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公开(公告)号：US11993861B2
公开(公告)日：2024-05-28
申请号：US17627576
申请日：2021-03-10
Applicant: EBARA CORPORATION
Inventor： Kazuhito Tsuji
Abstract: Provided is a technique that allows a removal of air bubbles that remain on an ionically resistive element.
A plating apparatus 1000 includes a plating tank 10 configured to accumulate a plating solution Ps and including an ionically resistive element 12 arranged in the plating tank, a substrate holder 30 arranged above the ionically resistive element and configured to hold a dummy substrate Wfx, a rotation mechanism 40 configured to rotate the substrate holder, and an elevating mechanism 50 configured to elevate the substrate holder. At least one projecting portion is disposed on a lower surface of the dummy substrate. The at least one projecting portion 60 projects downward from the lower surface. The substrate holder includes a ring 31 projecting below an outer peripheral edge of the lower surface of the dummy substrate. The projecting portion has a lower surface positioned below a lower surface of the ring. The plating apparatus is configured to cause the rotation mechanism to rotate the substrate holder in a state where the elevating mechanism moves down the substrate holder to allow the projecting portion of the dummy substrate to be positioned above the ionically resistive element and to be immersed in the plating solution of the plating tank.
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公开(公告)号：US20230407514A1
公开(公告)日：2023-12-21
申请号：US18037537
申请日：2021-11-30
Applicant: Lam Research Corporation
Inventor： James Isaac Fortner , Steven T. Mayer , Stephen J. Banik
CPC classification number: C25D21/04 , C25D17/001
Abstract: In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate. An example electroplating apparatus comprises a plating cell to receive a plating solution, an electrode, a counter electrode, a substrate holding fixture, a resistive element, and a de-bubbler device supportable rotatably adjacent the resistive element to generate or direct a flow of plating solution through the resistive element to release trapped bubbles.
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公开(公告)号：US20230151508A1
公开(公告)日：2023-05-18
申请号：US17627576
申请日：2021-03-10
Applicant: EBARA CORPORATION
Inventor： Kazuhito Tsuji
Abstract: Provided is a technique that allows a removal of air bubbles that remain on an ionically resistive element.
A plating apparatus 1000 includes a plating tank 10 configured to accumulate a plating solution Ps and including an ionically resistive element 12 arranged in the plating tank, a substrate holder 30 arranged above the ionically resistive element and configured to hold a dummy substrate Wfx, a rotation mechanism 40 configured to rotate the substrate holder, and an elevating mechanism 50 configured to elevate the substrate holder. At least one projecting portion is disposed on a lower surface of the dummy substrate. The at least one projecting portion 60 projects downward from the lower surface. The substrate holder includes a ring 31 projecting below an outer peripheral edge of the lower surface of the dummy substrate. The projecting portion has a lower surface positioned below a lower surface of the ring. The plating apparatus is configured to cause the rotation mechanism to rotate the substrate holder in a state where the elevating mechanism moves down the substrate holder to allow the projecting portion of the dummy substrate to be positioned above the ionically resistive element and to be immersed in the plating solution of the plating tank.
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公开(公告)号：US20230056444A1
公开(公告)日：2023-02-23
申请号：US17797589
申请日：2020-09-01
Applicant: SEMSYSCO GMBH
Inventor： Andreas GLEISSNER , Franz MARKUT , Ross KULZER , Herbert ÖTZLINGER
Abstract: The invention relates to an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, a module for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the electrochemical deposition system or the module for chemical and/or electrolytic surface treatment for a metal deposition application and a manufacturing method for an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate. The electrochemical deposition system comprises an anode, an anode enclosure, and a single electrolyte. The anode enclosure extends at least partially around the anode. The anode enclosure comprises a membrane. The anode and the anode enclosure are arranged in the single electrolyte. The single electrolyte is the only electrolyte of the electrochemical deposition system.
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公开(公告)号：US20220112621A1
公开(公告)日：2022-04-14
申请号：US17065621
申请日：2020-10-08
Applicant: Honeywell International Inc.
