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公开(公告)号：US20230138105A1
公开(公告)日：2023-05-04
申请号：US17911827
申请日：2021-03-17
申请人： NHK Spring Co., Ltd.
发明人： Tsuyoshi Inuma , Shuji Takahashi , Kazuya Soma , Takashi Nidaira , Yuya Hironaka
摘要： A probe unit includes: a plurality of first contact probes each coming into contact with an electrode to be contacted on one end side in a longitudinal direction; a second contact probe connected to an external ground; and a probe holder configured to hold the first and second contact probes, the probe holder including a first hollow portion configured to allow the first contact probes to be inserted therethrough and hold the first contact probes, a second hollow portion configured to allow the second contact probe to be inserted therethrough and hold the second contact probe, and a through-hole provided around the first hollow portion, wherein the probe holder includes a conductive portion that constitutes the through-hole and electrically connects the through-hole and the second contact probe.
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公开(公告)号：US20230127957A1
公开(公告)日：2023-04-27
申请号：US17910363
申请日：2021-02-22
发明人： Kohei TSUMURA
摘要： A circuit board inspection apparatus includes an inspection processing portion that inspects an electric circuit of a board to be inspected, an inspection jig, and a position detector used to position the inspection processing portion relative to the board to be inspected. The inspection jig includes a probe unit having a probe, a first board, a second board located in parallel with the first board in a thickness direction of the first board, an electrical connection portion that electrically connects the first board and the second board, and a second board holding portion that holds the second board from the first board and holds the probe unit on a side opposite to the first board side. The second board holding portion has a position detection opening penetrating in the thickness direction, at a position overlapping the position detector as viewed from the thickness direction of the second board holding portion.
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公开(公告)号：US11624679B2
公开(公告)日：2023-04-11
申请号：US17039878
申请日：2020-09-30
发明人： Michitaka Okuta , Yuki Saito , Toshinaga Takeya , Shou Harako , Jukiya Fukushi , Minoru Sato , Hisao Narita
摘要： An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.
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公开(公告)号：US11609245B2
公开(公告)日：2023-03-21
申请号：US17041871
申请日：2019-05-22
发明人： Dong-hoon Park , Jae-hwan Jeong
摘要： Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.
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公开(公告)号：US20230084616A1
公开(公告)日：2023-03-16
申请号：US17799698
申请日：2021-02-09
申请人： KYOCERA Corporation
发明人： Daisuke JINGU , Hidenori TANAKA
摘要： A heater substrate has an insulating substrate having a first surface and a second surface on the opposite side relative to the first surface and at least one heating element of spiral shape including plural heater wire pieces and positioned in or on the insulating substrate. The heating element of spiral shape has at least one adjustment section including a turn of all or some of the plural heater wire pieces. The plural heater wire pieces include a first heater wire piece and a second heater wire piece adjacent to the inner side of the first heater wire piece. In the adjustment section, the length of the first heater wire piece is smaller than the length of the second heater wire piece.
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6.发明授权公开(公告)号：US11598789B2
公开(公告)日：2023-03-07
申请号：US17506081
申请日：2021-10-20
申请人： FormFactor, Inc.
发明人： Martin Schindler , Stefan Kreissig , Torsten Kiel
摘要： Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.
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公开(公告)号：US11592465B2
公开(公告)日：2023-02-28
申请号：US17391998
申请日：2021-08-02
申请人： AEHR TEST SYSTEMS
摘要： A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
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公开(公告)号：US11585832B2
公开(公告)日：2023-02-21
申请号：US17221368
申请日：2021-04-02
申请人： MPI Corporation
发明人： Chung-Yen Huang , Chih-Wei Wen , Sheng-Feng Xu , Fuh-Chyun Tang , Chih-Hao Ho
IPC分类号： G01R1/073
摘要： A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.
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公开(公告)号：US11579182B1
公开(公告)日：2023-02-14
申请号：US16788213
申请日：2020-02-11
IPC分类号： G01R31/27 , G01R1/073 , G01R31/26 , H01L33/36 , H01L21/66 , H01L33/58 , F21V8/00 , H01L33/46
摘要： Enhanced probe cards, for testing unpackaged semiconductor die including numerous discrete devices (e.g., LEDs), are described. The die includes anodes and cathodes for the LEDs. Via a single touchdown event, the probe card may simultaneously operate each of the LEDs. The LEDs' optical output is measured and the performance of the die is characterized. The probe card includes a conductive first contact and another contact that are fabricated from a conformal sheet or film. Upon the touchdown event, the first contact makes contact with each of the die's anodes and the other contact makes contact with each of the die's cathodes. The vertical and sheet resistance of the contacts are sufficient such that the voltage drop across the vertical dimension of the contacts is approximately an order of magnitude greater than the operating voltage of the LEDs and current-sharing between adjacent LEDs is limited by the sheet resistance.
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公开(公告)号：US20230045361A1
公开(公告)日：2023-02-09
申请号：US17572371
申请日：2022-01-10
发明人： Ming-Cheng HSU , Wen-Chun Tu
IPC分类号： G01R1/073
摘要： A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.
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