摘要:
A fiber-coupled optical component package comprises a high thermal conductivity base, a housing including a ceramic substrate, an optical component mount aperture formed on the substrate and a substantially planar fiber mount region on the substrate adjacent to the optical component mount aperture. An optical component may be secured within an area defined by the optical component mount aperture and an optical fiber may be secured to the substantially planar fiber mount region to optically couple the fiber and the optical component. A package lid may be placed over one or more of the housing, the optical component, and a portion of the fiber.
摘要:
A hermetically sealed, opto-electronic array housing assembly having a ceramic base, electrical connectors, a metal can, and a glass window. The glass window can support a micro-lens array. The metal can receives the glass window. The electrical impedance of the electrical connectors is beneficially carefully controlled to enable high-speed data communications. A multi-element optical fiber connector can provide for optical communications to and/or from an opto-electronic array contained within the housing.
摘要:
A connection cable includes an optical cable and an integrated electrical connector. The integrated electrical connector is permanently fixed to the optical cable. The integrated electrical connector is for plug-in connection to a matching electrical connector on a target device.
摘要:
An optical interface between an optical fiber and a laser is provided. The optical fiber has a core and an end. The optical interface includes a mirror that is capable of receiving an optical output of the laser and of reflecting the optical output to the end of the optical fiber such that a chief ray of the optical output is incident on the core of the optical fiber. The optical interface also includes a lens located such that the chief ray of the optical output traverses a center of the lens. Such optical interface may be used in a transmitter optical subassembly (TOSA) having a vertical TO package for un-cooled lasers.
摘要:
A modular and adjustable backplane assembly for providing a fiber-optics backplane interface to a plurality of router cards functioning as a data router is provided. The assembly includes a first portion having a first array of connectors for interfacing with a compatible array of second connectors engaging specific ones of the router cards, and a second portion having a second array of connectors for interfacing with a compatible array of second connectors engaging specific others of the router cards. The mechanics of the assembly enable a moveable attachment with respect to the first and second portions such that they may be positionally adjusted during mounting, and wherein external data paths are provided from individual ones of the connectors to individual others of the connectors by fiber-optic conductors.
摘要:
Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.
摘要:
Coupled-power adjusting apparatus is disclosed in conjunction with optoelectronic modules. The apparatus includes a receptacle assembly with an elongated optical fiber receiving opening having a longitudinal axis and an optoelectronic device. Variable optical power coupling apparatus is mounted in the optical fiber receiving opening and rotateable about the longitudinal axis without moving along the longitudinal axis. Relative rotation of the variable optical power coupling apparatus varies the amount of optical power coupled between the optoelectronic device and an optical fiber positioned in the optical fiber receiving opening. The variable optical power coupling apparatus includes either a polarized isolator or a beveled optical fiber stub.
摘要:
A simple, effective and inexpensive method produces an optical connection on an optical component. A waveguide section, a sleeve for enclosing the waveguide section and an optical component, which has a receptacle for the waveguide section and the sleeve, are provided. The waveguide section is inserted with the first end face into the receptacle of the component and is only cut to length after insertion, while it is mounted on the component. The front end face of the waveguide section is milled away in a centered, spherical concave form.
摘要:
The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces, detachable fibres and leadframes. The TO-can/encapsulating element enables the optical fibre (9) to be readily positioned relative to the chip (25) with the aid of a fix-able can-flange (7), and eliminates the risk of crack formation by virtue of the component leads of said TO-can having been provided with and connected to a leadframe (6).
摘要:
The present invention provides a light-transmitting module capable of emitting light in stable under a predetermined temperature, especially the light-transmitting module applicable to a condition when the predetermined temperature is lower than ambient temperatures. The light-transmitting module of the present invention includes a light-emitting module, which encloses the laser diode and the Peltier device therein, a substrate electrically connected to the light-emitting module, and a heater. The heater is able to heat the package of the light-emitting module when the predetermined temperature of the laser diode is higher than the ambient temperature, thereby preventing the temperature of the package from lowering the dew-point and droplets from being generated on the substrate. The optical output from the light-transmitting module can be stabled.