公开(公告)号：US12098452B2

公开(公告)日：2024-09-24

申请号：US18628786

申请日：2024-04-07

申请人： CHANGZHOU UNIVERSITY

发明人： Wei Wei ,  Libo Yao ,  Kunxia Wei ,  Xulong An ,  Dandan Wang

IPC分类号： C22F1/08 ,  C22C9/00 ,  C25D3/38 ,  C25D5/34 ,  C25D5/50 ,  C25D7/06

CPC分类号： C22C9/00 ,  C22F1/08 ,  C25D3/38 ,  C25D5/34 ,  C25D5/50 ,  C25D7/0614

摘要： A method for preparing a graphene/copper composite deformed copper-chromium-zirconium alloy layered strip is provided. The method includes: obtaining a deformed copper-chromium-zirconium alloy strip by performing a solid solution treatment on a bulk copper-chromium-zirconium alloy, and performing a room temperature equal channel extrusion and a low temperature rolling on the bulk copper-chromium-zirconium alloy after the solid solution; obtaining a graphene/copper composite deformed copper-chromium-zirconium alloy strip by preparing a graphene/copper composite deposition liquid and performing a surface electrodeposition treatment on the deformed copper-chromium-zirconium alloy strip; obtaining the graphene/copper composite deformed copper-chromium-zirconium alloy layered strip with a rolling deformation of 65%-95% by stacking the graphene/copper composite deformed copper-chromium-zirconium alloy strips for 3-7 layers, and then performing a cold rolling, a single rolling deformation being 5%-10%; and performing a vacuum aging on the graphene/copper composite deformed copper-chromium-zirconium alloy layered strip.

公开(公告)号：US20240263334A1

公开(公告)日：2024-08-08

申请号：US18202157

申请日：2023-05-25

申请人： Luxshare Precision Industry(Chuzhou), Ltd.

发明人： Weihua SHAO ,  Jiangping YANG ,  Dewei JIANG

IPC分类号： C25D5/00 ,  C25D3/12 ,  C25D3/38 ,  C25D5/14 ,  C25D5/34 ,  C25D5/50

CPC分类号： C25D5/627 ,  C25D3/12 ,  C25D3/38 ,  C25D5/14 ,  C25D5/34 ,  C25D5/50

摘要： Disclosed is a process method for controlling a glossiness of an electroplated nickel-layer, which comprises: subjecting a metal substrate to pre-treatment, copper plating process, satin-nickel plating process, semi-bright-nickel plating process, and post-treatment in turn. The present application can effectively control the surface glossiness of a nickel-layer by optimizing the process flow of the electroplated nickel-layer and process parameters in the electroplating process, so that the glossiness of the product reaches 290-310 Gu, which fully meets the specification requirements of the product glossiness of 280-350 Gu.

公开(公告)号：US20240254645A1

公开(公告)日：2024-08-01

申请号：US18160912

申请日：2023-01-27

申请人： APPLIED Materials, Inc.

发明人： Jing Xu ,  John Klocke

IPC分类号： C25D3/38 ,  C25D5/02 ,  C25D5/10 ,  C25D5/34 ,  C25D7/12 ,  H01L21/02 ,  H01L21/768

CPC分类号： C25D3/38 ,  C25D5/02 ,  C25D5/10 ,  C25D5/34 ,  C25D7/12 ,  H01L21/02002 ,  H01L21/76879

摘要： A semiconductor wafer, including a substrate, at least one via formed in the substrate, and copper electroplating inside the at least one via, where the copper electroplating comprises a first layer of nanotwin copper, and a second layer of bulk copper. Further, a method of making a semiconductor wafer, the method comprising providing a substrate; etching the substrate to form at least one via; and depositing copper electroplating inside the at least one via, wherein the copper electroplating comprises a first layer of nanotwin copper, and a second layer of bulk copper.

公开(公告)号：US11914331B2

公开(公告)日：2024-02-27

申请号：US17056669

申请日：2019-06-18

申请人： Comadur SA

发明人： Johan Romand ,  Damien Le Boudouil ,  Nicolas Aubry ,  Pierry Vuille ,  Alexandre Netuschill

IPC分类号： G04B45/00 ,  G04B19/18 ,  G04B37/22 ,  B44C1/26 ,  C25D5/34 ,  C25D7/00 ,  C25D11/16 ,  C25D5/02 ,  C25D11/02

CPC分类号： G04B45/0076 ,  B44C1/26 ,  C25D5/02 ,  C25D5/34 ,  C25D7/005 ,  C25D11/022 ,  C25D11/16 ,  G04B19/18 ,  G04B37/226

摘要： A method is for manufacturing a part including a support made of an electrically non-conductive material, the support being provided with at least one recess filled with an aesthetic element made of an electrically conductive material, and the aesthetic element forms a decoration on a side of the part that is intended to be visible. The method includes inlaying by pressing a preform intended to form the aesthetic element into the at least one recess of the support, and treating the surface of the aesthetic element. The at least one recess opens in one or more places onto a side of the part that is intended to be non-visible, to respectively form one or more contact points for carrying current across the aesthetic element during the surface treatment.

