公开(公告)号：US11613481B2

公开(公告)日：2023-03-28

申请号：US16758448

申请日：2018-10-29

申请人： ATIUM AB

发明人： Björn Wickman ,  Cristian Tunsu

IPC分类号： C25D3/00 ,  C02F1/467 ,  C02F1/461 ,  C02F101/20

摘要： The present invention relates to a method for electrochemical purification of an aqueous solution comprising the steps of: providing a cathode and an anode to an aqueous solution, wherein said aqueous solution comprises soluble ions of at least one toxic heavy metal and wherein said cathode comprises an outer surface, which outer surface comprises a noble metal; applying an absolute potential to said cathode and wherein said absolute potential of said cathode drives the formation of an alloy comprising said noble metal and said at least one toxic heavy metal.

公开(公告)号：US20230062477A1

公开(公告)日：2023-03-02

申请号：US17796887

申请日：2021-02-05

申请人： Atotech Deutschland GmbH & Co. KG

发明人： Henry KUNZE ,  Ferdinand WIENER ,  Britta SCHELLER

IPC分类号： C25D17/12 ,  C25D17/00 ,  C25D21/12 ,  C25D3/00

摘要： An electrode for an apparatus (1) for electrolytically treating a workpiece (3), the apparatus (1) being of a type arranged to convey the workpiece (3) with a surface to be treated past and directed towards a surface of the electrode, is divided into segments (23a-e) at at least this surface of the electrode. The segments (23a-e) are arranged next to each other in a first direction (x). Adjacent segments (23a-e) are separated from each other along respective segment edges (24a-f) such as to allow adjacent segments (23a-e) to be maintained at different respective voltages. The segment edges (24a-f) extend at least partly in a second direction (y) from a common value (y0) of a co-ordinate in the second direction (y) to an edge (25,26) of at least an electrically conducting part of the electrode surface, the second direction (y) being transverse to the first direction (x) and corresponding to a direction of movement of the workpiece, in use. The segment edges (24a-f) between at least one pair of adjacent segments (23a-e) extend along respective paths of which an angle to the electrode surface edge (25,26) decreases from the common value (y0) of the co-ordinate to the electrode surface edge (25,26).

公开(公告)号：US10883187B2

公开(公告)日：2021-01-05

申请号：US15835536

申请日：2017-12-08

申请人： Daniel A. Scherson

发明人： Daniel A. Scherson

IPC分类号： C25D1/00 ,  C25D21/04 ,  C25D5/48 ,  C25D17/00 ,  F16L59/065 ,  H01J7/18 ,  C25D3/00 ,  H01M16/00 ,  H01J9/385 ,  C25D17/10 ,  C25D21/12 ,  F04B37/02

摘要： An apparatus for forming a vacuum in a sealed enclosure through an electrochemical reaction includes an electrochemical cell comprising a cathode and an anode supported on a solid electrolyte. The solid electrolyte is a Li-ion non-volatile electrolyte containing a dissolved metal salt. The cathode is constructed of a material with which lithium is known to form alloys. The anode is constructed of a lithium-ion containing material. The cell is operable to expose lithium metal on the cathode.

公开(公告)号：US10287698B2

公开(公告)日：2019-05-14

申请号：US15332235

申请日：2016-10-24

申请人： International Business Machines Corporation

发明人： Charles L. Arvin ,  Michael S. Gordon

IPC分类号： C25D3/32 ,  C25D3/30 ,  C25D17/12 ,  C25D17/00 ,  C25D21/06 ,  C25D5/50 ,  C25D7/12 ,  G21F9/12 ,  B01J20/06 ,  B01J20/30 ,  H01L23/00 ,  B01J20/32 ,  C25D17/10 ,  C23C18/54 ,  B01J20/02 ,  C25D3/00

摘要： A non alpha controlled plating bath including Tin species and a trace amount of Polonium species is utilized in a plating tool. The plating tool includes a Polonium filter element to remove Polonium species from the plating bath to selectively plate Tin upon a plating cathode. The filter may include a Titanium inner portion surrounding by a stannic oxide exterior. The filter may reduce the Polonium species by having the polonium absorb and then enter within the stannic oxide matrix. The filter may be located within the plating tool reservoir or filter housing. The filter may be fabricated by forming Tin upon a Titanium backbone and converting the Tin to stannic oxide.

公开(公告)号：US09809892B1

公开(公告)日：2017-11-07

申请号：US15212737

申请日：2016-07-18

申请人： Rohm and Haas Electronic Materials LLC

发明人： Yi Qin ,  Kristen Flajslik ,  Mark Lefebvre

IPC分类号： C25D3/00 ,  C25D3/54 ,  C25D21/04 ,  C25D5/02 ,  C25D7/12

CPC分类号： C25D3/54 ,  C25D5/022 ,  C25D7/123

摘要： Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.

公开(公告)号：US09752249B2

公开(公告)日：2017-09-05

申请号：US15062293

申请日：2016-03-07

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Motoki Hiraoka ,  Hiroshi Yanagimoto ,  Yuki Sato

IPC分类号： C25D17/12 ,  C25D17/00 ,  C25D5/04 ,  C25D5/08 ,  C25D3/00 ,  C25D7/12

CPC分类号： C25D17/002 ,  C25D3/00 ,  C25D5/04 ,  C25D5/08 ,  C25D7/123 ,  C25D17/12

摘要： A film forming apparatus includes: an anode; a solid electrolyte membrane that is arranged between the anode and an substrate that serves as a cathode, and that contains metal ions; a power supply that applies a voltage between the anode and the substrate in a state in which the solid electrolyte membrane is in contact with the substrate from above; and an oscillating portion configured to oscillate at least the anode in the state in which the solid electrolyte membrane is in contact with the substrate.

