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公开(公告)号：US20250070115A1
公开(公告)日：2025-02-27
申请号：US18942105
申请日：2024-11-08
Applicant: Pure Lithium Corporation
Inventor： Donald R. SADOWAY
Abstract: Methods are proposed for manufacturing dendrite-resistant lithium metal electrodes suitable for incorporation into lithium metal batteries. In an embodiment, the method involves first electroplating a copper sheet onto a surface of a single crystal of silicon, the silicon being doped to form a p-type or an n-type semiconductor, and then further electroplating the copper sheet with lithium metal. The lithium-electroplated copper sheet thus manufactured provides a lithium electrode that is resistant to dendrite formation during cycling of lithium metal batteries when compared to conventionally manufactured lithium electrodes. Methods are further provided of manufacturing lithium sheets by directly electroplating lithium metal onto single crystals of doped silicon, the lithium sheets configured for incorporation into lithium metal electrodes that are resistant to dendrite formation during cycling of lithium metal batteries.
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公开(公告)号：US12203190B2
公开(公告)日：2025-01-21
申请号：US16940934
申请日：2020-07-28
Applicant: THE BOEING COMPANY
Inventor： Stephen P. Gaydos , Vijaykumar S. Ijeri , Om Prakash , Trilochan Mishra , Raghuvir Singh , Shashi Kant Tiwari
Abstract: The present disclosure provides electrolyte solutions for electrodeposition of zinc-iron alloys, methods of forming electrolyte solutions, and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine with a metal salt. An electrolyte solution can be formed by dissolving an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine in water or an aqueous solution. Electrodepositing zinc-iron alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and iron onto the cathode.
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公开(公告)号：US20240417876A1
公开(公告)日：2024-12-19
申请号：US18822369
申请日：2024-09-02
Applicant: Atlas Magnetics
Inventor： John Othniel McDonald , Zachary Zimits , Daniel Smallwood
Abstract: An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.
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公开(公告)号：US12163217B2
公开(公告)日：2024-12-10
申请号：US17278139
申请日：2019-09-13
Inventor： Christian Manasterski , Vladislav Spassov , Cédric Faure
IPC: C23C16/40 , C22C5/08 , C23C16/455 , C25D5/00 , C25D5/10
Abstract: A substrate includes a final silver-plated surface protected against silver tarnishing by a protective coat having a thickness between 1 nm and 200 nm, the protective coat includes a first coat of Al2O3 deposited on said final silver-plated surface and having a thickness between 0.5 nm and 100 nm, and on the first coat of Al2O3, a second coat of TiO2 having a thickness between 0.5 nm and 100 nm, the substrate including a coat of a silver and copper alloy comprising between 0.1% and 10% by weight of copper with respect to the total weight of the alloy, forming said final silver-plated surface, said coat of a silver and copper alloy having a thickness between 1000 nm and 3000 nm. Embodiments also relate to a method for manufacturing such a substrate.
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5.发明授权公开(公告)号：US12139811B2
公开(公告)日：2024-11-12
申请号：US17779955
申请日：2020-10-15
Applicant: YMT CO.,LTD.
Inventor： Hyun Woo Jeon , Bo Mook Chung , Sung Wook Chun
Abstract: The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.
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Patent Agency Ranking
公开(公告)号：US12089331B2
公开(公告)日：2024-09-10
申请号：US17314131
申请日：2021-05-07
Applicant: Aplus Semiconductor Technologies Co., Ltd.
Inventor： Cheng-Neng Chen , Sui-Ho Tsai , Yun-Nan Wang , Chiao-Hui Wang
IPC: H05K1/14 , C23C14/34 , C23C14/58 , C23C18/16 , C23C28/02 , C25D5/02 , C25D5/10 , G03F7/004 , G03F7/20 , H05K1/11
CPC classification number: H05K1/147 , C23C14/34 , C23C14/5873 , C23C18/1637 , C23C28/023 , C25D5/022 , C25D5/10 , G03F7/0041 , G03F7/2016 , H05K1/11 , H05K2201/032 , H05K2201/0338 , H05K2201/0341
Abstract: A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.
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公开(公告)号：US12077877B2
公开(公告)日：2024-09-03
申请号：US17900803
申请日：2022-08-31
Applicant: Atlas Magnetics
Inventor： John Othniel McDonald , Daniel Smallwood , Zach Zimits
CPC classification number: C25D3/12 , C25D3/20 , C25D3/44 , C25D5/10 , C25D7/001 , H01F3/00 , H01F41/26
Abstract: An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.
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公开(公告)号：US12076965B2
公开(公告)日：2024-09-03
申请号：US16346843
申请日：2017-11-02
Applicant: MODUMETAL, INC.
Inventor： Christina A. Lomasney
CPC classification number: B32B3/12 , C23C18/1644 , C23C28/021 , C25D3/562 , C25D5/10 , C25D5/18 , C25D5/605 , C25D5/611 , C25D5/617 , C25D5/619 , C25D5/627 , B32B15/01
Abstract: The present disclosure provides articles comprising a laminate material having a void volume of at least 40%, having a lattice structure comprising a plurality of interconnected struts forming polyhedrons in a series that extends in three dimensions, or both, where the laminate materials have an interface density of at least 2.0 interfaces/micrometer (μm). Also described are methods for forming the same.
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公开(公告)号：US20240191429A1
公开(公告)日：2024-06-13
申请号：US18410501
申请日：2024-01-11
Applicant: NV BEKAERT SA
Inventor： Baoxing WANG , Yunfang TANG , Yohann HAMON
IPC: D07B1/06 , B21C23/08 , C22C9/04 , C25D3/20 , C25D3/22 , C25D3/38 , C25D5/10 , C25D5/50 , C25D7/06
CPC classification number: D07B1/0666 , B21C23/08 , C22C9/04 , C25D3/20 , C25D3/22 , C25D3/38 , C25D5/10 , C25D5/50 , C25D7/0607 , D07B2205/3025 , D07B2205/3089 , Y10T428/12333
Abstract: A steel cord that is suitable for reinforcing rubber articles such as tires. The inventive steel cord enables to completely eliminate the presence of cobalt in a tire when combined with the proper cobalt free compound. Advantageously the steel cord adheres equally well to rubbers containing organic cobalt salts. The inventive wire is different from prior art steel cords in that the brass coating now comprises iron particles. The iron particles have a size between 10 nm and 10 000 nm. The presence of iron mitigates the adhesion retention loss of the rubber to steel cord bond in a hot and humid environment. It is a further advantage that the inventive steel cord does not contain any intentionally added cobalt thereby contributing to the elimination of harmful substances in the production area as well as the environment.
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10.发明授权公开(公告)号：US12000038B2
公开(公告)日：2024-06-04
申请号：US17863272
申请日：2022-07-12
Applicant: FABRIC8LABS, INC.
Inventor： David Pain , Andrew Edmonds , Jeffrey Herman , Charles Pateros , Kareemullah Shaik , Edward White
IPC: C23C16/04 , B33Y30/00 , C23C14/04 , C23C14/08 , C23C14/14 , C23C16/27 , C25D5/10 , C25D17/00 , B29C64/112 , B29C64/209
CPC classification number: C23C16/042 , B33Y30/00 , C23C14/042 , C23C14/08 , C23C14/14 , C23C16/278 , C25D5/10 , C25D17/00 , B29C64/112 , B29C64/209
Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.
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