公开(公告)号：US12111114B2

公开(公告)日：2024-10-08

申请号：US17163217

申请日：2021-01-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hung-Hsien Huang ,  Shin-Luh Tarng ,  Ian Hu ,  Chien-Neng Liao ,  Jui-Cheng Yu ,  Po-Cheng Huang

IPC分类号： F28D15/04 ,  F28D15/02 ,  F28F13/18

CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D15/0283 ,  F28F13/187 ,  F28F2255/18

摘要： A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.

公开(公告)号：US12104856B2

公开(公告)日：2024-10-01

申请号：US15787455

申请日：2017-10-18

申请人： Kelvin Thermal Technologies, Inc.

发明人： Ryan John Lewis ,  Ronggui Yang ,  Yung-Cheng Lee

IPC分类号： F28D15/04 ,  F28D15/02 ,  H01L23/427 ,  H01L23/433 ,  B23P15/26

CPC分类号： F28D15/046 ,  F28D15/02 ,  F28D15/0233 ,  F28D15/04 ,  H01L23/427 ,  H01L23/433 ,  B23P15/26

摘要： Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.

公开(公告)号：US20240316639A1

公开(公告)日：2024-09-26

申请号：US18736877

申请日：2024-06-07

申请人： PORITE CORPORATION

发明人： Shigeyuki TANABE ,  Shinobu Aso ,  Kazuki Sadakata

IPC分类号： B22F7/08 ,  B22F3/18 ,  F28D15/04 ,  F28F21/08

CPC分类号： B22F7/08 ,  B22F3/18 ,  F28D15/04 ,  F28F21/08

摘要： Provided is a method for manufacturing a wick, which facilitates control over capillarity of the wick. A method for manufacturing a wick according to the present invention includes: a step of supplying material powder containing metal powder onto a base; a step of heating the material powder on the base to obtain a sintered compact; and a step of rolling the sintered compact. In this situation, when the material powder supplied onto the base is heated to form the sintered compact, the sheet-shaped sintered compact can be formed. Further, when the sintered compact is rolled, a void ratio of the sintered compact can be controlled after forming the sintered compact, thereby controlling the capillarity of the wick 1.

公开(公告)号：US12098865B2

公开(公告)日：2024-09-24

申请号：US18603274

申请日：2024-03-13

申请人： King Fahd University of Petroleum and Minerals

发明人： Faisal Bader Almutairi ,  Fahad Abdulaziz Alsulaiman ,  Nasiru Ishaq Ibrahim

IPC分类号： F24F5/00 ,  C02F9/00 ,  E03B1/04 ,  F28D5/02 ,  F28D15/04 ,  F28F25/06 ,  C02F1/00 ,  C02F1/28 ,  C02F1/32 ,  C02F1/68 ,  C02F103/00 ,  F28F25/00

CPC分类号： F24F5/0035 ,  C02F9/00 ,  E03B1/041 ,  F28D5/02 ,  F28D15/043 ,  F28F25/06 ,  C02F1/001 ,  C02F1/283 ,  C02F1/32 ,  C02F1/68 ,  C02F2103/002 ,  C02F2303/04 ,  F28F2025/005

摘要： An indirect evaporative cooling system for cooling a space adjacent to or containing an ablution bay is described. The indirect evaporative cooling system includes a greywater source from the ablution bay and evaporative cooler apparatus located above the space to be cooled in a dome shaped housing. The evaporative cooler apparatus includes a wet channel, at least one spray nozzle, and a dry channel. The at least one spray nozzle is located at the top of the evaporative cooler apparatus and is fluidly connected to the greywater source and the wet channel. The wet channel is located directly above the dry channel. A first side of the dry channel is connected to a first opening with a fan and outside air.

公开(公告)号：US20240302108A1

公开(公告)日：2024-09-12

申请号：US18668253

申请日：2024-05-20

申请人： National Tsing Hua University

发明人： Shwin-Chung Wong

IPC分类号： F28D15/04 ,  F28D15/02 ,  H05K7/20

CPC分类号： F28D15/046 ,  F28D15/0233 ,  H05K7/20336 ,  F28D15/04

摘要： A vapor chamber system, includes a heat source and a vapor chamber device. The vapor chamber device includes a first casing, a second casing, a second capillary structure and a third capillary structure. The first casing includes a first plate, and a first capillary structure. The second casing is stacked on the first casing. The second capillary structure is disposed between the first capillary structure and the supporting posts of the second casing. The third capillary structure is disposed at a zone of the inner surface of the first plate, the zone is within a projection of the heat source projected onto the inner surface, and an area of the zone is smaller than an area of the projection of the heat source.

公开(公告)号：US12072152B2

公开(公告)日：2024-08-27

申请号：US18241073

申请日：2023-08-31

申请人： VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.

