Method and apparatus for manufacturing defect-free monocrystalline silicon crystal

    公开(公告)号:US11618971B2

    公开(公告)日:2023-04-04

    申请号:US17037060

    申请日:2020-09-29

    申请人: SUMCO Corporation

    IPC分类号: C30B35/00 C30B15/20 C30B15/10

    摘要: A crystal puller apparatus comprises a pulling assembly to pull a crystal from a silicon melt at a pull speed; a crucible that contains the silicon melt; a heat shield above a surface of the silicon melt; a lifter to change a gap between the heat shield and the surface of the silicon melt; and one or more computing devices to determine an adjustment to the gap using a Pv-Pi margin, at a given length of the crystal, in response to a change in the pull speed. The computer-implemented method by a computing device comprises determining a pull-speed command signal to control a diameter of the crystal; determining a lifter command signal to control a gap between a heat shield and a surface of a silicon melt from which the crystal is grown; and determining an adjustment to the gap, in response to a different pull-speed, using a Pv-Pi margin.

    SEMICONDUCTOR CRYSTAL GROWTH METHOD AND DEVICE

    公开(公告)号:US20220213614A1

    公开(公告)日:2022-07-07

    申请号:US17606694

    申请日:2020-01-16

    摘要: A semiconductor crystal growth method and device are provided. The method comprises: obtaining an initial position of a graphite crucible when used in a semiconductor crystal growth process for the first time; obtaining a current production batch of the graphite crucible which characterizes a number of times of growth processes performed by the graphite crucible so far; and loading polysilicon raw materials into a quartz crucible sleeved in the graphite crucible based on the current production batch, wherein a total weight of the materials is called a charging amount, and the charging amount is adjusted based on the current production batch to keep an initial position of a silicon melt liquid surface in the quartz crucible stable while keeping the initial position of the graphite crucible unchanged. The present invention ensures the stability of each parameter in the crystal pulling process, and enhances the crystal pulling speed and quality.

    Compound semiconductor and method for producing single crystal of compound semiconductor

    公开(公告)号:US11371164B2

    公开(公告)日:2022-06-28

    申请号:US16499165

    申请日:2017-11-09

    摘要: Provided is a large diameter InP single crystal substrate having a diameter of 75 mm or more, which can achieve a high electrical activation rate of Zn over a main surface of the substrate even in a highly doped region having a Zn concentration of 5×1018 cm−3 or more; and a method for producing the same. An InP single crystal ingot is cooled such that a temperature difference of 200° C. is decreased for 2 to 7.5 minutes, while rotating the InP single crystal ingot at a rotation speed of 10 rpm or less, and the cooled InP single crystal ingot is cut into a thin plate, thereby allowing production of the InP single crystal substrate having an electrical activation rate of Zn of more than 85% over the main surface of the substrate even in a highly doped region having a Zn concentration of 5×1018 cm−3 or more.

    NON-CONTACT SYSTEMS AND METHODS FOR DETERMINING DISTANCE BETWEEN SILICON MELT AND REFLECTOR IN A CRYSTAL PULLER

    公开(公告)号:US20220154365A1

    公开(公告)日:2022-05-19

    申请号:US17455347

    申请日:2021-11-17

    摘要: A measurement system includes a reflector defining a central passage and an opening, a measurement assembly, and a controller. The measurement assembly includes a run pin having a head that is visible through the opening, a camera to capture images through the opening in the reflector, and a laser to transmit coherent light through the opening to the head of the run pin to produce a reflection of the run pin on the surface of the silicon melt. The controller is programmed to control the laser to direct coherent light from the laser to the run pin, control the camera capture images through the opening while the coherent light is directed at the run pin, and determine a distance between the surface of the silicon melt and a bottom surface of the reflector based on a location of the reflection of the run pin in the captured images.