公开(公告)号：US12191178B2

公开(公告)日：2025-01-07

申请号：US17682235

申请日：2022-02-28

Applicant: EBARA CORPORATION

Inventor： Jumpei Fujikata ,  Yuji Araki ,  Tensei Sato ,  Ryuya Koizumi

IPC: H01L21/67 ,  C25D3/12 ,  G05B19/05 ,  G05B19/418 ,  G05B23/02 ,  H01L21/677 ,  H01L21/687 ,  C25D17/00 ,  C25D17/02 ,  C25D17/10 ,  C25D21/06 ,  C25D21/10 ,  C25D21/12

Abstract: A semiconductor manufacturing apparatus including: a first device; a first calculation circuit that calculates one or more feature quantities of the first device from detected physical quantities; and a failure prediction circuit that determines a portion of model data with a minimum deviation between the measured feature quantities vector comprising the measured one or more feature quantities and a feature quantities vector comprising one or more feature quantities at each time in the plurality of pieces of model data, and calculates a predicted time until failure from a difference between the failure time point in the determined piece of model data and a point in time in the determined piece of model data at which the deviation between the measured feature quantities vector and the feature quantities vector at each time of the plurality of portions of model data is the minimum; and stops the receiving of a new substrate to prevent an introduction of defects on the new substrate.

公开(公告)号：US20240417876A1

公开(公告)日：2024-12-19

申请号：US18822369

申请日：2024-09-02

Applicant: Atlas Magnetics

Inventor： John Othniel McDonald ,  Zachary Zimits ,  Daniel Smallwood

IPC: C25D3/12 ,  C25D3/20 ,  C25D3/44 ,  C25D5/10 ,  C25D7/00 ,  H01F3/00 ,  H01F41/26

Abstract: An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

公开(公告)号：US12147200B2

公开(公告)日：2024-11-19

申请号：US17692303

申请日：2022-03-11

Applicant: ETA SA MANUFACTURE HORLOGÈRE SUISSE

Inventor： Serge Nicoud ,  Sébastien Roder

IPC: G04D3/00 ,  C25D3/12 ,  C25D7/00 ,  G04B15/14

Abstract: A method for manufacturing a horological mobile (10) including: depositing a first thin layer (11) with a first material including at least nickel, the periphery of which defines the contour of the geometry of the horological mobile (10); depositing an intermediate layer (12), with a second material including at least nickel and phosphorus, so as to cover a face of the first thin layer (11), the periphery of which corresponds to that of the geometric shape of the first thin layer (11); depositing a second thin layer (13) with the first material, so as to cover a face of the intermediate layer (12), the periphery of which corresponds to that of the geometric shape of the first thin layer (11), wherein the first and the second thin layer (11, 13) are poorer in phosphorus than the intermediate layer (12), or do not contain any phosphorus.

公开(公告)号：US20240368782A1

公开(公告)日：2024-11-07

申请号：US18655528

申请日：2024-05-06

Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Jinhan CHO ,  Jeongmin MO ,  Youn Ji KO ,  Wondo CHOI

IPC: C25B11/053 ,  C23C14/20 ,  C25B1/04 ,  C25B11/056 ,  C25B11/069 ,  C25B11/093 ,  C25B11/095 ,  C25B11/097 ,  C25D3/12 ,  C25D7/00

Abstract: The present invention relates to a fabric-type titanium oxide (TiOx)-based porous water electrolysis electrode, a method for preparing the same, and a water electrolysis device comprising the same.

公开(公告)号：US12110598B2

公开(公告)日：2024-10-08

申请号：US18235219

申请日：2023-08-17

Applicant: Osaka Gas Co., Ltd.

Inventor： Mitsuaki Echigo ,  Hisao Ohnishi

IPC: C23C8/18 ,  C22C38/50 ,  C23C28/00 ,  C23C28/04 ,  C25D3/12 ,  C25D5/48 ,  H01M8/1226

CPC classification number: C23C8/18 ,  C22C38/50 ,  C23C28/04 ,  C23C28/345 ,  C25D3/12 ,  C25D5/48 ,  H01M8/1226

Abstract: Provided is an alloy material including a metal oxide thin layer that can be formed using a simple method at low cost and can further suppress volatilization of Cr, which causes deterioration of a fuel cell, compared with a case where conventional expensive materials are used. Disclosed is a manufacturing method for an alloy material including a coating treatment step for coating a substrate made of a Fe—Cr based alloy with Co, and an oxidation treatment step for performing oxidation treatment on the substrate in a moisture-containing atmosphere after the coating treatment step.

