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1.发明公开公开(公告)号：US20240365513A1
公开(公告)日：2024-10-31
申请号：US18394503
申请日：2023-12-22
申请人： Intel Corporation
CPC分类号： H05K7/20381 , F25B5/02 , F25B49/022 , G06F1/206 , H05K7/20309 , H05K7/20327 , F25B2700/191 , F25B2700/197 , F25B2700/2108 , F25B2700/21174 , F25B2700/21175
摘要： An apparatus and method for cooling a computing system, comprising a plurality of electronic components, with a cooling system. The cooling system includes a closed loop for the two-phase coolant, wherein the two-phase coolant has a saturation temperature. The closed loop includes a valve fluidly connected between an outlet of a heat exchanger and an inlet of a plurality of evaporator structures configured to be thermally coupled to the plurality of electronic components, and a compressor fluidly connected between an outlet of the plurality of evaporator structures and an inlet of the heat exchanger. The apparatus and method for the cooling system are configured to monitor one or more system temperatures of the computing system and adjust an operation of at least one of the valve or the compressor to alter the saturation temperature based on the one or more system temperatures.
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公开(公告)号：US12133352B2
公开(公告)日：2024-10-29
申请号：US17443889
申请日：2021-07-28
申请人： Dell Products L.P.
发明人： Qinghong He , Ting-Chiang Huang
CPC分类号： H05K7/20145 , G06F1/20 , H05K7/20172 , F28D2021/0028
摘要： An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.
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3.发明公开公开(公告)号：US20240357765A1
公开(公告)日：2024-10-24
申请号：US18638962
申请日：2024-04-18
发明人： Rick Vanderhulst , Colin Crossman , Deanna Crossman , Rob Warren
CPC分类号： H05K7/20172 , G06F1/20 , H05K7/20145
摘要： A computing system may include at least one computing device, such as a cryptocurrency mining device, including a first device outlet configured to provide a first airflow and a second device outlet configured to provide a second airflow. The system may further include at least one airflow shroud coupled to each computing device of the at least one computing device. Each airflow shroud may include at least one airflow shroud configured to receive the first airflow from the first device outlet and the second airflow from the second device outlet, and an airflow shroud outlet configured to provide a combined airflow from the first airflow and the second airflow directed away from the at least one computing device.
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公开(公告)号：US12124293B2
公开(公告)日：2024-10-22
申请号：US17677463
申请日：2022-02-22
发明人： Yung-Hsiang Chen , Li-Wei Hung
CPC分类号： G06F1/1616 , G06F1/1675 , G06F1/203
摘要： An electronic device is provided. The electronic device includes a first body with a base and a movable member, a second body, a lifting member, and a linkage mechanism. The movable member is located on an upper surface of the base and includes a first side and a second side. The first side is pivotally connected to the base. The second body is pivotally connected to the second side by using a first rotary shaft. The lifting member is pivotally connected to the movable member by using a second rotary shaft. The linkage mechanism is disposed on the movable member, is linked to the second body by using the first rotary shaft, and drives the lifting member to rotate by using the second rotary shaft. When the second body is opened upward, an air outlet on a rear side of the first body is prevented from being covered.
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公开(公告)号：US12120846B2
公开(公告)日：2024-10-15
申请号：US17694765
申请日：2022-03-15
申请人： OVH
CPC分类号： H05K7/20272 , G06F1/20 , H05K7/20236 , H05K7/20281
摘要： A cooling system (50) including an immersion case, a bladder and a controller is disclosed. The immersion case (54) is configured to house an immersion cooling liquid, and an electronic component (80) configured to be submerged in the immersion cooling liquid. The bladder (56) is configurable between an expanded state and a contracted state and positioned such that the bladder (56) can be at least partially submerged in the immersion cooling liquid when in any one of the expanded state and the contracted state. The controller (58) is connected to the bladder (56) for modulating the bladder (56) between the expanded state and the contracted state to modulate a fluid level of the immersion cooling liquid in the immersion case (54).