公开(公告)号：US09745665B2

公开(公告)日：2017-08-29

申请号：US14396348

申请日：2013-04-16

申请人： Atotech Deutschland GmbH

发明人： Dominik Britz ,  Bernd Schmitt ,  Bernd Böse ,  Frank Mücklich ,  Christian Selzner

IPC分类号： C25D5/00 ,  C25D7/00 ,  C25D3/00 ,  C25D3/38 ,  C25D17/28 ,  C25D17/00 ,  C25D17/06 ,  H05K3/24

CPC分类号： C25D17/28 ,  C25D17/005 ,  C25D17/06 ,  H05K3/241

摘要： For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.

公开(公告)号：US09481940B2

公开(公告)日：2016-11-01

申请号：US14315390

申请日：2014-06-26

申请人： International Business Machines Corporation ,  Ancosys GmbH

发明人： Charles L. Arvin ,  Jürg Stahl

IPC分类号： C25D3/00 ,  C25D3/56 ,  C25D21/00 ,  C23F13/00 ,  C25D3/30 ,  C25D3/46 ,  C25D21/12

CPC分类号： C25D3/56 ,  C23F13/005 ,  C25D3/30 ,  C25D3/46 ,  C25D3/60 ,  C25D3/64 ,  C25D17/10 ,  C25D21/00 ,  C25D21/12

摘要： Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

公开(公告)号：US08961630B2

公开(公告)日：2015-02-24

申请号：US13464483

申请日：2012-05-04

申请人： Oleg A. Mazyar

发明人： Oleg A. Mazyar

IPC分类号： B24D3/10 ,  B24D18/00 ,  C25D3/00 ,  C25F5/00

CPC分类号： B24D3/10 ,  B24D18/0018 ,  B24D18/009 ,  B24D99/005

摘要： Methods of forming a cutting element include immersing at least a portion of a volume of polycrystalline diamond in a liquid electrolytic solution, applying a voltage between the polycrystalline diamond and a cathode in contact with the liquid electrolytic solution, and removing at least a portion of metal catalyst from interstitial spaces between adjacent diamond grains. The polycrystalline diamond includes interbonded diamond grains and metal catalyst particles in the interstitial spaces between adjacent grains of polycrystalline diamond material. Some methods include forming a barrier over a portion of a volume of polycrystalline diamond and transferring at least a portion of the metal catalyst from a portion of the polycrystalline diamond not covered by the barrier to a liquid electrolyte. Some methods include encapsulating a volume of polycrystalline diamond in a barrier and selectively removing a portion of the barrier from a first portion of the volume of polycrystalline diamond.

摘要翻译： 形成切割元件的方法包括将至少一部分体积的多晶金刚石浸入液体电解液中，在多晶金刚石和与液体电解液接触的阴极之间施加电压，并除去至少一部分金属 相邻金刚石颗粒间隙间的催化剂。 多晶金刚石在多晶金刚石材料的相邻颗粒之间的间隙中包括相互结合的金刚石晶粒和金属催化剂颗粒。 一些方法包括在体积的多晶金刚石的一部分上形成阻挡层，并将金属催化剂的至少一部分从未被阻挡层覆盖的多晶金刚石的一部分转移到液体电解质。 一些方法包括将一定体积的多晶金刚石封装在阻挡层中，并从多晶金刚石体积的第一部分选择性地去除一部分阻挡层。

公开(公告)号：US08939774B2

公开(公告)日：2015-01-27

申请号：US13674894

申请日：2012-11-12

申请人： Jorg Scholvin ,  Anthony Zorzos ,  Clifton Fonstad ,  Edward Boyden

发明人： Jorg Scholvin ,  Anthony Zorzos ,  Clifton Fonstad ,  Edward Boyden

IPC分类号： H01R12/00 ,  G01R1/073 ,  H01R4/02 ,  B23K20/00 ,  C25D3/00 ,  H01R13/03 ,  H05K1/00 ,  H05K3/24 ,  C25D5/02 ,  C23C18/16 ,  H05K1/18

CPC分类号： G01R1/07314 ,  B23K20/00 ,  C23C18/1608 ,  C25D3/00 ,  C25D5/022 ,  H01R4/027 ,  H01R13/03 ,  H05K1/00 ,  H05K1/18 ,  H05K3/242 ,  H05K2201/10083

摘要： In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.

摘要翻译： 在本发明的示例性实施方案中，通过电镀在两个正交表面之间制造电连接。 两个表面分开（电连接除外）间隔不超过100微米。 跨越间隙可以制造多个电连接。 在准备步骤中，两个表面上的导电焊盘可以被单独地电镀以形成“凸块”，这使得在最后的电镀步骤中更容易桥接剩余的间隙。 或者，可以使用无电沉积代替电镀。 在示例性实施方案中，可以通过将阵列结构插入到正交基板中来组装3D探针阵列。 阵列结构可以通过包括侧钩，稳定器，底钩，对准部分和背板的机械装置相对于基板对准和保持就位。