The lower plasma chamber and the upper plasma chamber are connected flexibly by an upper chamber bellows. Since the radioactive species volume is increased when the process pressure is low, the lower and upper plasma chambers are respectively raised. In contrast, since the radioactive species volume is reduced when the process pressure is high, the upper and lower plasma chambers are respectively lowered.
摘要:
When the processed body holding member is moved upward or downward, the pressure in the reaction pipe and the shift and mount chamber is reduced down to several to several tens Torr, to reduce wind pressure applied to the processed body and thereby to suppress pressure fluctuations in the reaction pipe. Further, when the processed body holding member is moved upward or downward, the processing gas is passed in the same direction as the movement direction of the processed body holding member at a speed higher than the movement speed of the processed body holding member, to prevent the processing gas from being opposed to the processed body, so that the resistance received by the processed body is reduced and thereby the pressure fluctuations can be suppressed in the reaction pipe.
摘要:
The present invention provides exemplary apparatus and methods for processing substrates and for ensuring purge gases reach the substrate edge, including edges of JMF type wafers, to help prevent unwanted deposition thereon. One embodiment provides an apparatus for processing substrates which includes a chamber and a substrate support (13) disposed in the chamber. An edge ring (15) is disposed on the substrate support. The edge ring has a lip portion (30) which at least partially overhangs an upper surface (36) of the substrate support to define a gap (29) between the lip portion and the upper surface. In this manner, the edge ring is designed to form a gap which properly directs purge gases to edges of the substrate, including JMF type substrates.
摘要:
Deposition of a pyrocarbon coating of precise thickness onto one or more substrates being levitated along with a bed of particles in a fluidized bed coating enclosure is accomplished by varying the amount of hydrocarbon supplied to the bed as a part of an upward levitating flow to compensate for changes which are detected in the size of the fluidized bed. Increases and decreases in the size of the bed are detected by monitoring either the differential pressure above and below the bed or the weight of the bed, and compensating changes are made to return the bed to its desired size by changing the flow rate of hydrocarbon. For example, when a growth in bed size is detected that is not attributable to an aberration in either particle supply or withdrawal, the amount of hydrocarbon being supplied to the bed is decreased so as to cause the size of the bed to gradually return to its desired value.
摘要:
The present invention discloses an apparatus for regulating chamber pressure in a process chamber by a closed-loop control method utilizing a pressure sensor, a pressure controller and an inverter for regulating the rotational speed of an exhaust blower such that the exhaust pressure in a factory exhaust conduit can be substantially controlled at a constant value. The present invention novel method and apparatus allows a more stable chamber pressure to be maintained in an APCVD or LPCVD chamber, while substantially reduces the possibility of particulate contamination on a throttle valve that is mounted juxtaposed to the process chamber and thus minimizing any back-fill contamination problems.
摘要:
A novel method is provided for in situ monitoring of a film being deposited on a wafer for manufacturing a semiconductor device. The method involves producing an incident beam of radiation directed during a deposition process to a film being deposited on a wafer in a deposition reactor. The Raman scattered radiation resulted from interaction of the incident beam with molecules of the deposited film is detected to produce a Raman spectrum of the deposited film.