公开(公告)号：US20220119975A1

公开(公告)日：2022-04-21

申请号：US17567327

申请日：2022-01-03

申请人： Raytheon Technologies Corporation

发明人： LEI CHEN

IPC分类号： C25D5/10 ,  C25D3/22 ,  C25D3/44 ,  C25D3/56 ,  C25D5/44 ,  C23C18/54 ,  F01D5/28 ,  F04D29/38

摘要： A coating system for an aluminum component includes a substrate formed from an aluminum material, a zinc or zinc alloy sacrificial layer deposited on the substrate, and an aluminum coating deposited over the zinc or zinc alloy sacrificial layer.

公开(公告)号：US11060191B2

公开(公告)日：2021-07-13

申请号：US16331188

申请日：2018-02-22

申请人： ASAHI DENKA KENKYUSHO CO., LTD.

发明人： Masanori Mizoguchi

IPC分类号： C25D5/44 ,  C25D1/02 ,  C25D5/48 ,  C23C18/16 ,  C23C18/18 ,  C25D3/38 ,  C23C18/38 ,  C25D1/08 ,  C23F1/00 ,  C23C18/54

摘要： A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.

公开(公告)号：US20200002830A1

公开(公告)日：2020-01-02

申请号：US16567669

申请日：2019-09-11

申请人： C. UYEMURA & CO., LTD.

发明人： YUKO YOSHIOKA ,  TOMOHARU NAKAYAMA ,  HISAMITSU YAMAMOTO

IPC分类号： C25D3/38 ,  C25D5/02 ,  C25D5/44

摘要： A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

公开(公告)号：US10519562B2

公开(公告)日：2019-12-31

申请号：US15678256

申请日：2017-08-16

申请人： Fengyan Hou ,  Yuxin Wang ,  Bo Hu ,  Christopher William Goode ,  Junzhe Dong

发明人： Fengyan Hou ,  Yuxin Wang ,  Bo Hu ,  Christopher William Goode ,  Junzhe Dong

IPC分类号： C25D11/20 ,  C25D11/22 ,  C25D5/44 ,  C25D5/18 ,  C25D11/04 ,  C25D13/20 ,  C25D21/08 ,  C25D5/38 ,  C25D5/42 ,  C25D11/08 ,  C25D11/16 ,  C25D11/26 ,  C25D11/30 ,  C25D5/14 ,  C25D11/10

摘要： In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.

公开(公告)号：US20190337268A1

公开(公告)日：2019-11-07

申请号：US16473924

申请日：2017-12-26

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Yoshiaki KOBAYASHI ,  Miho YAMAUCHI

IPC分类号： B32B15/01 ,  C25D5/12 ,  C25D5/44 ,  C25D7/00 ,  H01R13/03

摘要： The present invention provides: a surface-treated material that can simply and in a short time period form a surface treatment film having an adequate adhesiveness particularly on an electroconductive substrate which is mainly formed of a base metal having a large ionization tendency and is considered to resist having a sound plating film formed thereon; and a component produced by using the same.A surface-treated material (10) of the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), and among the at least one or more layers of metal layers (3 and 4), a lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1) and continuously extend from a surface of the electroconductive substrate (1) toward an inside thereof.

公开(公告)号：US10465759B2

公开(公告)日：2019-11-05

申请号：US15547445

申请日：2016-02-18

申请人： NISSIN KOGYO CO., LTD. ,  SHINSHU UNIVERSITY

发明人： Minoru Okamoto ,  Yohei Takahashi ,  Susumu Arai ,  Miyoka Ueda

IPC分类号： F16D65/18 ,  C23C18/52 ,  C23C28/02 ,  F16J1/01 ,  F16J9/26 ,  C25D3/56 ,  C25D5/12 ,  C25D5/44 ,  C23C18/16 ,  C23C18/32 ,  F16D121/04 ,  F16D125/04

摘要： A piston has a piston main body including an aluminum alloy, and a covering layer formed on the outer surface of the piston main body, and the covering layer has a first plating layer including an iron-phosphorous alloy, and a second plating layer including a nickel-phosphorous alloy formed on the first plating layer.

