公开(公告)号：US20250019853A1

公开(公告)日：2025-01-16

申请号：US18288507

申请日：2022-04-26

Applicant: VDEH-BETRIEBSFORSCHUNGSINSTITUT GMBH

Inventor： Andreas Bán

IPC: C25D3/06 ,  C25D5/18 ,  C25D17/04 ,  C25D21/18

Abstract: The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically connected component, wherein: there is an electrolyte solution containing chromium(II) in the deposition cell; the device has an electrolytic cell, which is divided by a membrane disposed in the electrolytic cell into a cathode chamber, in which there is a cathode, and an anode chamber, in which there is an anode; the cathode chamber is connected to the deposition cell by means of a line and a pump disposed in the line; the pump can pump liquid from the cathode chamber into the deposition cell and/or can pump liquid from the deposition cell into the cathode chamber.

公开(公告)号：US20240271307A1

公开(公告)日：2024-08-15

申请号：US18568465

申请日：2022-05-25

Applicant: MacDermid Enthone Inc.

Inventor： Donald Desalvo ,  Ron Blake ,  Carmichael Gugliotti ,  William J. Decesare ,  Richard A. Bellemare ,  James Watkowski ,  Ernest Long

IPC: C25D5/18 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  H05K3/42

CPC classification number: C25D5/18 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  H05K3/421 ,  H05K3/424

Abstract: A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon: (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating. DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.

公开(公告)号：US20240229282A1

公开(公告)日：2024-07-11

申请号：US18558324

申请日：2022-05-12

Applicant: Government of the United States of America, as represented by the Secretary of Commerce

Inventor： Trevor Michael Braun ,  Thomas Polk Moffat ,  Daniel Josell

IPC: C25D5/18 ,  C25D3/38 ,  H01L21/288 ,  H01L21/768

CPC classification number: C25D5/18 ,  C25D3/38 ,  H01L21/2885 ,  H01L21/76898

Abstract: Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applied electric potential; autonomously reducing the deposition potential of the recess; bifurcating the recess; forming a transition zone and moving the transition zone through the metal deposition; and reducing metal ions to form metal; and forming a resistance enhanced superconformal filling in the recess from the metal, such that forming the resistance enhanced superconformal filling occurs in consequence of autonomously reducing the deposition potential of the recess.

公开(公告)号：US12027690B2

公开(公告)日：2024-07-02

申请号：US17107931

申请日：2020-11-30

Applicant: QuantumScape Battery, Inc.

Inventor： Timothy Holme ,  Marie Mayer ,  Ghyrn Loveness ,  Zhebo Chen ,  Rainer Fasching

IPC: H01M10/052 ,  C25D3/00 ,  C25D5/00 ,  C25D5/18 ,  H01M4/04 ,  H01M4/1395 ,  H01M10/0585

CPC classification number: H01M4/045 ,  C25D3/00 ,  C25D5/18 ,  C25D5/611 ,  H01M4/1395 ,  H01M10/052 ,  H01M10/0585 ,  Y02T10/70

Abstract: The present invention is directed to battery system and operation thereof. In an embodiment, lithium material is plated onto the anode region of a lithium secondary battery cell by a pulsed current. The pulse current may have both positive and negative polarity. One of the polarities causes lithium material to plate onto the anode region, and the opposite polarity causes lithium dendrites to be removed. There are other embodiments as well.

公开(公告)号：US20240183051A1

公开(公告)日：2024-06-06

申请号：US18436968

申请日：2024-02-08

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： Zhaowei Jia ,  Jian Wang ,  Hui Wang ,  Hongchao Yang

IPC: C25D5/18 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/12 ,  C25D21/12 ,  H01L21/288 ,  H01L21/687 ,  H01L23/544

CPC classification number: C25D5/18 ,  C25D7/12 ,  C25D17/001 ,  C25D17/06 ,  C25D17/12 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/68764 ,  H01L23/544 ,  H01L2223/54493

Abstract: An electroplating apparatus for electroplating on a front surface of a wafer, the electroplating apparatus includes a plurality of anodes, the plurality of anodes forming electric fields on the front surface of the wafer. An independent electric field is formed in a designated area. The intensity of the independent electric field is independently controlled. A total amount of power received within the designated area is adjusted so as to control a plating thickness at a specified location on the front surface of the wafer.