发明人： Lei Lei Liu ,  Xiao Min Zhang ,  Xue Mei Wang

IPC分类号： F28D15/02 ,  F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/046

摘要： This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

公开(公告)号：US20240280276A1

公开(公告)日：2024-08-22

申请号：US18603274

申请日：2024-03-13

申请人： King Fahd University of Petroleum and Minerals

发明人： Faisal Bader ALMUTAIRI ,  Fahad Abdulaziz ALSULAIMAN ,  Nasiru Ishaq IBRAHIM

IPC分类号： F24F5/00 ,  C02F1/00 ,  C02F1/28 ,  C02F1/32 ,  C02F1/68 ,  C02F9/00 ,  C02F103/00 ,  E03B1/04 ,  F28D5/02 ,  F28D15/04 ,  F28F25/00 ,  F28F25/06

CPC分类号： F24F5/0035 ,  C02F9/00 ,  E03B1/041 ,  F28D5/02 ,  F28D15/043 ,  F28F25/06 ,  C02F1/001 ,  C02F1/283 ,  C02F1/32 ,  C02F1/68 ,  C02F2103/002 ,  C02F2303/04 ,  F28F2025/005

摘要： An indirect evaporative cooling system for cooling a space adjacent to or containing an ablution bay is described. The indirect evaporative cooling system includes a greywater source from the ablution bay and evaporative cooler apparatus located above the space to be cooled in a dome shaped housing. The evaporative cooler apparatus includes a wet channel, at least one spray nozzle, and a dry channel. The at least one spray nozzle is located at the top of the evaporative cooler apparatus and is fluidly connected to the greywater source and the wet channel. The wet channel is located directly above the dry channel. A first side of the dry channel is connected to a first opening with a fan and outside air.

公开(公告)号：US20240274306A1

公开(公告)日：2024-08-15

申请号：US18623667

申请日：2024-04-01

申请人： Westinghouse Electric Company LLC

发明人： Abdul R. Dulloo ,  Alex Levinsky ,  Richard F. Wright

IPC分类号： G21C15/257 ,  F28D15/04 ,  F28D21/00

CPC分类号： G21C15/257 ,  F28D15/046 ,  F28D2021/0054

摘要： A heat pipe configured to remove heat from a nuclear reactor core is disclosed herein. The heat pipe can include an inner housing defining an inner volume configured to accommodate a heat source and an outer housing configured about the inner housing and the heat source. A wick can be positioned between at least a portion of the inner housing and at least a portion of the outer housing, wherein the wick can include a capillary material, and wherein the wick can define an intermediate volume between the inner housing and the outer housing. A working fluid can be positioned within the intermediate volume, wherein the working fluid can evaporate at a first end of the heat pipe and condense at a second end of the heat pipe adjacent to a heat exchanger, and wherein the wick can return condensed working fluid to the first end of the heat pipe.

公开(公告)号：US12058841B2

公开(公告)日：2024-08-06

申请号：US17508689

申请日：2021-10-22

申请人： Furukawa Electric Co., Ltd.

发明人： Hirofumi Aoki ,  Yoshikatsu Inagaki ,  Yoshinori Nakamura ,  Hideaki Kawabata

IPC分类号： G06F1/16 ,  F28D15/04 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC分类号： H05K7/20318 ,  F28D15/04 ,  H05K7/20327

摘要： A cooling device that can reduce heat resistance by improving a heat exchange action of a condensation tube, and can exhibit excellent cooling characteristics, and a cooling system using the cooling device are provided. The cooling device includes a container to which at least one heating element is thermally connected, a primary refrigerant sealed inside the container, a condensation tube through which a secondary refrigerant flows and which penetrates through a gaseous phase portion inside the container, and a porous member provided at an outer surface of the condensation tube.

公开(公告)号：US20240255229A1

公开(公告)日：2024-08-01

申请号：US18104582

申请日：2023-02-01

申请人： Kelvin Cooling, Inc.

发明人： Zilong Wang ,  Qidong Sun

IPC分类号： F28D15/04 ,  F28D15/02

CPC分类号： F28D15/046 ,  F28D15/0266 ,  F28D2021/0028

摘要： Aspects of the disclosure are directed to thermal management. In accordance with one aspect, an apparatus includes a metal mesh layer; a porous metal powder layer coupled to the metal mesh layer; and a metal substrate coupled to the porous metal powder layer. In accordance with one aspect, a method includes introducing a working fluid from a condenser structure into a boiler structure to generate a vaporized fluid; transporting the vaporized fluid through a hybrid wick structure coupled to the boiler structure to generate a pressurized fluid; and injecting the pressurized fluid into the condenser structure to convert the pressurized fluid into a condensed fluid.