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公开(公告)号:US12099083B2
公开(公告)日:2024-09-24
申请号:US17680204
申请日:2022-02-24
发明人: Chen-Nan Chen
CPC分类号: G01R31/2808 , G01R1/07307
摘要: A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof. The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.
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公开(公告)号:US12066457B2
公开(公告)日:2024-08-20
申请号:US18316211
申请日:2023-05-11
发明人: Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
IPC分类号: G01R1/04 , G01R1/02 , G01R1/067 , G01R1/073 , G01R1/20 , G01R31/20 , G01R31/26 , G01R31/28 , H01R12/70
CPC分类号: G01R1/0433 , H01R12/7076
摘要: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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公开(公告)号:US11961220B2
公开(公告)日:2024-04-16
申请号:US15925008
申请日:2018-03-19
发明人: Neeraj Bhardwaj , Neha Vernekar , Janardhan Venkata Raju , Shubham Mehrotra , Arun Adoni , Mahit Arun Warhadpande , Shimee Gupta , Goda Devi Addanki , Pavinkumar Ramasamy , Binoy Jose Maliakal
CPC分类号: G06T7/0008 , G01R1/0441 , G01R31/2887 , G01R31/2893
摘要: Apparatuses and methods are disclosed for handling integrated circuits in automated testing. The handler apparatus includes an upper assembly that is selectively translatable above a testing surface and a lower bracket extending from and positioned below the upper assembly. The lower bracket forms a first opening, is selectively moveable upward and downward, and includes a rotatable finger extending downward to pick up and place an integrated circuit in a socket. The handier may further include an image sensor to detect potential error conditions, and a tool extending from the lower bracket to open and close a lid on the socket. The methods include sensing an image of an integrated circuit during certain phases of testing, analyzing the image to determine if the integrated circuit is positioned correctly, and correcting any detected error conditions before continuing with the automated testing.
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公开(公告)号:US11821940B2
公开(公告)日:2023-11-21
申请号:US18176965
申请日:2023-03-01
申请人: AEHR TEST SYSTEMS
IPC分类号: G01R31/20 , G01R31/28 , H01L21/687 , H05K7/14
CPC分类号: G01R31/2808 , G01R31/2893 , H01L21/687 , H05K7/1402 , H05K7/1412 , H05K7/1417
摘要: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.
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公开(公告)号:US11740282B1
公开(公告)日:2023-08-29
申请号:US17709483
申请日:2022-03-31
申请人: Intel Corporation
CPC分类号: G01R31/2891 , G01R1/0483 , G01R1/07314 , G01R31/2853 , G01R31/2886 , G01R31/2887 , H01L2924/00 , H01L2924/01006 , H01L2924/01033
摘要: An apparatus includes an input probe configured to be placed on a first cluster of u-bumps disposed on a semiconductor die, output probes configured to be respectively placed on multiple clusters of u-bumps disposed on the semiconductor die, the multiple clusters being separately connected to the first cluster. The apparatus further includes a space transformer and printed circuit board (PCB) portion including a current source configured to supply a current to the input probe placed on the first cluster, resistors having a same resistance and being connected to ground, and tester channels at which voltages are respectively measured, the tester channels being respectively connected to ends of the output probes respectively placed on the multiple clusters and being respectively connected to the resistors. The apparatus further includes a processor configured to determine whether the input probe is properly aligned with the first cluster, based on the measured voltages.
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公开(公告)号:US11630129B2
公开(公告)日:2023-04-18
申请号:US17504693
申请日:2021-10-19
申请人: PRO-2000 Co., LTD
发明人: Jun Soo Cho
摘要: Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.
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公开(公告)号:US20230041663A1
公开(公告)日:2023-02-09
申请号:US17816728
申请日:2022-08-02
发明人: Lifeng QIAO , Dehui ZHANG , Teng LIU
摘要: The disclosure discloses a method and device for monitoring partial discharge. The monitoring method including: step a, connecting a monitoring circuit in parallel to both ends of a tested product, disposing a ground wire between the monitoring circuit and ground, disposing a first sensor in the monitoring circuit, and disposing a ground wire sensor on the ground wire; step b, applying an excitation signal to the tested product, acquiring a first signal through the first sensor and acquiring a ground wire signal through the ground wire sensor within a monitoring cycle; and step c, determining whether the tested product has partial discharge through the first signal and the ground wire signal. The disclosure can avoid the partial discharge monitoring device from wrongly determining an interference signal to be a partial discharge signal, enhance anti-interference capability of the partial discharge monitoring device, and improve monitoring accuracy.
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公开(公告)号:US11226380B2
公开(公告)日:2022-01-18
申请号:US16842729
申请日:2020-04-07
IPC分类号: G01R31/20 , G01R31/68 , G01R1/04 , G01R1/073 , H01R13/15 , H01R13/24 , G01R1/067 , H01R24/38
摘要: A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.
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公开(公告)号:US11199572B2
公开(公告)日:2021-12-14
申请号:US16831485
申请日:2020-03-26
申请人: Aehr Test Systems
IPC分类号: G01R31/20 , G01R31/28 , H01L21/687 , H05K7/14
摘要: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.
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公开(公告)号:US10725105B2
公开(公告)日:2020-07-28
申请号:US15721633
申请日:2017-09-29
发明人: Matthew Holtz , James Niemann , Martin Rice
IPC分类号: G01R31/20 , G01R31/319 , G01R1/073 , G01R31/28 , G01R1/04
摘要: Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.
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