摘要:
A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer. Short purge channels may be provided to deliver some of the sweep gas to regions surrounding the spacers to cause a continuous flow of protective purge gas around the spacers. A common bottom section may cooperate with a plurality of different top sections to form segmented susceptors suitable for supporting various sized wafers.
摘要:
A vapor supply apparatus, for use in a semiconductor device manufacturing process, provides a three-dimensional showerhead for supplying various precursors to a reaction chamber. The three-dimensional showerhead comprises an inverted-cup structure having double walls, an outer wall and an inner wall, with the double walls defining a first interior volume and the inner wall defining an exterior cavity, the inverted-cup structure further has a plurality of first inlet ports connected to the outer wall for introducing first precursors into the first interior volume and a plurality of first outlet ports at the inner wall for discharging the first precursor vapor from the first interior volume to the exterior cavity. The three-dimensional showerhead confines the precursor vapor inside the external cavity to modify the processed film characteristics.
摘要:
An apparatus for processing a microelectronic workpiece in a micro-environment is set forth. The apparatus includes a first chamber member having an interior chamber wall and a second chamber member having an interior chamber wall. The first and second chamber members are adapted for relative movement between a loading position in which the first and second chamber members are distal one another and a processing position in which the first and second chamber members are proximate one another to define a processing chamber. At least one workpiece support assembly is disposed between the first and second chamber members for supporting the microelectronic workpiece. The workpiece support assembly is operable to space the workpiece a first distance, x1, from an interior chamber wall of at least one of the first and second chamber members when the first and second chamber members are in the loading position and to space the workpiece a second distance, x2, from the interior chamber wall when the first and second chamber members are in the processing position, wherein x1>x2.
摘要:
A liquid delivery system (10) for vaporization of a liquid pecursor to form precursor vapor for transport to a deposition zone (36). The system includes a vaporization chamber (12), a porous vaporization element (60) positioned in the vaporization chamber (12) to define an upstream portion (20) of the vaporization chamber (12) upstream of the porous vaporization element (60), and a downstream portion (22) of the vaporization chamber (12) downstream of the porous vaporization element (60) therein, a vaporization element heater (59), a liquid precursor supply (26) for introducing liquid precursor to the vaporization element (60) for vaporization thereof, a precursor vapor discharge (16) from the chamber, and means (46, 48, 50, 52, 54, 56 and 58) for diverting at least a part of the fluid in the upstream portion of the vaporization chamber (12) past the porous vaporization element (60), to stabilize fluid pressure in the upstream portion of the vaporization chamber (12) under conditions tending to perturb such fluid pressure.
摘要:
An apparatus for forming a silicon oxide film which has a process chamber and is for thermally oxidizing a surface of a silicon layer by introducing water vapor into the process chamber, and which further has dew-formation prevention/evaporation means for preventing dew formation in the process chamber and/or evaporating dew in the process chamber.
摘要:
A thermal reflow processing system has a rotatable structure to which articles having a reflowable surface are attached. The structure is coupled to a drive motor which causes the structure to rotate at speeds which generate centripetal forces in excess of that of gravity. The system is equipped with at least one radiant heat source. As the articles are being subjected to a centripetal force, the surface is heated by the radiant heat source.
摘要:
An apparatus for performing in-situ curvature measurement of a substrate during a deposition process is provided which includes a clamp for retaining the substrate near one end while leaving the opposite end free. A plurality of displacement sensors are arranged in a spaced apart fashion along the length of the substrate and are directed to a surface of the substrate opposite a surface to be coated. Each sensor provides a signal to a computer corresponding to a position of the substrate relative to the sensor. The computer receives and stores data from the displacement sensors to determine a stress evolution during a deposition process and to determine a coating modulus based upon a resultant curvature of the substrate.
摘要:
A direct liquid injection system and process which has on-line cleaning of the vaporizers without the need for shutting down the CVD process and thus eliminating down time is provided. The cleaning process includes the steps of providing at least one metalorganic precursor to a first vaporizer to produce a vapor containing the at least one precursor; transporting the vapor to a deposition chamber; periodically interrupting the supply of the at least one metalorganic precursor to the first vaporizer; providing the at least one metalorganic precursor to a second vaporizer to produce a vapor containing the at least one precursor; transporting the vapor to the deposition chamber; and during at least a portion of the time when the supply of the metalorganic precursor is interrupted to the first vaporizer, providing a cleaning fluid (either liquid solvent or cleaning gas plasma) to the first vaporizer, which fluid is effective to at least partially remove deposits of the metalorganic precursor. The process may be either carried out as a batch process, or more preferably, as a continuous process to avoid the need to shut down the system.
摘要:
A cold wall reactor having inner and outer walls defining an annular reactor cell. A susceptor is rotatably mounted in the cell, and received wafers to be treated by gases flowing axially through the cell. The outer wall of the reactor is normally cooled, but is heated by a suitable furnace to provide a hot wall reactor when cleaning of the cell is required.