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公开(公告)号：US11886117B2
公开(公告)日：2024-01-30
申请号：US17624261
申请日：2019-07-02
Applicant: SHANDONG SHENGQUAN NEW MATERIALS CO LTD.
Inventor： Diyuan Tang , Zhifang Li , Ke Bai , Bin Liu , Chuanming Sun
CPC classification number: G03F7/0751 , G03F7/0226 , G03F7/0755
Abstract: An adhesion promoter as shown in Formula (I) and a photosensitive resin composition containing the adhesion promoter are disclosed:
where R1, R2 and R3 each refer to a hydrogen atom, an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other optionally substituted carbon atom; A refers to an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other an optionally substituted carbon atom substituents; and the carbon in the alkyl, the alkenyl, the alkynyl, the phenyl, or the carbon atom substituents is optionally substituted with one or more of N, O and S; and X refers to an optionally substituted aromatic heterocyclic group. The adhesion promoter and the photosensitive resin composition can be used for manufacturing a semiconductor integrated circuit (IC), a LED and a flat-panel display.-
公开(公告)号：US11852973B2
公开(公告)日：2023-12-26
申请号：US17273401
申请日：2019-09-04
Applicant: TORAY Industries, Inc.
Inventor： Yusuke Komori , Kazuto Miyoshi
IPC: G03F7/023 , G03F7/022 , G03F7/40 , C08F2/48 , C08F4/26 , C08F12/24 , G03F7/038 , G03F7/20 , G03F7/32 , G03F7/38 , H10K85/30 , H10K85/60 , H10K50/11
CPC classification number: G03F7/0236 , C08F2/48 , C08F4/26 , C08F12/24 , G03F7/0226 , G03F7/0233 , G03F7/0382 , G03F7/2004 , G03F7/327 , G03F7/38 , G03F7/40 , H10K85/342 , H10K85/626 , H10K85/631 , H10K85/654 , H10K50/11
Abstract: The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).
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公开(公告)号：US11572430B2
公开(公告)日：2023-02-07
申请号：US17020532
申请日：2020-09-14
Applicant: Mitsubishi Gas Chemical Company, Inc.
Inventor： Takumi Toida , Youko Shimizu , Takashi Makinoshima , Takashi Sato , Masatoshi Echigo
IPC: C08G8/14 , C08G8/28 , C07C39/367 , C07C69/96 , G03F7/023 , G03F7/09 , G03F7/16 , G03F7/022 , G03F7/30 , C08G8/24 , C07C43/23 , C07D307/56 , G03F7/004 , G03F7/039 , C07C39/15
Abstract: The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent: wherein R1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R2 to R5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R2 to R5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m2 and m3 are each independently an integer of 0 to 8; m4 and m5 are each independently an integer of 0 to 9, provided that m2, m3, m4, and m5 are not 0 at the same time; n is an integer of 1 to 4; and p2 to p5 are each independently an integer of 0 to 2.
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公开(公告)号：US11543749B2
公开(公告)日：2023-01-03
申请号：US17178794
申请日：2021-02-18
Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
Inventor： Masako Sugihara , Takashi Nishimura , Junji Nakanishi
Abstract: The present invention provides a resist composition which has sufficient resistant to a plating treatment and is capable of forming a resist pattern with high accuracy. The present invention also provides a method for producing a resist pattern using the resist composition, and a method for producing a plated molded article using the resist pattern. The present invention relates to a resist composition comprising a compound (I) having a quinone diazide sulfonyl group, a resin comprising a structural unit having an acid-labile group (A1), an alkali-soluble resin (A2) and an acid generator (B); a method for producing a resist pattern using the resist composition; and a method for producing a plated molded article using the resist pattern.
