Memory architecture for serial EEPROMs

    公开(公告)号:US12125532B2

    公开(公告)日:2024-10-22

    申请号:US17459172

    申请日:2021-08-27

    发明人: Laurent Murillo

    摘要: In an embodiment an electrically erasable programmable readable memory includes a plurality of memory cells organised in a memory plane arranged in a matrix fashion in rows and in columns, wherein each memory cell includes a state transistor having a source region, a drain region, an injection window situated on the side of the drain, a control gate and a floating gate and an isolation transistor having a source region, a drain region and a gate; and an isolation barrier including a buried layer and at least one wall extending from the buried layer to a surface of a substrate, wherein the at least one wall is perpendicular to the buried layer, and wherein the isolating barrier forms an interior substrate surrounding at least one of the memory cells and isolating it from the remainder of the substrate.

    Semiconductor storage device
    4.
    发明授权

    公开(公告)号:US12112807B2

    公开(公告)日:2024-10-08

    申请号:US17902725

    申请日:2022-09-02

    发明人: Mina Hatakeyama

    IPC分类号: G11C16/14 G11C16/26

    CPC分类号: G11C16/14 G11C16/26

    摘要: A semiconductor storage device includes a circuit, a first plurality of conductive layers arranged along a first direction, extending along a second direction, and including first through third layers, the first layer between the second and third layers, a second plurality of conductive layers including fourth through sixth layers corresponding to the first through third layers and separated therefrom, a semiconductor layer extending between the first and second pluralities, and a charge storage layer between the semiconductor layer and the first and second pluralities. The circuit applies, in a verification operation of a write operation on the first conductive layer, a verification voltage to the first layer, a voltage smaller than the verification voltage to the fourth layer, a read voltage larger than the verification voltage to the second and fifth conductive layers, and a second voltage smaller than the read voltage to the third or sixth conductive layer.

    LAYOUT STRUCTURE OF DIFFERENTIAL LINES, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT

    公开(公告)号:US20240312949A1

    公开(公告)日:2024-09-19

    申请号:US18306971

    申请日:2023-04-25

    IPC分类号: H01L23/00 G11C5/06 G11C16/14

    摘要: A layout structure of differential lines, a memory storage device and a memory control circuit unit are provided. The layout structure of the differential lines includes a wiring layer, a first wire and a second wire. The first wire is arranged on the wiring layer and configured to transmit a first differential signal. The second wire is arranged on the wiring layer and configured to transmit a second differential signal. A first end of the first wire and a first end of the second wire are coupled to a first electrical component. A second end of the first wire and a second end of the second wire are coupled to a second electrical component. The first end of the first wire has a first bending structure. One of the second end of the first wire and the second end of the second wire has a second bending structure.

    MULTI-PROGRAM OF MEMORY CELLS WITHOUT INTERVENING ERASE OPERATIONS

    公开(公告)号:US20240221840A1

    公开(公告)日:2024-07-04

    申请号:US18604858

    申请日:2024-03-14

    发明人: Ezra Edward Hartz

    摘要: A memory device includes an array of memory cells configured as single-level cell memory and control logic operatively coupled with the array of memory cells. The control logic causes first data to be programmed to a plurality of memory cells of the array of memory cells, the first data including a first voltage distribution programmed relative to a first threshold voltage (Vt) level. The control logic causes, without erasing the plurality of memory cells, second data to be programmed to the plurality of memory cells, the second data including a second voltage distribution programmed relative to a second Vt level, wherein the second Vt level is higher than the first Vt level.

    THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

    公开(公告)号:US20240206170A1

    公开(公告)日:2024-06-20

    申请号:US18352012

    申请日:2023-07-13

    摘要: A semiconductor structure includes a vertical stack of repetition units, where each instance of the repetition unit extends along a first horizontal direction and includes a first electrically conductive strip, a first memory film located over the first electrically conductive strip, discrete semiconductor channels that are laterally spaced apart from each other along the first horizontal direction and located above the first memory film, a second memory film located above the discrete semiconductor channels, a second electrically conductive strip located above the second memory film, and an insulating strip located above the first electrically conductive strip. Source/drain openings are arranged along the first horizontal direction, interlaced with the discrete semiconductor channels, and vertically extending through the vertical stack of repetition units, and source/drain pillar structures are located in respective source/drain openings, and vertically extending through the vertical stack of repetition units.