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公开(公告)号：US12119639B2
公开(公告)日：2024-10-15
申请号：US18214405
申请日：2023-06-26
摘要： An integrated circuit (IC) heater circuit comprises a drive circuit configured to increase the temperature of the IC when consuming power; a temperature sensor coupled to a control node of the drive circuit to activate and deactivate the drive circuit to provide an ambient temperature for the IC, wherein current of the temperature sensor varies with temperature; and a control circuit coupled to the temperature sensor and configured to adjust variation in the temperature sensitivity of the current of the temperature sensor.
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公开(公告)号：US12114466B2
公开(公告)日：2024-10-08
申请号：US17132477
申请日：2020-12-23
申请人： Intel Corporation
发明人： Penchala Pratap Binni Boyina , Kathiravan D , Babu Triplicane Gopikrishnan , Prakash Kurma Raju , Deepak Sekar , Hari Shanker Thakur
IPC分类号： H05K7/20 , F28D15/04 , G06F1/20 , H01L23/40 , H01L23/427
CPC分类号： H05K7/20336 , F28D15/04 , G06F1/203 , H01L23/4006 , H01L23/427 , H01L2023/4087
摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
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公开(公告)号：US12111711B2
公开(公告)日：2024-10-08
申请号：US17402927
申请日：2021-08-16
申请人： Daedalus Prime LLC
IPC分类号： G06F1/32 , G06F1/20 , G06F1/3203 , G06F1/3206 , G06F1/3234 , G06F1/3287 , G06F1/329 , G06F9/50
CPC分类号： G06F1/3206 , G06F1/206 , G06F1/3203 , G06F1/3253 , G06F1/3287 , G06F1/329 , G06F9/5094 , G06F9/50 , Y02D10/00
摘要： An apparatus, method and system is described herein for efficiently balancing performance and power between processing elements based on measured workloads. If a workload of a processing element indicates that it is a bottleneck, then its performance may be increased. However, if a platform or integrated circuit including the processing element is already operating at a power or thermal limit, the increase in performance is counterbalanced by a reduction or cap in another processing elements performance to maintain compliance with the power or thermal limit. As a result, bottlenecks are identified and alleviated by balancing power allocation, even when multiple processing elements are operating at a power or thermal limit.
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9.发明授权公开(公告)号：US12111705B2
公开(公告)日：2024-10-08
申请号：US17939537
申请日：2022-09-07
IPC分类号： G06F1/20
CPC分类号： G06F1/206
摘要： Dynamically determining respective threshold temperatures for data storage devices (DSDs) in a data storage system (DSS) slot involves determining a marginal temperature of a DSD (TMd) based on the difference between a current threshold temperature of a corresponding DSS slot (TTe) and a current temperature value of the DSD (TCd), and raising the current TTe to an updated TTe accordingly, thereby effectively permitting the DSD to operate at temperatures up to the updated TTe. Updating TTe may come after first determining whether the TMd is greater than a lower limit and/or less than an upper limit, both of which are based on an inherent threshold temperature value of the DSD (TTd). This approach can be applied to other DSDs housed in the same DSS enclosure, enabling varying each respective DSD operating temperature, in contrast to using a fixed operating temperature range for the entire enclosure.
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公开(公告)号：US20240329704A1
公开(公告)日：2024-10-03
申请号：US18207126
申请日：2023-06-07
发明人： Chun-Hung LIN
CPC分类号： G06F1/206 , G10K11/16 , H05K7/20154
摘要： A heat dissipation device having a noise cancelling module includes: a seat body; a cover member correspondingly covering the seat body, and an accommodation chamber is formed between the seat body and the cover member, the cover member has an air inlet port and an air outlet port communicating with the accommodation chamber; a fan disposed in the accommodation chamber and arranged corresponding to the air inlet port, and having a plurality of blades; a heat dissipation fin set disposed in the accommodation chamber and arranged corresponding to the air outlet port; and a noise cancelling module generating a noise cancellation sound, the noise cancelling module is disposed on the cover member or the heat dissipation fin set to make the noise cancellation sound offset a noise generated when each of the blades rotates.
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