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5.发明授权公开(公告)号：US11526077B2
公开(公告)日：2022-12-13
申请号：US16300474
申请日：2018-04-25
Inventor： Wei Li , Tongshang Su , Guangyao Li , Yingbin Hu , Rui Ma , Jifeng Shao , Yang Zhang , Jianye Zhang
IPC: G03F7/022 , G03F7/039 , H01L27/12 , G03F7/26 , G03F7/031 , G03F7/16 , G03F7/20 , H01L21/027 , G03F7/085 , G03F7/40 , H01L21/311 , G02F1/1362
Abstract: The present disclosure provides a positive photoresist composition including a major adhesive material and a photosensitizer, wherein the photoresist composition further includes a photoisomerizable compound which would be converted into an ionic structure with an increased degree of molecular polarity after ultraviolet irradiation. The formation of the ionic structure with increased polarity of the molecule reduces the adhesion between the positive photoresist and the organic film layer, facilitates stripping after formation of the via, and improves the product rate of pass. Further, the present disclosure provides a via-forming method using the positive resist composition, a display substrate including the via formed by the via-forming method, and a display device including the display substrate.
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Patent Agency Ranking
公开(公告)号：US20220382154A1
公开(公告)日：2022-12-01
申请号：US17766101
申请日：2020-09-17
Applicant: TAIYO HOLDINGS CO., LTD.
Inventor： Maho AKIMOTO , Mei KUNITO , Toshiyuki OGATA
Abstract: [Problem] To provide a photosensitive resin composition having high dissolution rate in the exposed area and excellent dissolution contrast (resolution).
[Solution] (A) a polyimide precursor which is a reaction product of diamine compound and dicarboxylic acid and (B) a photosensitive agent, the diamine compound comprising at least one selected from the group consisting of compounds represented by the formulae (1) and (2):-
公开(公告)号：US11333975B2
公开(公告)日：2022-05-17
申请号：US16848589
申请日：2020-04-14
Inventor： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC: G03F7/023 , C08G73/10 , C08G73/14 , C08G73/22 , G03F7/022 , G03F7/038 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40
Abstract: Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
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公开(公告)号：US11243467B2
公开(公告)日：2022-02-08
申请号：US15759076
申请日：2016-09-08
Applicant: Mitsubishi Gas Chemical Company, Inc.
Inventor： Takumi Toida , Youko Shimizu , Takashi Makinoshima , Takashi Sato , Masatoshi Echigo
IPC: G03F7/004 , C07C39/367 , C07C69/96 , C07D307/56 , G03F7/039 , G03F7/30 , G03F7/023 , G03F7/09 , G03F7/16 , G03F7/022 , C07C43/23 , C07C39/15
Abstract: The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent: wherein R1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R2 to R5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R2 to R5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m2 and m3 are each independently an integer of 0 to 8; m4 and m5 are each independently an integer of 0 to 9, provided that m2, m3, m4, and m5 are not 0 at the same time; n is an integer of 1 to 4; and p2 to p5 are each independently an integer of 0 to 2.
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公开(公告)号：US10915019B2
公开(公告)日：2021-02-09
申请号：US15937924
申请日：2018-03-28
Applicant: PROMERUS, LLC
Inventor： Pramod F Kandanarachch , Hongshi Zhen , Larry F Rhodes
IPC: G03F7/023 , G03F7/038 , G03F7/039 , G03F7/012 , G03F7/00 , G02B1/04 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/30 , G02B3/00 , G03F7/075 , G03F7/022 , G03F7/40
Abstract: Embodiments in accordance with the present invention encompass self-imagable polymer compositions containing a colorant which are useful for forming films that can be patterned to create structures for color filters and microlens having applications in a variety of microelectronic devices, optoelectronic devices and displays, such as for example image sensors. The compositions of this invention can be tailored to form positive tone images for forming an array of images, which can be thermally transformed into an array of microlens. The images thus formed can then be used in color filter applications.
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10.发明授权公开(公告)号：US10831101B2
公开(公告)日：2020-11-10
申请号：US15742975
申请日：2017-03-28
Applicant: ASAHI KASEI KABUSHIKI KAISHA
Inventor： Tomohiro Yorisue , Taihei Inoue , Yoshito Ido , Mitsutaka Nakamura , Tomoshige Yunokuchi , Daisuke Sasano , Takahiro Sasaki
IPC: G03F7/022 , G03F7/031 , G03F7/023 , G03F7/038 , G03F7/004 , G03F7/037 , G03F7/16 , C08L77/00 , H05K3/28 , C08K5/33 , C08K5/375 , H05K3/02
Abstract: A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
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