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公开(公告)号:US11691388B2
公开(公告)日:2023-07-04
申请号:US14903913
申请日:2014-07-09
IPC分类号: C25D1/10 , B32B15/08 , C25D5/02 , C25D7/04 , C23C18/16 , B29B11/06 , B29B11/14 , B29C43/18 , B29C45/14 , C23C26/00 , E04B1/19 , E04B1/30 , B29K101/10 , B29K101/12 , B29K105/20 , B29K705/00 , B29L9/00
CPC分类号: B32B15/08 , B29B11/06 , B29B11/14 , B29C43/183 , B29C45/14 , C23C18/1605 , C23C26/00 , C25D5/022 , C25D7/04 , E04B1/19 , E04B1/30 , B29K2101/10 , B29K2101/12 , B29K2105/20 , B29K2705/00 , B29L2009/00 , B32B2250/02 , B32B2307/558 , B32B2605/00 , E04B2001/1927
摘要: An encapsulated polymeric article is disclosed. The encapsulated polymeric article may include a polymer substrate and a metallic outer shell at least partially encapsulating the polymer substrate. The encapsulated polymeric article may be fabricated by a method comprising: 1) providing a mandrel in a shape of the encapsulated polymeric article, 2) shaping the metallic outer shell on the mandrel, 3) removing the mandrel from the metallic outer shell, and 4) molding the polymeric substrate into the metallic outer shell through a port formed in the metallic outer shell to provide the encapsulated polymeric article.
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公开(公告)号:US11629421B2
公开(公告)日:2023-04-18
申请号:US16573263
申请日:2019-09-17
申请人: LG Display Co., Ltd.
发明人: Hyunjun Kim
摘要: A mask and a method of manufacturing the same are disclosed. The method of manufacturing a mask includes forming a conductive layer on a pattern region and an auxiliary region around the pattern region of a substrate, placing the substrate including the conductive layer in a plating bath, forming a plating layer on the conductive layer, and separating the substrate and the conductive layer from the plating layer.
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公开(公告)号:US11603600B2
公开(公告)日:2023-03-14
申请号:US17191750
申请日:2021-03-04
发明人: Jyun-Yi Yu
摘要: A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.
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公开(公告)号:US11577480B2
公开(公告)日:2023-02-14
申请号:US16930387
申请日:2020-07-16
申请人: QINGDAO UNIVERSITY OF TECHNOLOGY , QINGDAO 5D INTELLIGENT ADDITIVE MANUFACTURING TECHNOLOGY CO., LTD.
发明人: Hongbo Lan , Quan Xu , Jiawe Zhao , Xiaoyang Zhu
IPC分类号: B29D11/00 , B33Y10/00 , B29C64/10 , B29C33/38 , B29C59/02 , C25D1/10 , F21V8/00 , G03F7/00 , B33Y50/02 , B29C64/393
摘要: A method and apparatus for mass production of AR diffractive waveguides. Low-cost mass production of large-area AR diffractive waveguides (slanted surface-relief gratings) of any shape. Uses two-photon polymerization micro-nano 3D printing to realize manufacturing of slanted grating large-area masters of any shape (thereby solving the problem about manufacturing of slanted grating masters of any shape on the one hand, realizing direct manufacturing of large-size wafer-level masters on the other hand, and also having the advantages of low manufacturing cost and high production efficiency). Composite nanoimprint lithography technology is employed (in combination with the peculiar imprint technique and the composite soft mold suitable for slanted gratings) to solve the problem that a large-slanting-angle large-slot-depth slanted grating cannot be demolded and thus cannot be manufactured, and realize the manufacturing of the slanted grating without constraints (geometric shape and size).
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公开(公告)号:US11453940B2
公开(公告)日:2022-09-27
申请号:US17013535
申请日:2020-09-04
发明人: Sumika Tamura , Mikio Shinno , Daisei Fujito , Kiyoaki Nishitsuji , Takehiro Nishi , Naoko Mikami
IPC分类号: C23C14/04 , C25D1/04 , C25B11/055 , C25C1/08 , C25C7/08 , C25D1/10 , C25D11/34 , H01L51/00 , C25D3/56
摘要: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.