公开(公告)号：US11908698B2

公开(公告)日：2024-02-20

申请号：US17491692

申请日：2021-10-01

申请人： SEMSYSCO GMBH

发明人： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC分类号： C25D5/34 ,  H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D17/00 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14 ,  C25D21/12

CPC分类号： H01L21/2885 ,  B05C3/005 ,  B05C3/02 ,  B05C9/14 ,  C25D5/003 ,  C25D5/02 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  H01L21/76877 ,  H05K3/42

摘要： The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:



Providing a substrate with a substrate surface comprising at least one recess,
applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas,
applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and
plating the recess.

公开(公告)号：US20230227981A1

公开(公告)日：2023-07-20

申请号：US18056420

申请日：2022-11-17

申请人： Rubattel & Weyermann S.A.

发明人： Giovanni POLY ,  Jonas GROBE ,  Frédéric JEANRENAUD

IPC分类号： C23C28/02 ,  C23C14/34 ,  C23C14/16 ,  C23C14/58 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00 ,  C25D5/48 ,  G04D3/00

CPC分类号： C23C28/023 ,  C23C14/34 ,  C23C14/165 ,  C23C14/588 ,  C25D5/022 ,  C25D5/34 ,  C25D7/005 ,  C25D5/48 ,  G04D3/0092 ,  G04D3/0048

摘要： A method for manufacturing appliques on a dial for a timepiece.

公开(公告)号：US11692279B2

公开(公告)日：2023-07-04

申请号：US17746134

申请日：2022-05-17

申请人： KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

发明人： Il-Kwon Oh ,  Saewoong Oh

IPC分类号： C25D5/48 ,  C25D3/38 ,  C25D5/34 ,  B82Y30/00 ,  C01G3/02 ,  C23G1/00 ,  B82Y40/00

CPC分类号： C25D5/48 ,  B82Y30/00 ,  B82Y40/00 ,  C01G3/02 ,  C23G1/00 ,  C25D3/38 ,  C25D5/34

摘要： An exemplary embodiment relates to improving a driving speed of a shape-memory-alloy applied as an artificial muscle, and to improving heat conduction and thermal convection by growing copper nanowires on the surface of the shape-memory-alloy to improve a natural cooling rate and a driving speed of the shape-memory-alloy.

公开(公告)号：US20230095518A1

公开(公告)日：2023-03-30

申请号：US17908695

申请日：2021-01-27

申请人： SEMSYSCO GMBH

发明人： Aljbert LJATIFI ,  Herbert ÖTZLINGER ,  Franz MARKUT ,  Andreas GLEISSNER

IPC分类号： C25D5/04 ,  C25D17/08 ,  C25D5/34 ,  C25D21/04

摘要： The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate.
The method for a chemical and/or electrolytic surface treatment comprises the following steps, not necessarily in this order: mounting a substrate to be treated to a rotor unit, moving the rotor unit with the substrate into a pre-wetting chamber of the process station, applying a pre-wetting fluid to the substrate in the pre-wetting chamber, moving the rotor unit with the substrate at least partially out of the pre-wetting chamber, spinning the rotor unit with the substrate in a spinning plane to centrifugally reduce the pre-wetting fluid at a surface of the substrate, rotating the rotor unit with the substrate normal to the spinning plane so that the substrate faces away from the pre-wetting chamber, moving the rotor unit with the substrate into an electroplating chamber of the process station, applying an electrolyte liquid and an electric current to the substrate for an electroplating process on the substrate in the electroplating chamber, and moving the rotor unit with the substrate at least partially out of the electroplating chamber.

公开(公告)号：US20230035545A1

公开(公告)日：2023-02-02

申请号：US17783856

申请日：2020-10-15

申请人： POSCO

发明人： Young-Ha KIM ,  Kwon-Il KIM ,  Dae-Young KANG

IPC分类号： C25D5/34 ,  C21D8/02 ,  C25D7/06 ,  C22C38/00

摘要： The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50 mg/m2 or less.
According to the present invention, provided are a high-strength cold-rolled steel sheet and a manufacturing for manufacturing same. In the high-strength cold-rolled steel sheet, a metal layer is coated on a cold-rolled steel sheet to a thickness of nanometers, followed by annealing, thereby suppressing the formation of oxides of Si, Mn, and the like on the surface of the steel sheet to within a range in which the elution of Fe is not suppressed, and thus the high-strength cold-rolled steel sheet has improved phosphatability.

公开(公告)号：US11542619B2

公开(公告)日：2023-01-03

申请号：US17497252

申请日：2021-10-08

申请人： EBARA CORPORATION

发明人： Kazuhito Tsuji

IPC分类号： C25D5/34 ,  C25D7/12 ,  C25D21/12 ,  C25D17/00

摘要： An objective of the present invention is to prevent a prewetting liquid from remaining in an edge portion of a substrate. A plating method for subjecting a substrate to a plating treatment is provided, the substrate including a part to be plated that is exposed to a plating solution and an edge portion that is an outer region of the part to be plated. The plating method includes a first sealing step of bringing a first seal body into contact with the substrate to seal the edge portion of the substrate, a prewetting step of subjecting the sealed substrate to a prewetting treatment, a first seal removing step of removing the first seal body from the prewetted substrate, a substrate holding step of holding the substrate with a substrate holder including a second seal body, and a plating step of applying the plating solution to the substrate held by the substrate holder.