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公开(公告)号:US12105975B2
公开(公告)日:2024-10-01
申请号:US18230413
申请日:2023-08-04
申请人: Rambus Inc.
IPC分类号: G06F3/06 , G11C7/06 , G11C7/18 , G11C7/22 , G11C11/4076 , G11C11/4091 , G11C11/4097
CPC分类号: G06F3/064 , G06F3/0611 , G06F3/0625 , G06F3/0655 , G06F3/0673 , G11C7/06 , G11C7/18 , G11C7/22 , G11C11/4076 , G11C11/4091 , G11C11/4097
摘要: Same sized blocks of data corresponding to a single read/write command are stored in the same memory array of a memory device, but using different formats. A first one of these formats spreads the data in the block across a larger number of memory subarrays (a.k.a., memory array tiles—MATs) than a second format. In this manner, the data blocks stored in the first format can be accessed with lower latency than the blocks stored in the second format because more data can be read from the array simultaneously. In addition, since the data stored in the second format is stored in fewer subarrays, it takes less energy to read a block stored in the second format. Thus, a system may elect, on a data block by data block basis, whether to conserve power or improve speed.
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公开(公告)号:US12101925B2
公开(公告)日:2024-09-24
申请号:US17739849
申请日:2022-05-09
发明人: Nozomu Harada , Koji Sakui
IPC分类号: H10B12/00 , G11C11/4097
CPC分类号: H10B12/20 , G11C11/4097
摘要: Provided on a substrate are an N+ layer connecting to a source line SL and an N+ layer connecting to a bit line BL that are located at opposite ends of a Si pillar standing in an upright position along the vertical direction, an N layer continuous with the N+ layer, an N layer continuous with the N+ layer, a first gate insulating layer surrounding the Si pillar, a first gate conductor layer surrounding the first gate insulating layer and connecting to a plate line PL, and a second gate conductor layer surrounding a second gate insulating layer surrounding the Si pillar and connecting to a word line WL. A voltage applied to each of the source line SL, the plate line PL, the word line WL, and the bit line BL is controlled to perform a data retention operation for retaining holes, which have been generated through an impact ionization phenomenon or using a gate induced drain leakage current, in a channel region of the Si pillar, and a data erase operation for removing the holes from the channel region.
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公开(公告)号:US20240296881A1
公开(公告)日:2024-09-05
申请号:US18646415
申请日:2024-04-25
发明人: Tomoaki ATSUMI , Junpei SUGAO
IPC分类号: G11C11/4094 , G11C11/401 , G11C11/4096 , G11C11/4097 , H01L27/12 , H01L29/786 , H10B10/00 , H10B41/70
CPC分类号: G11C11/4094 , G11C11/401 , G11C11/4096 , G11C11/4097 , H01L27/1225 , H01L27/124 , H01L27/1251 , H01L27/1255 , H01L29/78675 , H01L29/7869 , H01L29/78696 , H10B10/12 , H10B41/70
摘要: The semiconductor device includes a first memory cell, and a second memory cell thereover. The first memory cell includes first and second transistors, and a first capacitor. The second memory cell includes third and fourth transistors, and a second capacitor. A gate of the first transistor is electrically connected to one of a source and a drain of the second transistor and the first capacitor. A gate of the third transistor is electrically connected to one of a source and a drain of the fourth transistor and the second capacitor. One of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the third transistor. The second and fourth transistors include an oxide semiconductor. A channel length direction of the first and third transistors is substantially perpendicular to a channel length direction of the second and fourth transistors.
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公开(公告)号:US12080337B2
公开(公告)日:2024-09-03
申请号:US17854153
申请日:2022-06-30
发明人: Ying Wang
IPC分类号: G11C7/12 , G11C7/06 , G11C11/4091 , G11C11/4094 , G11C11/4097
CPC分类号: G11C11/4091 , G11C7/062 , G11C7/12 , G11C11/4094 , G11C11/4097
摘要: A local amplifying circuit, a data readout method and a memory are provided. The local amplifying circuit includes: write control transistors, configured to connect a global data line to a local data line based on a write enable signal; column selection transistors, configured to connect a bit line to the local data line based on a column selection signal; a first control NMOS transistor, having a gate connected to the local data line, one of a source and a drain being connected to the global data line and the other being connected to a corresponding read control transistor; a second control NMOS transistor, having a gate connected to a complementary local data line, one of a source and a drain being connected to a complementary global data line and the other being connected to a corresponding read control transistor.
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公开(公告)号:US12002540B2
公开(公告)日:2024-06-04
申请号:US18214466
申请日:2023-06-26
申请人: Rambus Inc.
发明人: Ian Shaeffer , Kyung Suk Oh
IPC分类号: G11C5/06 , G11C7/22 , G11C11/4063 , G11C29/02 , G11C5/02 , G11C5/04 , G11C7/18 , G11C11/4097
CPC分类号: G11C7/22 , G11C5/063 , G11C11/4063 , G11C29/02 , G11C29/022 , G11C29/025 , G11C29/028 , G11C5/025 , G11C5/04 , G11C5/06 , G11C7/18 , G11C11/4097
摘要: A memory device includes a set of inputs, and a first register that includes a first register field to store a value for enabling application of one of a plurality of command/address (CA) on-die termination (ODT) impedance values to first inputs that receive the CA signals; and a second register field to store a value for enabling application of one of a plurality of chip select (CS) ODT impedance values to a second input that receives the CS signal. A third register field may store a value for enabling application of a clock (CK) ODT impedance value to third inputs that receive the CK signal.