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公开(公告)号:US20220235480A1
公开(公告)日:2022-07-28
申请号:US17618631
申请日:2020-06-15
摘要: Disclosed herein is a method comprising growing a shim by disposing a mandrel having an optional textured surface in an electrolytic bath, where the shim contains a negative image of the optional textured surface formed by electrolytic deposition of a metal; affixing the shim working-side down on a reference plane using a fixture; optically scanning the shim to reverse engineer a geometry of a non-working surface, where reverse engineering a geometry of the non-working surface includes developing a profile of the non-working surface and the thickness of the shim; and adding a material to the non-working surface of the shim via additive manufacturing to form a tool insert.
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公开(公告)号:US20220178039A1
公开(公告)日:2022-06-09
申请号:US17191750
申请日:2021-03-04
发明人: Jyun-Yi YU
摘要: A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.
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公开(公告)号:US11117190B2
公开(公告)日:2021-09-14
申请号:US15479380
申请日:2017-04-05
发明人: John P. Swank , Robert M. Conaway , Hugh M. Davis
摘要: A method for creating a metallurgic component comprises creating a thin-walled container corresponding to a shape of the metallurgic component from a metal. If powder metal is not already in the container (depending on a method of creating the container), the thin-walled container is filled with powder metal. A quick-can device is fixed to the thin-walled container, and the powder metal is consolidated inside the thin-walled container (e.g., in a hot isostatic press). During consolidation, pressure within the thin-walled container is monitored and a desired pressure differential between an inside of the thin-walled container and an outside of the thin-walled container is maintained by the quick-can device.
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公开(公告)号:US20210214834A1
公开(公告)日:2021-07-15
申请号:US15733833
申请日:2018-06-26
摘要: Embodiments of the disclosure provide methods and apparatus for a shadow mask. In one embodiment, a shadow mask is provided and includes a frame made of a metallic material, and one or more mask patterns coupled to the frame, the one or more mask patterns comprising a metal having a coefficient of thermal expansion less than or equal to about 14 microns/meter/degrees Celsius and having a plurality of openings formed therein, the metal having a thickness of about 5 microns to about 50 microns and having borders formed therein each defining a fine opening having a recessed surface formed on a substrate contact surface thereof, wherein each of the one or more mask patterns have a flatness of less than about 150 microns across a surface area of about 70,000 square millimeters.
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公开(公告)号:US11007678B2
公开(公告)日:2021-05-18
申请号:US15933573
申请日:2018-03-23
申请人: FUJIFILM Corporation
发明人: Shotaro Ogawa , Satoshi Chai , Kenji Ichikawa , Kazunori Komatsu , Kozue Ikeda , Ryo Hibino
IPC分类号: B29C33/38 , B29C33/42 , B81C99/00 , A61M37/00 , B29C43/52 , B29C33/40 , B29C41/20 , B29C41/38 , B29C41/42 , C25D1/10 , B29K101/12 , B29L7/00 , B29L31/00
摘要: A production method of a mold includes: preparing a plate precursor having a protruding pattern formed of protrusions in a pattern presence region on a base, and a thermoplastic resin sheet; determining a position at which the plate precursor is to be pressed against the thermoplastic resin sheet by moving the plate precursor and the thermoplastic resin sheet relative to each other; and forming a recessed pattern on the thermoplastic resin sheet by pressing the protrusions of the plate precursor which is heated against the thermoplastic resin sheet at a position where a part of the pattern presence region of the plate precursor excluding the protrusions is separated from a surface of the thermoplastic resin sheet, cooling the plate precursor in a state in where the pressed protrusions and the thermoplastic resin sheet are in contact with each other, and separating the plate precursor from the thermoplastic resin sheet.
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