Inventor： James PIASCIK , Glenn SKLAR , Joseph W. MINTZER, III
Abstract: Systems and methods for automated electroplating are disclosed. An electroplating system includes a first chamber configured to receive one or more parts. The first chamber includes a vessel extending from a first end to a second end, a first cap proximate to the first end a first cathode contact coupled to the first end, a second cathode contact coupled to the second end, and a plurality of anodes formed on an inner surface of the vessel. The electroplating system further includes at least one reservoir and a first conduit and a second conduit each coupled between the at least one reservoir and the first chamber. The first conduit may be configured to transfer fluid from the first reservoir to the first chamber and the second conduit may be configured to transfer fluid from the first chamber to the at least one reservoir.
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公开(公告)号：US20220084813A1
公开(公告)日：2022-03-17
申请号：US17199510
申请日：2021-03-12
Applicant: Kioxia Corporation
Inventor： Makoto IYAMA , Fumito SHOJI , Masatoshi SHOMURA
Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes loading a substrate into a processing container, airtightly sealing the processing container in which the substrate has been loaded, reducing a pressure of the processing container airtightly sealed, supplying a processing solution into the processing container with reduced pressure, performing a process on the substrate using the processing solution, discharging the processing solution used for the process from the processing container, after discharging the processing solution, opening the processing container, and unloading the substrate subjected to the process out of the processing container.
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公开(公告)号：US11214887B2
公开(公告)日：2022-01-04
申请号：US16870411
申请日：2020-05-08
Applicant: LAM RESEARCH CORPORATION
Inventor： Stephen J. Banik , Bryan L. Buckalew , Gabriel Hay Graham , Alfred Bostick , Sean Wilbur , John Floyd Ostrowski
Abstract: An electroplating apparatus includes an electrode at the bottom of a chamber, an ionically resistive element with through holes arranged horizontally at the top of the chamber, with a membrane in the middle. One or more panels extend vertically and parallelly from the membrane to the element and extend linearly across the chamber, forming a plurality of regions between the membrane and the element. A substrate with a protuberance extending along a chord of the substrate and contacting a top surface of the element is arranged above a first region. An electrolyte flowed between the substrate and the element descends into the first region via the through holes on a first side of the protuberance and ascends from the first region via the through holes on a second side of the protuberance, forcing air bubbles out from a portion of the element associated with the first region.
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8.发明授权
公开(公告)号：US10982347B2
公开(公告)日：2021-04-20
申请号：US16576251
申请日：2019-09-19
Applicant: EBARA CORPORATION
Inventor： Shoichiro Ogata , Masaaki Kimura , Mitsutoshi Yahagi
IPC: C25D17/06 , C25D5/34 , C25D17/00 , C25D21/04 , H01L21/67 , G01M3/32 , C25D7/12 , H01L21/288 , H01L21/687 , C25D17/02 , C25D21/06 , C25D21/10 , C25D21/12
Abstract: There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.
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公开(公告)号：US10301738B2
公开(公告)日：2019-05-28
申请号：US15724120
申请日：2017-10-03
Applicant: Novellus Systems, Inc.
Inventor： Bryan L. Buckalew , Steven T. Mayer , Thomas A. Ponnuswamy , Robert Rash , Brian Paul Blackman , Doug Higley
IPC: C25D3/12 , C25D3/30 , C25D3/38 , C25D5/00 , C25D5/02 , C25D5/12 , C25D5/56 , C25D7/12 , C25D17/00 , C25D21/04 , C25D21/12 , H01L21/02 , H01L21/67 , H01L21/288 , H01L21/321 , H01L21/768
Abstract: Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute.
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公开(公告)号：US20180080139A1
公开(公告)日：2018-03-22
申请号：US15827092
申请日：2017-11-30
Applicant: NEO Industries LLC
Inventor： Michal Fedor , Milan Smolen
CPC classification number: C25D17/02 , C23C18/1628 , C23C18/163 , C23C18/1676 , C23C18/168 , C25D3/04 , C25D17/04 , C25D17/06 , C25D21/02 , C25D21/04
Abstract: The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt.
