公开(公告)号：US12222642B2

公开(公告)日：2025-02-11

申请号：US16431752

申请日：2019-06-05

Applicant: eChem Solutions Corp.

Inventor： Yi-Sheng Wu ,  Hsin-Chieh Yang ,  Ping-Sung Tsai

IPC: G03F7/00 ,  G02B1/04 ,  G03F7/031 ,  G03F7/033 ,  G02F1/1335

Abstract: A photosensitive composition, a color filter prepared by using the photosensitive composition and a method for preparing the color filter. The photosensitive composition includes an alkali-soluble resin (A); an ethylenically unsaturated monomer (B); a photopolymerization initiator (C); a solvent (D); and a colorant (E), wherein the content of the photopolymerization initiator (C) is from 32 parts by weight to 70 parts by weight based on 100 parts by weight of the ethylenically unsaturated monomer(B).

公开(公告)号：US20240385519A1

公开(公告)日：2024-11-21

申请号：US18786536

申请日：2024-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sih-Hao Liao ,  Yu-Hsiang Hu ,  Hung-Jui Kuo ,  Chen-Hua Yu

IPC: G03F7/031 ,  C08K5/375 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

Abstract: A method of manufacturing a semiconductor device includes forming a polymer mixture over a substrate, curing the polymer mixture to form a polymer material, and patterning the polymer material. The polymer mixture includes a polymer precursor, a photosensitizer, a cross-linker, and a solvent. The polymer precursor may be a polyamic acid ester. The cross-linker may be tetraethylene glycol dimethacrylate. The photosensitizer includes 4-phenyl-2-(piperazin-1-yl)thiazole. The mixture may further include an additive.

公开(公告)号：US20240247091A1

公开(公告)日：2024-07-25

申请号：US18598717

申请日：2024-03-07

Applicant: Bridgestone Americas Tire Operations, LLC

Inventor： Joshua P. Abell ,  Michael R. Beaulieu ,  Douglas B. Costlow ,  Andrew V. Haidet

IPC: C08F290/04 ,  B29C64/129 ,  B29K9/00 ,  B29K105/00 ,  B29K105/24 ,  B29L30/00 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  B60C1/00 ,  C08F2/50 ,  C08K3/013 ,  G03F7/00 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/033 ,  G03F7/038

CPC classification number: C08F290/048 ,  B29C64/129 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  B60C1/0016 ,  C08F2/50 ,  C08K3/013 ,  G03F7/0037 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/033 ,  G03F7/038 ,  B29K2009/00 ,  B29K2105/0002 ,  B29K2105/24 ,  B29L2030/002

Abstract: The present disclosure is directed to actinic radiation curable polymeric mixtures, cured polymeric mixtures, tires and tire components made from the foregoing, and related processes.

公开(公告)号：US20240210827A1

公开(公告)日：2024-06-27

申请号：US18396056

申请日：2023-12-26

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Tomohiro YORISUE ,  Taihei INOUE ,  Yoshito IDO ,  Mitsutaka NAKAMURA ,  Tomoshige YUNOKUCHI ,  Daisuke SASANO ,  Takahiro SASAKI

IPC: G03F7/022 ,  C08L77/00 ,  G03F7/004 ,  G03F7/023 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/16

CPC classification number: G03F7/0226 ,  C08L77/00 ,  G03F7/0048 ,  G03F7/0233 ,  G03F7/031 ,  G03F7/037 ,  G03F7/0387 ,  G03F7/0388 ,  G03F7/162 ,  H05K3/287 ,  H05K2201/0154

Abstract: A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

公开(公告)号：US12013638B2

公开(公告)日：2024-06-18

申请号：US17433946

申请日：2020-11-04

Applicant: SUZHOU POLLY NEW MATERIAL TECH CO., LTD.

Inventor： Wenbin Wang ,  Jie Xiong

IPC: G03F7/035 ,  G03F7/027 ,  G03F7/031 ,  G03F7/038 ,  B33Y10/00 ,  B33Y70/00

CPC classification number: G03F7/035 ,  G03F7/027 ,  G03F7/031 ,  G03F7/0382 ,  B33Y10/00 ,  B33Y70/00

Abstract: The present disclosure relates to a dual-cure phase-separation type photosensitive resin composition for continuous 3D printing with high precision, including an acrylate having a cross-linkable double bond, a polyurethane prepolymer, a chain extender, and a photoinitiator. The polyurethane prepolymer is produced by a reaction between an isocyanate and a polyether polyol with a molecular weight larger than or equal to 4000 under heating and catalytic action. The photosensitive resin composition of the present disclosure is used in the continuous 3D printing to make high precision parts.

公开(公告)号：US11982939B2

公开(公告)日：2024-05-14

申请号：US16939507

申请日：2020-07-27

Applicant: FUJIFILM Corporation

Inventor： Masahiro Mori ,  Shunsuke Kitajima ,  Tokihiko Matsumura ,  Tetsushi Miyata

IPC: G02B5/20 ,  C09B3/14 ,  C09B57/00 ,  G03F7/00 ,  G03F7/004 ,  G03F7/031 ,  G09F9/35 ,  H01L27/146 ,  H10K59/38

CPC classification number: G03F7/0007 ,  C09B3/14 ,  C09B57/00 ,  G02B5/208 ,  G03F7/0045 ,  G03F7/031 ,  G09F9/35 ,  H01L27/14621 ,  H10K59/38

Abstract: A composition includes a near-infrared absorber, a color material that transmits near-infrared rays and shields visible light, at least one compound selected from the group consisting of a resin having a glass transition temperature of 100° C. or higher, and a resin precursor of the resin having a glass transition temperature of 100° C. or higher, and a surfactant.