公开(公告)号：US10121606B2

公开(公告)日：2018-11-06

申请号：US15151088

申请日：2016-05-10

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Katsuji Nakamura ,  Kaichi Tsuruta ,  Yuji Ozaki ,  Shigeaki Watarai ,  Hidenori Takagi ,  Yutaka Ohori

IPC分类号： H01R9/00 ,  H05K3/00 ,  H01G11/50 ,  C23C18/16 ,  C23C18/18 ,  C23C18/54 ,  H01G11/24 ,  H01G11/66 ,  H01M2/20 ,  H01M2/30 ,  H01B1/02 ,  H01B13/32 ,  C25D5/12 ,  C25D5/44 ,  C23C18/31 ,  C23C18/32 ,  C23C18/48 ,  C25D3/12 ,  C25D3/22 ,  C25D3/30 ,  C25D3/56 ,  C25D3/60 ,  H01G11/06 ,  H01G11/30 ,  H01M2/26 ,  C23C18/36 ,  C23C18/52 ,  H01M4/02

摘要： An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

公开(公告)号：US20180163317A1

公开(公告)日：2018-06-14

申请号：US15835067

申请日：2017-12-07

申请人： Applied Materials, Inc.

发明人： Balaji GANAPATHY ,  Ankur KADAM ,  Prerna S. GORADIA ,  Laksheswar KALITA ,  Tapash CHAKRABORTY ,  Vijay Bhan SHARMA

IPC分类号： C25D5/44 ,  C25D3/44 ,  C25D5/18 ,  C25D7/00

CPC分类号： C25D5/44 ,  C25D3/44 ,  C25D5/022 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D7/00 ,  C25D9/08 ,  C25D11/04

摘要： In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

公开(公告)号：US20170198624A1

公开(公告)日：2017-07-13

申请号：US15132754

申请日：2016-04-19

申请人： Hille & Müller GmbH

发明人： Annette BORISCH ,  Philip SCHMITZ ,  Ken-Dominic FLECHTNER ,  Martin SCHWAGEREIT

IPC分类号： F01N13/16 ,  C25D3/12 ,  C25D5/36 ,  F02M37/00 ,  C25D5/50 ,  C22F1/04 ,  C21D1/26 ,  C21D9/52 ,  C25D9/10 ,  C25D5/44

CPC分类号： F01N13/16 ,  C21D1/26 ,  C21D9/52 ,  C22F1/04 ,  C25D3/12 ,  C25D5/12 ,  C25D5/36 ,  C25D5/44 ,  C25D5/50 ,  C25D9/10 ,  C25D9/12 ,  F01N3/281 ,  F01N2510/08 ,  F01N2530/02 ,  F01N2530/04 ,  F01N2530/06 ,  F02M37/0017

摘要： A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

公开(公告)号：US20160336253A1

公开(公告)日：2016-11-17

申请号：US15109486

申请日：2015-10-08

申请人： SUPERUFO291 TEC

发明人： Akira FUKUI

IPC分类号： H01L23/373 ,  C25D5/44 ,  C25D5/34 ,  C25D7/12 ,  C23C18/32 ,  B22F3/24 ,  B22F7/00 ,  B22F7/04 ,  B23K1/00 ,  H01L21/48 ,  C25D3/12 ,  B22F3/16

CPC分类号： H01L23/3732 ,  B22F3/1035 ,  B22F3/105 ,  B22F3/14 ,  B22F3/16 ,  B22F3/24 ,  B22F7/008 ,  B22F7/04 ,  B22F2003/247 ,  B22F2007/042 ,  B22F2301/052 ,  B22F2301/255 ,  B22F2302/406 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  C22C26/00 ,  C23C18/16 ,  C23C18/32 ,  C25D3/12 ,  C25D5/12 ,  C25D5/34 ,  C25D5/44 ,  C25D5/50 ,  C25D7/12 ,  H01L21/4882 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2003/241

摘要： A heat dissipation substrate having a metallic layer with few defects on its surface is obtained by a process including the steps of: forming a metallic layer by plating on the surface of an alloy composite mainly composed of a powder of a principal metal, additional metal and diamond; and heating and pressurizing alloy composite coated with metallic layer, at a temperature equal to or lower than melting points of the metallic layer and the alloy composite. Consequently a heat dissipation substrate is obtained which has a coefficient of linear expansion of 6.5 ppm/K or higher and 15 ppm/K or lower as well as a degree of thermal conductivity of 420 W/m·K or higher, the substrate having a metallic layer with few defects in its surface layer and thereby allowing for a Ni-based plating on which the void percentage in the solder joint will be 5% or lower.

摘要翻译： 通过包括以下步骤的方法获得具有表面缺陷少的金属层的散热基板：通过在主要由主要金属粉末，附加金属和 钻石; 在金属层和合金复合体的熔点以下的温度下，对金属层进行加热加压合金复合体。 因此，获得了具有6.5ppm / K以上且15ppm / K以下的线膨胀系数以及420W / m·K以上的导热系数的散热基板，所述基板具有 在其表面层中几乎没有缺陷的金属层，从而允许焊接接头中的空隙率为5％以下的Ni基电镀。