公开(公告)号：US12077877B2

公开(公告)日：2024-09-03

申请号：US17900803

申请日：2022-08-31

Applicant: Atlas Magnetics

Inventor： John Othniel McDonald ,  Daniel Smallwood ,  Zach Zimits

IPC: C25D3/20 ,  C25D3/12 ,  C25D3/44 ,  C25D5/10 ,  C25D7/00 ,  H01F3/00 ,  H01F41/26

CPC classification number: C25D3/12 ,  C25D3/20 ,  C25D3/44 ,  C25D5/10 ,  C25D7/001 ,  H01F3/00 ,  H01F41/26

Abstract: An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

公开(公告)号：US12031213B2

公开(公告)日：2024-07-09

申请号：US17595570

申请日：2020-07-09

Applicant: SHOWA DENKO K.K.

Inventor： Akira Furuya ,  Tadaaki Kojima ,  Hiroshi Suzuki ,  Fumiaki Naka

IPC: B32B15/01 ,  B32B3/10 ,  B32B3/26 ,  B32B3/30 ,  B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00 ,  C25D3/12 ,  H01J37/32 ,  C22C38/44 ,  C23C16/44

CPC classification number: C23C28/322 ,  B32B3/10 ,  B32B3/266 ,  B32B3/30 ,  B32B15/01 ,  B32B15/015 ,  B32B15/017 ,  B32B15/018 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/1848 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/02 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C23C28/321 ,  C23C28/345 ,  C23C30/00 ,  C23C30/005 ,  C25D3/12 ,  H01J37/32477 ,  C22C38/44 ,  C23C16/4404 ,  C23C18/1824 ,  Y10T428/1259 ,  Y10T428/12597 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/249953 ,  Y10T428/26 ,  Y10T428/265

Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

公开(公告)号：US12018395B2

公开(公告)日：2024-06-25

申请号：US17630274

申请日：2020-07-27

Applicant: TOYO KOHAN CO., LTD.

Inventor： Shinichirou Horie ,  Etsuro Tsutsumi ,  Toshifumi Koyanagi ,  Shunki Obata ,  Michio Kawamura ,  Koh Yoshioka ,  Naoharu Harada ,  Tsuyoshi Irie ,  Yonosuke Yoshii

IPC: C25D3/12 ,  C25D5/00 ,  C25D5/48

CPC classification number: C25D3/12 ,  C25D5/48 ,  C25D5/605

Abstract: [Object]
To provide a roughened nickel-plated material in which the formation unevenness such as generation of the unevenness or grooves in a roughened nickel plated layer is restrained.
[Solving Means]
A roughened nickel-plated material including a base material that is a rolled material, and a roughened nickel plated layer formed on at least one surface of the base material, in which SRzjis of the surface of the roughened nickel plated layer is equal to or more than 2 μm, and, letting a maximum height of the roughened nickel plated layer be SRz, a valley region B in a given virtual planer region A as observed at a height position of SRz×0.25 satisfies the following (i). (i) The length of the valley region B in the rolling direction RD of the base material is less than 40 μm in a direct distance.

公开(公告)号：US20240161939A1

公开(公告)日：2024-05-16

申请号：US18474211

申请日：2023-09-25

Applicant: Nuclidium AG

Inventor： Leila JAAFAR-THIEL ,  Luqman Mukhtar ISRAD ,  Attila MOLNAR ,  Markus Josef BAIER

IPC: G21G1/00 ,  C25D3/12 ,  G21G1/04

CPC classification number: G21G1/001 ,  C25D3/12 ,  G21G1/04 ,  G21G2001/0094

Abstract: The present disclosure is related to novel solid target systems that produce novel high-purity radionuclide compositions using medical cyclotrons, the compositions are of suitable radionuclidic and chemical purity for use in radiopharmaceutical applications, for example, diagnostic imaging and targeted-radionuclide therapy in nuclear medicine.

公开(公告)号：US20240133040A1

公开(公告)日：2024-04-25

申请号：US17971898

申请日：2022-10-23

Applicant: General Electric Company

Inventor： Bangalore Aswatha Nagaraj ,  Liming Zhang

IPC: C23C28/02 ,  B32B15/01 ,  C23C10/08 ,  C23C10/60 ,  C25D3/12 ,  C25D3/50 ,  C25D5/12 ,  C25D5/50

CPC classification number: C23C28/022 ,  B32B15/017 ,  C23C10/08 ,  C23C10/60 ,  C25D3/12 ,  C25D3/50 ,  C25D5/12 ,  C25D5/50

Abstract: Methods of forming a coating system on a surface of a cobalt-based superalloy component are provided. The method includes forming a nickel-based primer layer on the surface of the cobalt-based superalloy component; forming an intermediate nickel-containing layer on the nickel-based primer layer; and heat treating the cobalt-based superalloy component to form a diffusion coating on the surface of the cobalt-based superalloy component. The intermediate nickel-containing layer includes nickel, chromium, and aluminum. Coated cobalt-based superalloy components formed from such a method are also provided.