公开(公告)号：US20240118616A1

公开(公告)日：2024-04-11

申请号：US17767873

申请日：2020-10-08

Applicant: DONGJIN SEMICHEM CO., LTD.

Inventor： Kyoungsoon SHIN ,  Hyoc-Min YOUN ,  Tai Hoon YEO ,  Dong Myung KIM ,  Gi Seon LEE ,  Ah Rum PARK ,  Seok Hyeon LEE

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/022 ,  G03F7/031

CPC classification number: G03F7/0397 ,  G03F7/0048 ,  G03F7/022 ,  G03F7/031

Abstract: This invention relates to a positive photosensitive resin composition that includes a siloxane copolymer of two kinds of reactive silane compounds with specific structures wherein residual impurities such as unreacted monomers and catalysts are minimized, and a UV absorber including one or more kinds of phenol hydroxyl groups capable of crosslinking and an alkoxy group. Accordingly, the resin composition exhibits excellent performances such as sensitivity, resolution, and degree of planarization, and also has excellent weatherability and UV absorbance, thereby providing excellent panel reliability.

公开(公告)号：US20240101761A1

公开(公告)日：2024-03-28

申请号：US18271758

申请日：2022-01-12

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Kohei MURAKAMI ,  Tomohito OGURA

IPC: C08G73/14 ,  G03F7/004 ,  G03F7/022 ,  G03F7/031 ,  G03F7/038 ,  G03F7/38

CPC classification number: C08G73/14 ,  G03F7/0048 ,  G03F7/0226 ,  G03F7/031 ,  G03F7/0382 ,  G03F7/0387 ,  G03F7/38

Abstract: The purpose of the present disclosure is to provide a method for manufacturing a polyimide (PI) precursor resin composition that has excellent resolution performance, a broad range of available exposure and good handling properties. Provided is a method for manufacturing a PI precursor resin composition that comprises a PI precursor resin, an exposure light absorber, a photopolymerization initiator and a solvent. The PI precursor resin is selected from among materials having an absorbance parameter Xp for a light species within a range of 0.001-0.20, the exposure light absorber is selected from among materials having an absorbance parameter Xt for the light species within a range of 0.01-0.05, and the photopolymerization initiator is selected from among materials having an absorbance parameter Xr for the light species within a range of 0-0.04. On the basis of an assumed thickness D of a film that is formed by applying the PI precursor resin composition and desolventing, the addition amount (parts by mass) α of the exposure light absorber and the addition amount (parts by mass) β of the photopolymerization initiator are determined so as to satisfy the formula: 0.7≤(Xp+Xt×α+Xr×β)×D≤2.2.

公开(公告)号：US11921424B2

公开(公告)日：2024-03-05

申请号：US16497600

申请日：2017-03-30

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Nobuhito Komuro ,  Yuta Daijima ,  Masayuki Kojima ,  Shinji Irizawa ,  Shinya Oosaki

IPC: G03F7/031 ,  G03F7/029 ,  G03F7/032 ,  G03F7/038 ,  G03F7/40 ,  H05K3/00

CPC classification number: G03F7/031 ,  G03F7/029 ,  G03F7/032 ,  G03F7/0382 ,  G03F7/40 ,  H05K3/0076

Abstract: There are provided a photosensitive resin composition which can be applied to either a projection exposure or direct-write exposure machine without fine adjustment of the composition, and can form a resist pattern having an excellent cross-sectional shape in which an undercut in which the bottom portion of the resist pattern is hollowed and omission of the top of the resist pattern are less likely to occur, and a line width of an intermediate portion (central portion) and a deepest portion (bottom portion) in the depth direction of the cross section of the resist pattern is less likely to be larger than a line width of the surface portion (that is, linearity in the depth direction of the resist pattern contour is favorable), and which has excellent insulation reliability and crack resistance reliability, and a dry film using the same, a printed wiring board, and a printed wiring board manufacturing method. The photosensitive resin composition includes an acid-modified vinyl group-containing epoxy resin (A), a photopolymerization initiator (B), a photopolymerization sensitizer including a benzophenone compound (C), and a photopolymerizable compound (D).

公开(公告)号：US20240069439A1

公开(公告)日：2024-02-29

申请号：US18180897

申请日：2023-03-09

Applicant: Eastman Kodak Company

Inventor： Christopher D. Simpson ,  Stefanie Hansmann ,  Merve Cagli ,  Saija Werner ,  Jianbing Huang

IPC: G03F7/031 ,  B41C1/10 ,  G03F7/004

CPC classification number: G03F7/031 ,  B41C1/1008 ,  G03F7/0045 ,  B41C2210/04

Abstract: IR-sensitive lithographic printing plate precursors provide a stable printout using a unique IR-sensitive image-recording layer. The IR radiation-sensitive layer includes: component (1) a free radical initiator composition; component (2) a free radically polymerizable composition; and component (3) a color-changing compound of Structure (I) having an indene structure in the conjugated chain between the aromatic terminal groups. A specific group, such as a halo group, is directly or indirectly attached to this indene structure. The infrared radiation-sensitive image-recording composition and layer also contains one or more borate ions. After infrared imaging, these precursors exhibit desirable fresh or initial printout and printout after dark storage. The precursors can be developed on-press.