公开(公告)号：US11916217B2

公开(公告)日：2024-02-27

申请号：US17313541

申请日：2021-05-06

Applicant: Nanoscale Components, Inc.

Inventor： Robert W. Grant ,  Matthew Sweetland ,  Asela Maha Acharige

IPC: H01M4/04 ,  H01M4/1393 ,  H01M4/1395 ,  C25D5/02 ,  C25D5/18 ,  C25D5/00 ,  C25D7/06 ,  H01M10/052 ,  H01M4/02

CPC classification number: H01M4/0452 ,  C25D5/022 ,  C25D5/18 ,  C25D5/611 ,  C25D7/0642 ,  C25D7/0657 ,  H01M4/1393 ,  H01M4/1395 ,  H01M10/052 ,  H01M2004/021

Abstract: The present invention relates to processes that may be used singly or in combination to prevent lithium (or alkali metal) plating or dendrite buildup on bare substrate areas or edges of electrode rolls during alkaliation of a battery or electrochemical cell anode composed of a conductive substrate and coatings, in which the electrode rolls may be coated on one or both sides and may have exposed substrate on edges, or on continuous or discontinuous portions of either or both substrate surfaces.

公开(公告)号：US20230357944A1

公开(公告)日：2023-11-09

申请号：US18344608

申请日：2023-06-29

Applicant: The Boeing Company

Inventor： Vijaykumar S. Ijeri ,  Om Prakash ,  Stephen P. Gaydos ,  Nitin Pandurang Wasekar ,  Govindan Sundararajan ,  Dameracharla Srinivasa Rao

IPC: C25D3/56 ,  C25D5/18 ,  C25D5/00

CPC classification number: C25D3/562 ,  C25D5/18 ,  C25D5/627 ,  C25D5/611

Abstract: An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.

公开(公告)号：US11807951B2

公开(公告)日：2023-11-07

申请号：US17524450

申请日：2021-11-11

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/02 ,  C25D5/18 ,  C25D7/12 ,  B32B15/04 ,  B32B3/26 ,  C25D5/00 ,  C25D7/00

CPC classification number: C25D3/16 ,  B32B3/26 ,  B32B15/04 ,  B32B15/043 ,  C25D5/02 ,  C25D5/18 ,  C25D5/611 ,  C25D7/00 ,  C25D7/123 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12993 ,  Y10T428/2495 ,  Y10T428/24942 ,  Y10T428/265

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

公开(公告)号：US11746877B2

公开(公告)日：2023-09-05

申请号：US16710855

申请日：2019-12-11

Applicant: Rolls-Royce Corporation

Inventor： Mark E. Bartolomeo

IPC: F16H55/14 ,  F16H55/17 ,  B33Y80/00 ,  B33Y70/00 ,  C25D5/12 ,  C25D3/56 ,  C25D5/18 ,  C25D7/00 ,  B33Y40/20 ,  B33Y10/00

CPC classification number: F16H55/14 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  C25D3/562 ,  C25D5/12 ,  C25D5/18 ,  C25D7/00 ,  F16H55/17 ,  B33Y10/00

Abstract: A mechanical component that includes a core substrate and a nano-crystalline coating on at least a portion of the core substrate. The core substrate defines a resonance damping cavity. The resonance damping cavity is configured to damp a vibration in the component at a selected frequency.

公开(公告)号：US11712744B2

公开(公告)日：2023-08-01

申请号：US17290945

申请日：2019-12-17

Applicant: SAFRAN AIRCRAFT ENGINES ,  UNIVERSITE DE LORRAINE ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： Mariem Msakni Malouche ,  Janvier Lecomte ,  Mickael Rancic ,  Nicolas Stein ,  Clotilde Boulanger

IPC: B23H3/08 ,  C25F3/22 ,  C25D5/18

CPC classification number: B23H3/08 ,  C25F3/22 ,  C25D5/18

Abstract: An electrolyte for the electrochemical machining of a γ-γ″ nickel-based superalloy, includes NaNO3 in a content of between 10% and 30% by weight relative to the total weight of the electrolyte; a complexing agent selected from sulfosalicylic acid at a pH of between 3 and 10 and nitrilotriacetic acid at a pH of between 7 and 14, the complexing agent being present in a content of between 1% and 5% by weight relative to the total weight of the electrolyte; optionally, an anionic surfactant in a content of between 1% and 5% by weight relative to the total weight of the electrolyte; optionally, NaOH in order to obtain the desired pH; and an aqueous solvent.