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公开(公告)号:US20240153552A1
公开(公告)日:2024-05-09
申请号:US18175895
申请日:2023-02-28
发明人: Tian-Sheuan Chang , Wei-Zen Chen , Shyh-Jye Jou , Shu-Hung Kuo , Shih-Hang Kao , Li-Kai Chen
IPC分类号: G11C11/54 , G11C11/408 , G11C11/4097
CPC分类号: G11C11/54 , G11C11/4085 , G11C11/4097
摘要: A memory array for computing-in-memory (CIM) is disclosed. The memory array for CIM includes a bit cell array, at least one word line and at least one bit line. The bit cell array has a plurality of bit cells, wherein each bit cell is operated at an operating voltage. The at least one word line is electrically connected to the bit cell array, wherein the at least one word line is associated with a first parameter. The at least one bit line is electrically connected to the bit cell array, wherein the bit cells extend along a specific direction, each the at least one bit line has an electrical parameter associated therewith, each the bit cell is associated with a second parameter, a first quantity of the plurality of bit cells of the bit cell array extends along the specific direction, and the memory array determines how an expansion associated with at least one of the first parameter and the second parameter is according to the specific direction.
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公开(公告)号:US20240088099A1
公开(公告)日:2024-03-14
申请号:US18215681
申请日:2023-06-28
IPC分类号: H01L25/065 , G11C11/4097 , H01L25/18
CPC分类号: H01L25/0657 , G11C11/4097 , H01L25/18 , H01L2225/06555
摘要: Memory stacks having substantially vertical bitlines, and chip packages having the same, are disclosed herein. In one example, a memory stack is provided that includes a first memory IC die and a second memory IC die. The second memory IC die is stacked on the first memory IC die. Bitlines are routed through the first and second IC dies in a substantially vertical orientation. Wordlines within the first memory IC die are oriented orthogonal to the bitlines.
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公开(公告)号:US20240062804A1
公开(公告)日:2024-02-22
申请号:US17821448
申请日:2022-08-22
IPC分类号: G11C11/408 , G11C11/4097 , G11C11/4091
CPC分类号: G11C11/4087 , G11C11/4097 , G11C11/4091
摘要: An apparatus that includes a plurality of first memory mats each including a plurality of common column sections except for at least one associated column section, the at least one associated column sections being selected by respective column addresses which are different from one another; and a second memory mat including the at least one corresponding column sections therein.
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公开(公告)号:US20240038285A1
公开(公告)日:2024-02-01
申请号:US18064757
申请日:2022-12-12
申请人: SK hynix Inc.
发明人: Take Kyun WOO
IPC分类号: G11C8/08 , G11C11/408 , G11C11/4097 , G11C5/06 , H01L27/105
CPC分类号: G11C8/08 , G11C11/4085 , G11C11/4097 , G11C5/063 , H01L27/105
摘要: A semiconductor device may include: a first substrate structure including: a first substrate; a first word line, a first bit line, a second bit line, a second word line, a third word line, a third bit line, a fourth bit line, and a fourth word line that are sequentially arranged over the first substrate in a vertical direction; and first, second, third, and fourth memory cells, the first memory cell being disposed between the first word line and the first bit line, the second memory cell being disposed between the second word line and the second bit line, the third memory cell being disposed between the third word line and the third bit line, and the fourth memory cell being disposed between the fourth word line and the fourth bit line; and a second substrate structure disposed over the first substrate structure and including a second substrate.
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公开(公告)号:US11869965B2
公开(公告)日:2024-01-09
申请号:US18227183
申请日:2023-07-27
申请人: Monolithic 3D Inc.
发明人: Zvi Or-Bach
IPC分类号: H01L29/78 , G11C16/02 , G11C11/404 , G11C11/4097 , H10B10/00 , H10B12/00 , H10B43/20 , H10B69/00 , H10B63/00 , G11C11/412 , G11C16/04
CPC分类号: H01L29/78 , G11C11/404 , G11C11/4097 , G11C16/02 , H01L29/7841 , H10B10/12 , H10B12/20 , H10B43/20 , H10B63/30 , H10B69/00 , G11C11/412 , G11C16/0483 , G11C2213/71
摘要: A 3D semiconductor device including: a first level including a first single crystal layer and first transistors, and at least one first metal layer-which includes interconnects between the first transistors forming control circuits-which overlays the first single crystal layer; a second metal layer overlaying first metal layer; a second level including second transistors, first memory cells (each including at least one second transistor) and overlaying second metal layer; a third level including third transistors (at least one includes a polysilicon channel), second memory cells (each including at least one third transistor and cell is partially disposed atop control circuits) and overlaying the second level; control circuits control data written to second memory cells; third metal layer disposed above third level; fourth metal layer includes a global power distribution grid, has a thickness at least twice the second metal layer, and is disposed above third metal layer.
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