NORMAL-INCIDENCE IN-SITU PROCESS MONITOR SENSOR

    公开(公告)号:US20240222100A1

    公开(公告)日:2024-07-04

    申请号:US18605526

    申请日:2024-03-14

    摘要: An apparatus for in-situ etching monitoring in a plasma processing chamber includes a continuous wave broadband light source, an illumination system configured to illuminate an area on a substrate with an incident light beam being directed from the continuous wave broadband light source at normal incidence to the substrate, a collection system configured to collect a reflected light beam being reflected from the illuminated area on the substrate, and to direct the reflected light beam to a first light detector, and a controller. The controller is configured to determine a property of the substrate or structures formed thereupon based on a reference light beam and the reflected light beam, and control an etch process based on the determined property. The reference light beam is generated by the illumination system by splitting a portion of the incident light beam and directed to a second light detector.

    Device for detecting substance being measured

    公开(公告)号:US12000783B2

    公开(公告)日:2024-06-04

    申请号:US17626124

    申请日:2020-07-10

    摘要: A detection device of a substance to be measured according to an embodiment of the present disclosure is intended to conveniently detect a bio-related substance such as a bacteria or a fungus. The detection device according to an embodiment of the present disclosure includes, a container that contains solution and a composite particle combining a substance to be measured and a magnetic labeling substance, a magnetic field applying unit that applies a magnetic field to a predetermined region so as to collect the composite particles, wherein spatial light is incident to the predetermined region other than lower region of the container, an imaging unit for imaging the composite particles collected in the predetermined region where the spatial light is incident, a detection unit that detects the composite particles based on the image captured by the imaging unit.

    Adhesion defect detection apparatus and adhesion defect detection method using the same

    公开(公告)号:US11624709B2

    公开(公告)日:2023-04-11

    申请号:US17403838

    申请日:2021-08-16

    发明人: Tae Jin Hwang

    摘要: An adhesion defect detection apparatus includes an inspection window having a first dummy area, a second dummy area, and an inspection area disposed between the first dummy area and the second dummy area. A first shape changer is disposed on the inspection window. The first shape changer is configured to change a shape of the inspection window in a first direction. A second shape changer is disposed outside of both the first dummy area and the second dummy area. The second shape changer is configured to change a shape of the inspection window in a second direction that is perpendicular to the first direction.