公开(公告)号：US20230120376A1

公开(公告)日：2023-04-20

申请号：US17798230

申请日：2021-08-06

申请人： TEIKOKU ION CO., LTD ,  NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY ,  OKAZAKI MANUFACTURING COMPANY

发明人： Takashi Nakamura ,  Takuya Kawawaki ,  Mitsuhiko Terashita ,  Masahiko Hirakami ,  Masafumi Hojo ,  Ryosuke Nakamura ,  Masao Ishikawa ,  Taketo Nishikawa ,  Toshihiko Ryo

IPC分类号： C25D17/02 ,  C25D17/06 ,  C25D17/00 ,  C25D17/12 ,  C25D7/06 ,  C25D21/10 ,  C25D5/02 ,  C25D5/10

摘要： A plating apparatus (10) is disclosed including a plating tank (9), cathodes (1a to 1f), a holding mechanism (2), at least one anode (3), and a rotation mechanism (4). The plating tank (9) contains an annularly or helically wound substrate (90) together with a plating solution. The cathodes (1a to 1f) are placed inside the plating tank (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions electrically connected to the outer periphery of the substrate (90) and holds the substrate (90) via the cathodes (1a to 1f). The anode (3) is placed at least on the inner periphery side of the substrate (90) held by the holding mechanism (2). The rotation mechanism (4) rotates at least either the substrate (90) and cathodes (1a to 1f) held by the holding mechanism (2) or the anode (3), or both, around the axis of the wound substrate (90).

公开(公告)号：US20220411951A1

公开(公告)日：2022-12-29

申请号：US17780006

申请日：2019-12-24

申请人： YKK Corporation

发明人： Masayuki IIMORI ,  Ryosuke TAKEDA

IPC分类号： C25D17/02 ,  C25D21/10

摘要： Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

公开(公告)号：US20220396896A1

公开(公告)日：2022-12-15

申请号：US17605477

申请日：2020-12-21

申请人： EBARA CORPORATION

发明人： Shao Hua Chang ,  Masaya Seki

IPC分类号： C25D17/06 ,  C25D21/10 ,  C25D17/02

摘要： Provided is a plating apparatus and a plating solution agitating method that can agitate a plating solution without using a paddle.
A plating apparatus 1000 includes a holder cover 50 disposed in a substrate holder 30 and configured to rotate with the substrate holder when the substrate holder rotates. The holder cover is configured to have a lower surface immersed in the plating solution with the lower surface positioned below a surface to be plated of a substrate. The lower surface of the holder cover is provided with at least one cover groove extending in a direction intersecting with a rotation direction of the holder cover.

公开(公告)号：US11365487B2

公开(公告)日：2022-06-21

申请号：US16904987

申请日：2020-06-18

申请人： Nippon Steel Corporation ,  Vallourec Oil and Gas France

发明人： Masanari Kimoto ,  Kazuya Ishii ,  Masahiro Oshima

IPC分类号： C25D5/02 ,  C25D7/04 ,  C25D5/08 ,  C25D21/10 ,  C25D17/02 ,  C25D5/00 ,  C25D17/00 ,  C25D17/12

摘要： An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.

公开(公告)号：US20220170174A1

公开(公告)日：2022-06-02

申请号：US17516236

申请日：2021-11-01

申请人： BOE Technology Group Co., Ltd.

发明人： Chengfei WANG ,  Junwei YAN ,  Guangcai YUAN ,  Shaodong SUN ,  Guocai ZHANG ,  Shihao DONG ,  Pengcheng DONG

IPC分类号： C25D17/08 ,  C25D21/10

摘要： The present disclosure provides a carrier liquid leakage preventing device and an electrochemical deposition apparatus. The carrier liquid leakage preventing device is used for containing liquid medicine dripping from a carrier; the carrier liquid leakage preventing device comprises: a guide rail disposed along a first direction, the first direction is a vertical direction perpendicular to the horizontal plane or a direction at an angle to the horizontal plane; a leakage preventing groove provided on the guide rail and capable of performing a lifting movement along the guide rail so as to move above or below the carrier; and a driver for driving the lifting movement of the leakage preventing groove.

公开(公告)号：US20220170161A1

公开(公告)日：2022-06-02

申请号：US17454403

申请日：2021-11-10

申请人： HOJIN PLATECH CO., LTD.

发明人： Jin Gyu IM ,  Woon Suk JUNG ,  Jong Uk KIM ,  Jin Gyu LEE ,  Duk Haeng LEE

IPC分类号： C23C18/16 ,  C25D21/10 ,  C25D21/16

摘要： Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.

公开(公告)号：US11274378B2

公开(公告)日：2022-03-15

申请号：US16857823

申请日：2020-04-24

申请人： Engineering and Software System Solutions, Inc.

发明人： Kelly V. Smith ,  Josh J. Ault ,  Jeremy J. Hall

IPC分类号： C25D17/08 ,  C25D21/10 ,  C25D5/04 ,  C25D21/04 ,  C25D17/02

摘要： The present disclosure concerns an array of chemical and electrochemical treatment cells. The cells include electrochemical cells that individually include a plating tank, a power supply, and an anode. A flight bar for supporting a cathode is moved from one tank to another for treating and plating a cathode surface. Within an electrochemical tank, the power supply operates a circuit with metal ions being eroded from the anode and being deposited onto the cathode surface. A plating apparatus is configured to simultaneously provide mechanical support, a cathodic connection, and agitation to a cathode in a plating tank. The plating apparatus includes an agitator which rotates the cathode about a fixed pivot connection to provide motion along a lateral axis and a vertical axis.

公开(公告)号：US20220064811A1

公开(公告)日：2022-03-03

申请号：US17416703

申请日：2020-01-31

申请人： MacDermid Enthone Inc.

发明人： Eric Yakobson ,  Shaopeng Sun ,  Elie Najjar ,  Thomas Richardson ,  Vincent Paneccasio, Jr. ,  Wenbo Shao ,  Kyle Whitten

IPC分类号： C25D3/18 ,  H01L21/768 ,  H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D21/10

摘要： A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.

公开(公告)号：US11261533B2

公开(公告)日：2022-03-01

申请号：US15884006

申请日：2018-01-30

申请人： Applied Materials, Inc.

发明人： David W. Groechel ,  Gang Peng ,  Robert Mikkola

IPC分类号： C25D3/44 ,  C25D5/00 ,  C25D5/18 ,  C25D3/66 ,  C25D17/02 ,  C25D21/10

摘要： The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode.

公开(公告)号：US11180864B2

公开(公告)日：2021-11-23

申请号：US16909939

申请日：2020-06-23

申请人： MODUMETAL, INC.

发明人： Christina A. Lomasney

IPC分类号： C25D17/06 ,  C25D7/06 ,  C25D21/10 ,  C25D21/12 ,  C25D5/18 ,  C25D17/00 ,  B82Y40/00 ,  C25D5/08 ,  C25D5/10 ,  C25D7/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/20 ,  C25D3/22 ,  C25D3/30 ,  C25D3/34 ,  C25D3/38 ,  C25D3/42 ,  C25D3/44 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D3/56 ,  C25D5/12 ,  C25D5/20 ,  C23C18/16

摘要： Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.