Method for manufacturing cover member, and cover member structure

    公开(公告)号:US12210389B2

    公开(公告)日:2025-01-28

    申请号:US17475526

    申请日:2021-09-15

    Abstract: A method for manufacturing a cover member for electronic devices according to certain embodiments of the present disclosure may comprise: a step for forming a magnesium plate; a step for performing primary CNC processing on the magnesium plate using a predetermined cutting oil; a step for performing a primary pretreatment on the magnesium plate using chromate or micro arc oxidation (MAO); a step for performing a primary surface-treatment on the magnesium plate by bake-coating or electrodeposition coating; a step for performing secondary CNC processing on a first region of the magnesium plate using an alcohol-containing cutting oil; a washing and drying step; a step for performing a secondary pretreatment for preventing oxidation on the first region; and a step for performing a secondary surface-treatment on the first region by bake-coating or electrodeposition coating.

    Heat recovery device and electrodeposition coating system

    公开(公告)号:US11725295B2

    公开(公告)日:2023-08-15

    申请号:US17254185

    申请日:2019-06-04

    CPC classification number: C25D13/22 C25D13/20

    Abstract: A heat recovery device including: a warm-water bath storing warm water and a drying chamber, wherein warm exhausted air from the chamber heats the water includes: an exhaust duct that the exhausted air from the chamber to the outside air passes; an exhaust bypass duct between two positions in the exhaust duct; a circulation pipe through which the water circulates; a heat exchanger provided generates air in the bypass duct to be absorbed by water in the circulation pipe; a warm-water bypass pipe between two positions downstream to the heat exchanger in the circulation pipe or between one position downstream to the heat exchanger in the circulation pipe and the warm-water bath; a heatsink provided at the bypass pipe; a first distribution-changing valve for distribution of air flowing from the exhaust duct to the exhaust bypass duct; and a second distribution valve for distributing water to the bypass pipe.

    Electrodeposition coating method and electrodeposition coating apparatus

    公开(公告)号:US11692280B2

    公开(公告)日:2023-07-04

    申请号:US16963640

    申请日:2019-01-15

    CPC classification number: C25D13/22 C25D13/10 C25D13/20 C25D13/24

    Abstract: An electrodeposition coating method includes a degreasing/cleaning step, a chemical conversion step, and an electrodeposition coating layer formation step. The degreasing/cleaning step includes a degreasing step of ultrasonically vibrating a degreasing solution in which a target object is immersed, using an ultrasonic vibrator. The electrodeposition coating layer formation step includes: a first electrodeposition step; a first rinsing step; a rinse water removal/reduction step of removing or reducing rinse water on a rinse water stagnating surface of the target object; a thermal flow step of allowing the first electrodeposition coating film to thermally flow so that the first electrodeposition coating film formed on a portion of the target object near a first counter electrode has a higher electrical resistance than the first electrodeposition coating film formed on a portion of the target object far from the first counter electrode; and a second electrodeposition step.

    METHODS AND SYSTEMS FOR REDOX-TRIGGERED SURFACE IMMOBILIZATION OF POLYIONIC SPECIES ON A SUBSTRATE

    公开(公告)号:US20210292929A1

    公开(公告)日:2021-09-23

    申请号:US16997268

    申请日:2020-08-19

    Abstract: Described herein are methods for the surface deposition of polyionic species on a substrate surface. This deposition process can be triggered facilely by oxidizing organometallic species present on the surface of the substrate. This approach is quite general, affording quantitative deposition of polyionic species with a wide range of chemical identities (e.g., synthetic polymers, peptides and DNA) and molecular weights. This approach is in addition suitable for surface deposition of several types of functional materials, including proteins (antibodies), nanomaterials, colloids, lipid vesicles, among others.

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